2035560507

9 7 8 B �0.25� CIRCUIT N CAV NO. MOLD NO. CIRCUIT 1 3.0 (COVER TAPE) 8 �0.5� (PICTH) (COVER TAPE) 3.5 �0.13� D (COVER TAPE) A 0.12 TRADE MARK �0.05� 5.41 3 �0.35� �1.22� 2 B 部品 PART 1 ウエハー WAFER 1 0.6 �0.66� (SOLDERING AREA) 2 TIN GOLD PLATING THICKNESS [micro-meter MIN.] SERIES No. DRAWING No. 1.0 0.1 0.76 501331 504449 203557 1.1 B ポリアミド(PA), UL94V-0, 色：SEE SHEET 6 POLYAMIDE(PA), UL94V-0, COLOR : SEE SHEET 6 金めっき： 0.38 MICRO-METER MIN. GOLD PLATING 金めっき： 0.1 MICRO-METER MIN. GOLD PLATING ニッケルめっき：1.27 MICRO-METER MIN. NICKEL ネイル NAIL 3 4 下地めっき UNDER PLATING カバーテープ ポリイミドテープ COVER TAPE POLYIMIDE TAPE DOCUMENT STATUS FORMAT: tb-prod-A3 REVISION: H DATE: 2018/01/18 9 P1 RELEASE DATE 8 SCALE mm NTS ANGULAR TOL ニッケルめっき：1.0 MICRO-METER MIN. NICKEL 2019/04/05 DIMENSION UNITS ± 3.0 ° 4 PLACES ± 0.2 3 PLACES ± 0.2 2 PLACES ± 0.2 1 PLACE ± 0.2 0 PLACES ± 0.2 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 01:07:40 7 7.0 6.0 5.0 4.0 5 4 3 2 B A 極数 CIRCUIT SIZE CURRENT REV DESC: GENERAL TOLERANCES (UNLESS SPECIFIED) 錫めっき： 1.0 MICRO-METER MIN. MATTE TIN PLATING テール部 TAIL AREA 4.0 3.0 2.0 1.0 THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION リン青銅 PHOSPHOR BRONZE A D C 材質 MATERIAL 接点部 ソルダーピン CONTACT AREA SOLDER PIN テール部 TAIL AREA 下地めっき UNDER PLATING E 5013310000-SD PSD 000 5044490000-SD PSD 000 2035570000-SD PSD 000 リン青銅 PHOSPHOR BRONZE 2 1 (SOLDERING AREA) 0.1 TABLE 1 PLATING 2 �1.05� (SOLDERING AREA) 番号 NO. (STAND OFF) 4 C 3 1. 本製品は極数によって、ロック形状が変わりますので御注意願います。 　 THE LOCK SHAPE OF THIS PRODUCT CHANGES ACCORDING TO THE NUMBER OF CIRCUIT. 　 2~5 CIRCUITS：フリクションロック FRICTION LOCK 　 6~15 CIRCUITS：インナーポジティブロック INNER POSITIVE LOCK 　 2 材料及び仕上げ(めっき仕様)：TABLE 1,2 参照 　 MATERIAL AND FINISHES : SEE TABLE 1 AND 2 3. 製品仕様書：5013300000-PS 000 　 PRODUCT SPECIFICATION: 4. 梱包形態：SEE SHEET 4 　 PACKAGING INFORMATION: 5 嵌合相手：501330 シリーズ 　MATES WITH:501330 SERIES 6. アプリケーション仕様書(コネクタ取扱い説明書)：5013300000-AS A00(JAPANESE)/-A01(ENGLISH) 　 APPLICATION SPECIFICATION(CONNECTOR MANUAL): 7. ソルダーピン及びネイルの平坦度:0.1 MAX. 　SOLDER PIN AND NAIL COPLANARITY: 0.1 MAX. 　 8 偶数極に適応 　APPLY FOR EVEN CIRCUIT 9. その他金めっき厚品及び錫めっき品は以下の図面を御参照下さい。 　 PLEASE REFER TO THE FOLLOWING DRAWING 　 FOR OTHER GOLD PLATING VERSION AND TIN PLATING VERSION. CIRCUIT No.1 INDICATOR MARK 1.0 4 NOTES E 3.5 5 6 6 5 4 EC NO: 614886 DRWN: AISHIKAWA CHK'D: AIDA APPR: KOMURAKAMI INITIAL REVISION: DRWN: AISHIKAWA APPR: KOMURAKAMI THIRD ANGLE PROJECTION DRAWING 2019/04/02 2019/04/03 2019/04/05 PRODUCT CUSTOMER DRAWING DOC TYPE DOC PART REVISION DOCUMENT NUMBER 2019/04/02 2019/04/05 2035560000-SD MATERIAL NUMBER SERIES A3-SIZE 203556 3 PICO-CLASP 1.0 W/B SINGLE ROW VT SMT INNER LOCK GOLD PLATING 0.38 MICRO-METER 2 PSD 000 A SHEET NUMBER CUSTOMER SEE SHEET 6 1 OF 6 1 A 9 7 8 5 6 4 3 2 1 B CIRCUIT N CAV NO. MOLD NO. 8 1.0 �0.5� �0.25� (PITCH) CIRCUIT 1 CIRCUIT No.1 INDICATOR MARK 3.0 E 4.47 �0.13� D 4.5 5.0 (COVER TAPE) 5.0 (COVER TAPE) E D (COVER TAPE) A 4 0.12 TRADE MARK C �0.35� �1.22� (SOLDERING AREA) B 番号 NO. 部品 PART 1 ウエハー WAFER (STAND OFF) 5.41 �0.05� 1 2 C 2 0.6 �0.66� 3 TABLE 2 材質 MATERIAL �1.05� (SOLDERING AREA) (SOLDERING AREA) ポリアミド(PA), UL94V-0, 色：SEE SHEET 6 POLYAMIDE(PA), UL94V-0, COLOR : SEE SHEET 6 0.1 1.1 リン青銅 PHOSPHOR BRONZE 2 接点部 ソルダーピン CONTACT AREA SOLDER PIN テール部 TAIL AREA 下地めっき UNDER PLATING 金めっき： 0.38 MICRO-METER MIN. GOLD PLATING 金めっき： 0.1 MICRO-METER MIN. GOLD PLATING ニッケルめっき：1.27 MICRO-METER MIN. NICKEL ネイル NAIL 3 4 下地めっき UNDER PLATING カバーテープ ポリイミドテープ COVER TAPE POLYIMIDE TAPE DOCUMENT STATUS FORMAT: master-tb-prod-A3 REVISION: H DATE: 2018/01/18 9 P1 RELEASE DATE 8 SCALE mm NTS ANGULAR TOL ニッケルめっき：1.0 MICRO-METER MIN. NICKEL 2019/04/05 DIMENSION UNITS ± 3.0 ° 4 PLACES ± 0.2 3 PLACES ± 0.2 2 PLACES ± 0.2 1 PLACE ± 0.2 0 PLACES ± 0.2 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 01:07:40 7 15 14 13 12 11 10 9 8 7 6 B A 極数 CIRCUIT SIZE B CURRENT REV DESC: GENERAL TOLERANCES (UNLESS SPECIFIED) 錫めっき： 1.0 MICRO-METER MIN. MATTE TIN PLATING テール部 TAIL AREA 17.0 16.0 15.0 14.0 13.0 12.0 11.0 10.0 9.0 8.0 THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION リン青銅 PHOSPHOR BRONZE A 14.0 13.0 12.0 11.0 10.0 9.0 8.0 7.0 6.0 5.0 6 5 4 EC NO: 614886 DRWN: AISHIKAWA CHK'D: AIDA APPR: KOMURAKAMI INITIAL REVISION: DRWN: AISHIKAWA APPR: KOMURAKAMI THIRD ANGLE PROJECTION DRAWING 2019/04/02 2019/04/03 2019/04/05 PRODUCT CUSTOMER DRAWING DOC TYPE DOC PART REVISION DOCUMENT NUMBER 2019/04/02 2019/04/05 2035560000-SD MATERIAL NUMBER SERIES A3-SIZE 203556 3 PICO-CLASP 1.0 W/B SINGLE ROW VT SMT INNER LOCK GOLD PLATING 0.38 MICRO-METER 2 PSD 000 A SHEET NUMBER CUSTOMER SEE SHEET 6 2 OF 6 1 A 9 7 8 5 6 4 3 �A� 2 1 �0.12� �3.0� �0.6� E E 嵌合相手：501330 シリーズ MATE WITH : 501330 SERIES �6.3� 5 D 1.0 ±0.05 公差非累積 (PICTH) NON-ACCUMULATIVE TYP.(N) �0.39� 製品輪郭線 PART OUTLINE �1.0� 0.6 ±0.05 CIRCUIT N CIRCUIT 1 D a) 2~5 CIRCUITS 1.53 MIN. B ±0.05 DISTANCE FROM CONNECTOR OUT-LINE TO TERMINAL PAD 製品レイアウト(参考：6~15 CIRCUITS) PRODUCT LAYOUT(REFERENCE: 6~15 CIRCUITS) �A� �0.12� �4.8� �0.6� �0.8� DISTANCE FROM CONNECTOR OUT-LINE TO NAIL PAD 0.7 ±0.05 1.2 MIN. TYP.(2) TYP.(2) �6.3� TYP.(2) B �0.40� 1.8 ±0.05 �0.21� LAYOUT OR SOLDER PASTE RESTRICTED AREA �6.8� パターン及び 半田禁止エリア 4.2 ±0.05 C 2.65 ±0.05 C B 推奨基板レイアウト(全極数適応)：実装面側 (参考：基板厚 1.0mm, メタルマスク厚さ 0.12mm, マスク開口率100%) b) 6~15 CIRCUITS 嵌合図 MATED CONNECTORS POLARIZED RECOMMENDED PCB LAYOUT(APPLY TO ALL CIRCUIT) : COMPONENT SIDE (REFERENCE: PCB THICKNESS 1.0mm, STENCIL THICKNESS 0.12mmm, APERTURE RATIO 100%) THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION :パターン禁止エリア RESTRICTED AREA NO PCB COMPONENTS ALLOWED A DOCUMENT STATUS FORMAT: master-tb-prod-A3 REVISION: H DATE: 2018/01/18 9 P1 RELEASE DATE 2019/04/05 8 DIMENSION UNITS SCALE mm NTS GENERAL TOLERANCES (UNLESS SPECIFIED) ANGULAR TOL ± 3.0 ° 4 PLACES ± 0.2 3 PLACES ± 0.2 2 PLACES ± 0.2 1 PLACE ± 0.2 0 PLACES ± 0.2 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 01:07:40 7 CURRENT REV DESC: 6 5 4 EC NO: 614886 DRWN: AISHIKAWA CHK'D: AIDA APPR: KOMURAKAMI INITIAL REVISION: DRWN: AISHIKAWA APPR: KOMURAKAMI THIRD ANGLE PROJECTION DRAWING 2019/04/02 2019/04/03 2019/04/05 PRODUCT CUSTOMER DRAWING DOC TYPE DOC PART REVISION DOCUMENT NUMBER 2019/04/02 2019/04/05 2035560000-SD MATERIAL NUMBER SERIES A3-SIZE 203556 3 PICO-CLASP 1.0 W/B SINGLE ROW VT SMT INNER LOCK GOLD PLATING 0.38 MICRO-METER 2 PSD 000 A SHEET NUMBER CUSTOMER SEE SHEET 6 3 OF 6 1 A 9 7 8 E 5 6 5 REEL 引き出し方向 4 3 2 1 E NOTES 10. 梱包数量:1100個/リール 　　NUMBER OF CONNECTORS : 1100 PIECES/REEL 11. リードテープ長さ 　　LEAD TAPE LENGTH トップテープ接着部(空エンボス) 100 MIN. ⌀ 380 ±2 �⌀80� PULL OUT DIRECTION TOP TAPE BONDED PART(EMPTY) 引き出し方向 PULL OUT DIRECTION D 部品挿入部 CONPONENT SUPPLIER 400 MIN. D 末端部(空部) TAIL PART (EMPTY) 110 MIN. Z 12. トップテープの剥離強度はIEC60286-3に準拠。 　 TOP TAPE PEELING FORCE IS DEFINED BY IEC60286-3. 　 13 2~5極品は乾燥剤入り、ハイバリア梱包による納品となります。 　 2~5 CIRCUITS IS DELIVERED IN A HIGH BARIER PACKAGE WITH DESOCCANT. 14. 梱包仕様書：2035569200 PS 200 　 PACKAGE SPECIFICATION: 33.4 15 発注番号：SHEET 6 参照 ORDER No.：PLEASE REFER TO SHEET 6 FOR PRODUCT LIST. 2.0 ±0.5 C ±1.0 C 203556 ** * * (12 (2) 0°) (22) (⌀10) 25.4 極数 CIRCUIT SIZE B (⌀21) ハウジングカラー HOUSING COLOR 0:NATURAL(BEIGE) 9 8 7 6 5 4 3 2 製品識別番号 IDENTIFICATION NUMBER 7:EMBOSSED PACKAGE �⌀ 13� 17.5 DETAIL Z C C 15 14 13 12 11 10 B 極数 CIRCUIT SIZE THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DIMENSION UNITS SCALE mm NTS CURRENT REV DESC: GENERAL TOLERANCES (UNLESS SPECIFIED) A ANGULAR TOL 番号 部品 NO. PART 5 材質 MATERIAL リール ポリスチレン(PS) REEL POLYSTYRENE(PS) DOCUMENT STATUS FORMAT: master-tb-prod-A3 REVISION: H DATE: 2018/01/18 9 P1 RELEASE DATE 2019/04/05 8 3.0 ° 4 PLACES ± 0.2 3 PLACES ± 0.2 2 PLACES ± 0.2 1 PLACE ± 0.2 0 PLACES ± 0.2 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 01:07:40 7 ± 6 5 4 EC NO: 614886 DRWN: AISHIKAWA CHK'D: AIDA APPR: KOMURAKAMI INITIAL REVISION: DRWN: AISHIKAWA APPR: KOMURAKAMI THIRD ANGLE PROJECTION DRAWING 2019/04/02 2019/04/03 2019/04/05 PRODUCT CUSTOMER DRAWING DOC TYPE DOC PART REVISION DOCUMENT NUMBER 2019/04/02 2019/04/05 2035560000-SD MATERIAL NUMBER SERIES A3-SIZE 203556 3 PICO-CLASP 1.0 W/B SINGLE ROW VT SMT INNER LOCK GOLD PLATING 0.38 MICRO-METER 2 PSD 000 A SHEET NUMBER CUSTOMER SEE SHEET 6 4 OF 6 1 A 9 7 8 5 6 4 3 2 1 引き出し方向 PULL OUT DIRECTION CIRCUIT 1 1.75 ±0.1 ⌀ 1.5 +0.1 0.0 �2.55� �5.1� R �0.75� DETAIL U 12 ±0.1 32mm幅テープ TAPE WIDTH:32mm 24mm幅テープ W D ±0.3 �F � 28.4 ±0.1 CONNECTOR V V �E� W 6 CARRIER TAPE �2.55� CIRCUIT 1 �5.67� 1.75 ±0.1 SECTION W-W F �2.0� エンボスポケット中心位置 4.0 ±0.1 累積ピッチ：40±0.2 部品 PART NO. 6 7 DOCUMENT STATUS ポリエチレン(PE)、その他 POLYETHYLENE(PE), etc 9 P1 RELEASE DATE 2019/04/05 8 DIMENSION UNITS SCALE mm NTS ANGULAR TOL キャリアテープ ポリプロピレン(PP)、その他 CARRIER TAPE POLYPROPYLEN(PP), etc FORMAT: master-tb-prod-A3 REVISION: H DATE: 2018/01/18 32 11.5 24 7.5 16 コネクタ中心位置 E エンボステープ幅 D SENTER OF CONNECTOR WIDTH OF TAPE ± 3.0 ° 4 PLACES ± 0.2 3 PLACES ± 0.2 2 PLACES ± 0.2 1 PLACE ± 0.2 0 PLACES ± 0.2 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 01:07:40 7 6 9 8 7 6 5 4 3 2 極数 CIRCUIT SIZE B CURRENT REV DESC: GENERAL TOLERANCES (UNLESS SPECIFIED) 材質 MATERIAL トップテープ TOP TAPE 14.2 C 15 14 13 12 11 10 THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION CENTER OF EMBOSSED POCKET ACUUMLATIVE PITCH: A 番号 D DETAIL U 18.3 17.3 16.3 15.3 14.3 13.3 12.3 11.3 10.3 9.3 8.3 7.3 6.3 5.3 TAPE WIDTH:24mm +0.1 ⌀ 1.5 0.0 SECTION V-V 1.5 +0.1 0 CENTER OF EMBOSSED POCKET ACCUMULATIVE PITCH: B �6.8� �0.5� SECTION X-X 7 TOP TAPE C E �2.55� X �2.0�エンボスポケット中心位置 4.0 ±0.1 累積ピッチ：40±0.2 6~15 CIRCUITS �5.67� �2.55� 0.2 +0.15 -0.05 SECTION Y-Y �6.8� �F � �E� D ±0.3 X Y D TAPE WIDTH:16mm �5.8� �4.2� Y E �4.2� 16mm幅テープ �0.5� 12 ±0.1 �5.8� 2~5 CIRCUITS 5 4 EC NO: 614886 DRWN: AISHIKAWA CHK'D: AIDA APPR: KOMURAKAMI INITIAL REVISION: DRWN: AISHIKAWA APPR: KOMURAKAMI THIRD ANGLE PROJECTION DRAWING 2019/04/02 2019/04/03 2019/04/05 PRODUCT CUSTOMER DRAWING DOC TYPE DOC PART REVISION DOCUMENT NUMBER 2019/04/02 2019/04/05 2035560000-SD MATERIAL NUMBER SERIES A3-SIZE 203556 3 PICO-CLASP 1.0 W/B SINGLE ROW VT SMT INNER LOCK GOLD PLATING 0.38 MICRO-METER 2 PSD 000 A SHEET NUMBER CUSTOMER SEE SHEET 6 5 OF 6 1 A 9 7 8 6 5 4 3 2 1 E E D D 15 13 製品一覧 PRODUCT LIST HOUSING COLOR NATURAL(BEIGE) 203556 1507 1407 1307 1207 1107 1007 0907 0807 0707 0607 0507 0407 0307 203556 0207 C B 15 14 13 12 11 C 10 9 8 7 6 5 4 3 2 B 発注番号 ORDER No. 極数 梱包形態：エンボスリール　 CIRCUIT SIZE PACKAGE:EMBOSSED REEL THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DIMENSION UNITS SCALE mm NTS CURRENT REV DESC: GENERAL TOLERANCES (UNLESS SPECIFIED) A ANGULAR TOL DOCUMENT STATUS FORMAT: master-tb-prod-A3 REVISION: H DATE: 2018/01/18 9 P1 RELEASE DATE 2019/04/05 8 ± 3.0 ° 4 PLACES ± 0.2 3 PLACES ± 0.2 2 PLACES ± 0.2 1 PLACE ± 0.2 0 PLACES ± 0.2 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 01:07:40 7 6 5 4 EC NO: 614886 DRWN: AISHIKAWA CHK'D: AIDA APPR: KOMURAKAMI INITIAL REVISION: DRWN: AISHIKAWA APPR: KOMURAKAMI THIRD ANGLE PROJECTION DRAWING 2019/04/02 2019/04/03 2019/04/05 PRODUCT CUSTOMER DRAWING DOC TYPE DOC PART REVISION DOCUMENT NUMBER 2019/04/02 2019/04/05 2035560000-SD MATERIAL NUMBER SERIES A3-SIZE 203556 3 PICO-CLASP 1.0 W/B SINGLE ROW VT SMT INNER LOCK GOLD PLATING 0.38 MICRO-METER 2 PSD 000 A SHEET NUMBER CUSTOMER SEE SHEET 6 6 OF 6 1 A