9
7
8
B
�0.25�
CIRCUIT N
CAV NO.
MOLD NO.
CIRCUIT 1
3.0
(COVER TAPE)
8
�0.5�
(PICTH)
(COVER TAPE)
3.5
�0.13�
D
(COVER TAPE)
A
0.12
TRADE MARK
�0.05�
5.41
3
�0.35�
�1.22�
2
B
部品
PART
1
ウエハー
WAFER
1
0.6
�0.66�
(SOLDERING AREA)
2
TIN
GOLD
PLATING
THICKNESS
[micro-meter MIN.]
SERIES No. DRAWING No.
1.0
0.1
0.76
501331
504449
203557
1.1
B
ポリアミド(PA), UL94V-0, 色:SEE SHEET 6
POLYAMIDE(PA), UL94V-0, COLOR : SEE SHEET 6
金めっき: 0.38 MICRO-METER MIN.
GOLD PLATING
金めっき: 0.1 MICRO-METER MIN.
GOLD PLATING
ニッケルめっき:1.27 MICRO-METER MIN.
NICKEL
ネイル
NAIL
3
4
下地めっき
UNDER PLATING
カバーテープ ポリイミドテープ
COVER TAPE POLYIMIDE TAPE
DOCUMENT STATUS
FORMAT: tb-prod-A3
REVISION: H
DATE: 2018/01/18
9
P1
RELEASE DATE
8
SCALE
mm
NTS
ANGULAR TOL
ニッケルめっき:1.0 MICRO-METER MIN.
NICKEL
2019/04/05
DIMENSION UNITS
±
3.0 °
4 PLACES
±
0.2
3 PLACES
±
0.2
2 PLACES
±
0.2
1 PLACE
±
0.2
0 PLACES
±
0.2
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
01:07:40
7
7.0
6.0
5.0
4.0
5
4
3
2
B
A
極数
CIRCUIT SIZE
CURRENT REV DESC:
GENERAL TOLERANCES
(UNLESS SPECIFIED)
錫めっき: 1.0 MICRO-METER MIN.
MATTE TIN PLATING
テール部
TAIL AREA
4.0
3.0
2.0
1.0
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
リン青銅
PHOSPHOR BRONZE
A
D
C
材質
MATERIAL
接点部
ソルダーピン CONTACT AREA
SOLDER PIN テール部
TAIL AREA
下地めっき
UNDER PLATING
E
5013310000-SD PSD 000
5044490000-SD PSD 000
2035570000-SD PSD 000
リン青銅
PHOSPHOR BRONZE
2
1
(SOLDERING AREA)
0.1
TABLE 1
PLATING
2
�1.05�
(SOLDERING AREA)
番号
NO.
(STAND OFF)
4
C
3
1. 本製品は極数によって、ロック形状が変わりますので御注意願います。
THE LOCK SHAPE OF THIS PRODUCT CHANGES ACCORDING TO THE NUMBER OF CIRCUIT.
2~5 CIRCUITS:フリクションロック FRICTION LOCK
6~15 CIRCUITS:インナーポジティブロック INNER POSITIVE LOCK
2 材料及び仕上げ(めっき仕様):TABLE 1,2 参照
MATERIAL AND FINISHES : SEE TABLE 1 AND 2
3. 製品仕様書:5013300000-PS 000
PRODUCT SPECIFICATION:
4. 梱包形態:SEE SHEET 4
PACKAGING INFORMATION:
5 嵌合相手:501330 シリーズ
MATES WITH:501330 SERIES
6. アプリケーション仕様書(コネクタ取扱い説明書):5013300000-AS A00(JAPANESE)/-A01(ENGLISH)
APPLICATION SPECIFICATION(CONNECTOR MANUAL):
7. ソルダーピン及びネイルの平坦度:0.1 MAX.
SOLDER PIN AND NAIL COPLANARITY: 0.1 MAX.
8 偶数極に適応
APPLY FOR EVEN CIRCUIT
9. その他金めっき厚品及び錫めっき品は以下の図面を御参照下さい。
PLEASE REFER TO THE FOLLOWING DRAWING
FOR OTHER GOLD PLATING VERSION AND TIN PLATING VERSION.
CIRCUIT No.1
INDICATOR MARK
1.0
4
NOTES
E
3.5
5
6
6
5
4
EC NO: 614886
DRWN: AISHIKAWA
CHK'D: AIDA
APPR: KOMURAKAMI
INITIAL REVISION:
DRWN: AISHIKAWA
APPR: KOMURAKAMI
THIRD ANGLE PROJECTION
DRAWING
2019/04/02
2019/04/03
2019/04/05
PRODUCT CUSTOMER DRAWING
DOC TYPE DOC PART REVISION
DOCUMENT NUMBER
2019/04/02
2019/04/05
2035560000-SD
MATERIAL NUMBER
SERIES
A3-SIZE 203556
3
PICO-CLASP 1.0 W/B
SINGLE ROW VT SMT INNER LOCK GOLD PLATING
0.38 MICRO-METER
2
PSD 000
A
SHEET NUMBER
CUSTOMER
SEE SHEET 6
1 OF 6
1
A
9
7
8
5
6
4
3
2
1
B
CIRCUIT N
CAV NO.
MOLD NO.
8
1.0
�0.5�
�0.25�
(PITCH)
CIRCUIT 1
CIRCUIT No.1
INDICATOR MARK
3.0
E
4.47
�0.13�
D
4.5
5.0
(COVER TAPE)
5.0
(COVER TAPE)
E
D
(COVER TAPE)
A
4
0.12
TRADE MARK
C
�0.35�
�1.22�
(SOLDERING AREA)
B
番号
NO.
部品
PART
1
ウエハー
WAFER
(STAND OFF)
5.41
�0.05�
1
2
C
2
0.6
�0.66�
3
TABLE 2
材質
MATERIAL
�1.05�
(SOLDERING AREA)
(SOLDERING AREA)
ポリアミド(PA), UL94V-0, 色:SEE SHEET 6
POLYAMIDE(PA), UL94V-0, COLOR : SEE SHEET 6
0.1
1.1
リン青銅
PHOSPHOR BRONZE
2
接点部
ソルダーピン CONTACT AREA
SOLDER PIN テール部
TAIL AREA
下地めっき
UNDER PLATING
金めっき: 0.38 MICRO-METER MIN.
GOLD PLATING
金めっき: 0.1 MICRO-METER MIN.
GOLD PLATING
ニッケルめっき:1.27 MICRO-METER MIN.
NICKEL
ネイル
NAIL
3
4
下地めっき
UNDER PLATING
カバーテープ ポリイミドテープ
COVER TAPE POLYIMIDE TAPE
DOCUMENT STATUS
FORMAT: master-tb-prod-A3
REVISION: H
DATE: 2018/01/18
9
P1
RELEASE DATE
8
SCALE
mm
NTS
ANGULAR TOL
ニッケルめっき:1.0 MICRO-METER MIN.
NICKEL
2019/04/05
DIMENSION UNITS
±
3.0 °
4 PLACES
±
0.2
3 PLACES
±
0.2
2 PLACES
±
0.2
1 PLACE
±
0.2
0 PLACES
±
0.2
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
01:07:40
7
15
14
13
12
11
10
9
8
7
6
B
A
極数
CIRCUIT SIZE
B
CURRENT REV DESC:
GENERAL TOLERANCES
(UNLESS SPECIFIED)
錫めっき: 1.0 MICRO-METER MIN.
MATTE TIN PLATING
テール部
TAIL AREA
17.0
16.0
15.0
14.0
13.0
12.0
11.0
10.0
9.0
8.0
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
リン青銅
PHOSPHOR BRONZE
A
14.0
13.0
12.0
11.0
10.0
9.0
8.0
7.0
6.0
5.0
6
5
4
EC NO: 614886
DRWN: AISHIKAWA
CHK'D: AIDA
APPR: KOMURAKAMI
INITIAL REVISION:
DRWN: AISHIKAWA
APPR: KOMURAKAMI
THIRD ANGLE PROJECTION
DRAWING
2019/04/02
2019/04/03
2019/04/05
PRODUCT CUSTOMER DRAWING
DOC TYPE DOC PART REVISION
DOCUMENT NUMBER
2019/04/02
2019/04/05
2035560000-SD
MATERIAL NUMBER
SERIES
A3-SIZE 203556
3
PICO-CLASP 1.0 W/B
SINGLE ROW VT SMT INNER LOCK GOLD PLATING
0.38 MICRO-METER
2
PSD 000
A
SHEET NUMBER
CUSTOMER
SEE SHEET 6
2 OF 6
1
A
9
7
8
5
6
4
3
�A�
2
1
�0.12�
�3.0�
�0.6�
E
E
嵌合相手:501330 シリーズ
MATE WITH : 501330 SERIES
�6.3�
5
D
1.0 ±0.05 公差非累積
(PICTH) NON-ACCUMULATIVE
TYP.(N)
�0.39�
製品輪郭線
PART OUTLINE
�1.0�
0.6 ±0.05
CIRCUIT N
CIRCUIT 1
D
a) 2~5 CIRCUITS
1.53 MIN.
B ±0.05
DISTANCE FROM CONNECTOR
OUT-LINE TO TERMINAL PAD
製品レイアウト(参考:6~15 CIRCUITS)
PRODUCT LAYOUT(REFERENCE: 6~15 CIRCUITS)
�A�
�0.12�
�4.8�
�0.6�
�0.8�
DISTANCE FROM CONNECTOR
OUT-LINE TO NAIL PAD
0.7 ±0.05
1.2 MIN.
TYP.(2)
TYP.(2)
�6.3�
TYP.(2)
B
�0.40�
1.8 ±0.05
�0.21�
LAYOUT OR
SOLDER PASTE
RESTRICTED AREA
�6.8�
パターン及び
半田禁止エリア
4.2 ±0.05
C
2.65 ±0.05
C
B
推奨基板レイアウト(全極数適応):実装面側
(参考:基板厚 1.0mm, メタルマスク厚さ 0.12mm, マスク開口率100%)
b) 6~15 CIRCUITS
嵌合図
MATED CONNECTORS
POLARIZED RECOMMENDED PCB LAYOUT(APPLY TO ALL CIRCUIT) : COMPONENT SIDE
(REFERENCE: PCB THICKNESS 1.0mm, STENCIL THICKNESS 0.12mmm, APERTURE RATIO 100%)
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
:パターン禁止エリア
RESTRICTED AREA
NO PCB COMPONENTS ALLOWED
A
DOCUMENT STATUS
FORMAT: master-tb-prod-A3
REVISION: H
DATE: 2018/01/18
9
P1
RELEASE DATE
2019/04/05
8
DIMENSION UNITS
SCALE
mm
NTS
GENERAL TOLERANCES
(UNLESS SPECIFIED)
ANGULAR TOL
±
3.0 °
4 PLACES
±
0.2
3 PLACES
±
0.2
2 PLACES
±
0.2
1 PLACE
±
0.2
0 PLACES
±
0.2
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
01:07:40
7
CURRENT REV DESC:
6
5
4
EC NO: 614886
DRWN: AISHIKAWA
CHK'D: AIDA
APPR: KOMURAKAMI
INITIAL REVISION:
DRWN: AISHIKAWA
APPR: KOMURAKAMI
THIRD ANGLE PROJECTION
DRAWING
2019/04/02
2019/04/03
2019/04/05
PRODUCT CUSTOMER DRAWING
DOC TYPE DOC PART REVISION
DOCUMENT NUMBER
2019/04/02
2019/04/05
2035560000-SD
MATERIAL NUMBER
SERIES
A3-SIZE 203556
3
PICO-CLASP 1.0 W/B
SINGLE ROW VT SMT INNER LOCK GOLD PLATING
0.38 MICRO-METER
2
PSD 000
A
SHEET NUMBER
CUSTOMER
SEE SHEET 6
3 OF 6
1
A
9
7
8
E
5
6
5 REEL
引き出し方向
4
3
2
1
E
NOTES
10. 梱包数量:1100個/リール
NUMBER OF CONNECTORS : 1100 PIECES/REEL
11. リードテープ長さ
LEAD TAPE LENGTH
トップテープ接着部(空エンボス)
100 MIN.
⌀ 380 ±2
�⌀80�
PULL OUT DIRECTION
TOP TAPE BONDED PART(EMPTY)
引き出し方向
PULL OUT
DIRECTION
D
部品挿入部
CONPONENT
SUPPLIER
400 MIN.
D
末端部(空部)
TAIL PART
(EMPTY)
110 MIN.
Z
12. トップテープの剥離強度はIEC60286-3に準拠。
TOP TAPE PEELING FORCE IS DEFINED BY IEC60286-3.
13 2~5極品は乾燥剤入り、ハイバリア梱包による納品となります。
2~5 CIRCUITS IS DELIVERED IN A HIGH BARIER PACKAGE WITH DESOCCANT.
14. 梱包仕様書:2035569200 PS 200
PACKAGE SPECIFICATION:
33.4
15 発注番号:SHEET 6 参照
ORDER No.:PLEASE REFER TO SHEET 6 FOR PRODUCT LIST.
2.0 ±0.5
C ±1.0
C
203556 ** * *
(12
(2)
0°)
(22)
(⌀10)
25.4
極数
CIRCUIT SIZE
B
(⌀21)
ハウジングカラー
HOUSING COLOR
0:NATURAL(BEIGE)
9
8
7
6
5
4
3
2
製品識別番号
IDENTIFICATION NUMBER
7:EMBOSSED PACKAGE
�⌀ 13�
17.5
DETAIL Z
C
C
15
14
13
12
11
10
B
極数
CIRCUIT SIZE
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
DIMENSION UNITS
SCALE
mm
NTS
CURRENT REV DESC:
GENERAL TOLERANCES
(UNLESS SPECIFIED)
A
ANGULAR TOL
番号 部品
NO. PART
5
材質
MATERIAL
リール ポリスチレン(PS)
REEL POLYSTYRENE(PS)
DOCUMENT STATUS
FORMAT: master-tb-prod-A3
REVISION: H
DATE: 2018/01/18
9
P1
RELEASE DATE
2019/04/05
8
3.0 °
4 PLACES
±
0.2
3 PLACES
±
0.2
2 PLACES
±
0.2
1 PLACE
±
0.2
0 PLACES
±
0.2
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
01:07:40
7
±
6
5
4
EC NO: 614886
DRWN: AISHIKAWA
CHK'D: AIDA
APPR: KOMURAKAMI
INITIAL REVISION:
DRWN: AISHIKAWA
APPR: KOMURAKAMI
THIRD ANGLE PROJECTION
DRAWING
2019/04/02
2019/04/03
2019/04/05
PRODUCT CUSTOMER DRAWING
DOC TYPE DOC PART REVISION
DOCUMENT NUMBER
2019/04/02
2019/04/05
2035560000-SD
MATERIAL NUMBER
SERIES
A3-SIZE 203556
3
PICO-CLASP 1.0 W/B
SINGLE ROW VT SMT INNER LOCK GOLD PLATING
0.38 MICRO-METER
2
PSD 000
A
SHEET NUMBER
CUSTOMER
SEE SHEET 6
4 OF 6
1
A
9
7
8
5
6
4
3
2
1
引き出し方向
PULL OUT DIRECTION
CIRCUIT 1
1.75 ±0.1
⌀ 1.5 +0.1
0.0
�2.55�
�5.1�
R �0.75�
DETAIL U
12 ±0.1
32mm幅テープ
TAPE WIDTH:32mm
24mm幅テープ
W
D ±0.3
�F �
28.4 ±0.1
CONNECTOR
V
V
�E�
W
6 CARRIER TAPE
�2.55�
CIRCUIT 1 �5.67�
1.75 ±0.1
SECTION W-W
F
�2.0� エンボスポケット中心位置
4.0 ±0.1 累積ピッチ:40±0.2
部品
PART
NO.
6
7
DOCUMENT STATUS
ポリエチレン(PE)、その他
POLYETHYLENE(PE), etc
9
P1
RELEASE DATE
2019/04/05
8
DIMENSION UNITS
SCALE
mm
NTS
ANGULAR TOL
キャリアテープ ポリプロピレン(PP)、その他
CARRIER TAPE POLYPROPYLEN(PP), etc
FORMAT: master-tb-prod-A3
REVISION: H
DATE: 2018/01/18
32
11.5
24
7.5
16
コネクタ中心位置 E
エンボステープ幅 D
SENTER OF CONNECTOR WIDTH OF TAPE
±
3.0 °
4 PLACES
±
0.2
3 PLACES
±
0.2
2 PLACES
±
0.2
1 PLACE
±
0.2
0 PLACES
±
0.2
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
01:07:40
7
6
9
8
7
6
5
4
3
2
極数
CIRCUIT SIZE
B
CURRENT REV DESC:
GENERAL TOLERANCES
(UNLESS SPECIFIED)
材質
MATERIAL
トップテープ
TOP TAPE
14.2
C
15
14
13
12
11
10
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
CENTER OF EMBOSSED POCKET
ACUUMLATIVE PITCH:
A 番号
D
DETAIL U
18.3
17.3
16.3
15.3
14.3
13.3
12.3
11.3
10.3
9.3
8.3
7.3
6.3
5.3
TAPE WIDTH:24mm
+0.1
⌀ 1.5
0.0
SECTION V-V
1.5 +0.1
0
CENTER OF EMBOSSED POCKET
ACCUMULATIVE PITCH:
B
�6.8�
�0.5�
SECTION X-X
7 TOP TAPE
C
E
�2.55�
X
�2.0�エンボスポケット中心位置
4.0 ±0.1 累積ピッチ:40±0.2
6~15 CIRCUITS
�5.67�
�2.55�
0.2 +0.15
-0.05
SECTION Y-Y
�6.8�
�F �
�E�
D ±0.3
X
Y
D
TAPE WIDTH:16mm
�5.8�
�4.2�
Y
E
�4.2�
16mm幅テープ
�0.5�
12 ±0.1
�5.8�
2~5 CIRCUITS
5
4
EC NO: 614886
DRWN: AISHIKAWA
CHK'D: AIDA
APPR: KOMURAKAMI
INITIAL REVISION:
DRWN: AISHIKAWA
APPR: KOMURAKAMI
THIRD ANGLE PROJECTION
DRAWING
2019/04/02
2019/04/03
2019/04/05
PRODUCT CUSTOMER DRAWING
DOC TYPE DOC PART REVISION
DOCUMENT NUMBER
2019/04/02
2019/04/05
2035560000-SD
MATERIAL NUMBER
SERIES
A3-SIZE 203556
3
PICO-CLASP 1.0 W/B
SINGLE ROW VT SMT INNER LOCK GOLD PLATING
0.38 MICRO-METER
2
PSD 000
A
SHEET NUMBER
CUSTOMER
SEE SHEET 6
5 OF 6
1
A
9
7
8
6
5
4
3
2
1
E
E
D
D
15
13
製品一覧 PRODUCT LIST
HOUSING COLOR
NATURAL(BEIGE)
203556 1507
1407
1307
1207
1107
1007
0907
0807
0707
0607
0507
0407
0307
203556 0207
C
B
15
14
13
12
11
C
10
9
8
7
6
5
4
3
2
B
発注番号 ORDER No.
極数
梱包形態:エンボスリール CIRCUIT SIZE
PACKAGE:EMBOSSED REEL
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
DIMENSION UNITS
SCALE
mm
NTS
CURRENT REV DESC:
GENERAL TOLERANCES
(UNLESS SPECIFIED)
A
ANGULAR TOL
DOCUMENT STATUS
FORMAT: master-tb-prod-A3
REVISION: H
DATE: 2018/01/18
9
P1
RELEASE DATE
2019/04/05
8
±
3.0 °
4 PLACES
±
0.2
3 PLACES
±
0.2
2 PLACES
±
0.2
1 PLACE
±
0.2
0 PLACES
±
0.2
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
01:07:40
7
6
5
4
EC NO: 614886
DRWN: AISHIKAWA
CHK'D: AIDA
APPR: KOMURAKAMI
INITIAL REVISION:
DRWN: AISHIKAWA
APPR: KOMURAKAMI
THIRD ANGLE PROJECTION
DRAWING
2019/04/02
2019/04/03
2019/04/05
PRODUCT CUSTOMER DRAWING
DOC TYPE DOC PART REVISION
DOCUMENT NUMBER
2019/04/02
2019/04/05
2035560000-SD
MATERIAL NUMBER
SERIES
A3-SIZE 203556
3
PICO-CLASP 1.0 W/B
SINGLE ROW VT SMT INNER LOCK GOLD PLATING
0.38 MICRO-METER
2
PSD 000
A
SHEET NUMBER
CUSTOMER
SEE SHEET 6
6 OF 6
1
A
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