203564-2017

9 7 8 5 6 NOTES A B CIRCUIT 2 CIRCUIT N 1.0 (PICTH) D �0.25� (COVER TAPE) 4.9 TRADE MARK �0.155� (COVER TAPE) 3 �1.22� (0.03) 1 0.6 (SOLDERING AREA) B 番号 NO. 部品 PART 1 ウエハー WAFER 0.1 0.76 501190 203565 203564 ** * * 極数 CIRCUIT SIZE TABLE 2 HOUSING COLOR 9 �1.15� (SOLDERING AREA) 2.38 材質 MATERIAL 1.25 NATURAL(WHITE) ポリアミド(PA), UL94V-0, 色：SEE TABLE 2 POLYAMIDE(PA), UL94V-0, COLOR : SEE TABLE 2 金めっき： 0.38 MICRO-METER MIN. GOLD PLATING 金めっき GOLD PLATING ニッケルめっき：1.27 MICRO-METER MIN. NICKEL ネイル NAIL 3 4 下地めっき UNDER PLATING カバーテープ ポリイミドテープ COVER TAPE POLYIMIDE TAPE DOCUMENT STATUS FORMAT: tb-prod-A3 REVISION: H DATE: 2018/01/18 9 P1 RELEASE DATE 8 27.3 22.3 17.3 12.3 203564 5017 203564 4017 203564 3017 203564 2017 C B A 発注番号 ORDER No. DIMENSION UNITS SCALE mm NTS ANGULAR TOL ± 3.0 ° 4 PLACES ± 0.2 3 PLACES ± 0.2 2 PLACES ± 0.2 1 PLACE ± 0.2 0 PLACES ± 0.2 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 08:20:57 7 B 50 40 30 20 極数 梱包形態：エンボスリール　 CIRCUIT SIZE PACKAGE:EMBOSSED REEL CURRENT REV DESC: GENERAL TOLERANCES (UNLESS SPECIFIED) ニッケルめっき：1.0 MICRO-METER MIN. NICKEL 2019/09/17 24.0 19.0 14.0 9.0 THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION 錫めっき： 1.0 MICRO-METER MIN. MATTE TIN PLATING テール部 TAIL AREA 26.8 21.8 16.8 11.8 極数別 寸法 DIMENSION リン青銅 PHOSPHOR BRONZE A 製品識別番号 IDENTIFICATION NUMBER 7:EMBOSSED PACKAGE (SOLDERING AREA) TABLE 1 接点部 ソルダーピン CONTACT AREA SOLDER PIN テール部 TAIL AREA 下地めっき UNDER PLATING C ハウジングカラー HOUSING COLOR 1:NATURAL(BEIGE) リン青銅 PHOSPHOR BRONZE 2 5011900000-SD PSD 000 2035650000-SD PSD 000 発注番号：TABLE 2 参照 ORDER No.：SEE TABLE 2 �0.66� (SOLDERING AREA) 1 9 SERIES No. DRAWING No. 0.6 �0.66� 1 GOLD PLATING THICKNESS [MICRO-METER MIN.] 2 �0.35� 2 材料及び仕上げ(めっき仕様)：TABLE 1 参照 　 MATERIAL AND FINISHES : SEE TABLE 1 2. 製品仕様書：5011890000-PS 001 　 PRODUCT SPECIFICATION: 3. 梱包形態：SEE SHEET 3 E 　 PACKAGING INFORMATION: 4 嵌合相手：501189 シリーズ 　MATES WITH:501189 SERIES 5. アプリケーション仕様書(コネクタ取扱い説明書)：5011890000-AS 000 　 APPLICATION SPECIFICATION(CONNECTOR MANUAL): 6. ソルダーピン及びネイルの平坦度:0.1 mm MAX. 　SOLDER PIN AND NAIL COPLANARITY: 0.1 mm MAX. 　 7 極数/2=偶数に適応 　APPLICABLE FOR CIRCUIT SIZE/2 = EVEN 8. 本製品は複数の金めっき厚を展開しております。その他の金めっき厚は以下の図面を御参照下さい。 　 THIS PRODUCT EXIST MULTIPLE GOLD PLATING. 　 PLEASE REFER TO THE FOLLOWING DRAWING FOR OTHER GOLD PLATING THICKNESS. D (5.2) �0.05� (STAND OFF) 4 3 1 (C) 5.41 C 6.67 5.2 5.6 CIRCUIT 1 6.09 1.33 CIRCUIT No.1 & No.2 INDICATOR MARK 1.02 7 �0.5� (COVER TAPE) E 4 6 5 4 EC NO: 615136 DRWN: AISHIKAWA CHK'D: AIDA APPR: SAKIYAMA INITIAL REVISION: DRWN: AISHIKAWA APPR: KOMURAKAMI THIRD ANGLE PROJECTION DRAWING 2019/09/06 2019/09/11 2019/09/17 2019/03/29 2019/04/03 DOC TYPE DOC PART REVISION 2035640000-SD MATERIAL NUMBER SERIES 2 A PRODUCT CUSTOMER DRAWING DOCUMENT NUMBER A3-SIZE 203564 3 PICO-CLASP 1.0 W/B DUAL ROW VT SMT GOLD PLATING 0.38 MICRO-METER PSD 000 B SHEET NUMBER CUSTOMER SEE SHEET 5 1 OF 4 1 9 7 8 5 6 4 3 2 1 E E 4 D (B) パターン及び 半田禁止エリア �A� 1.0 ±0.05 公差非累積 LAYOUT OR SOLDER PASTE RESTRICTED AREA (PICTH) NON-ACCUMULATIVE �7.5� �0.2� CIRCUIT 2 CIRCUIT N TYP.(N) 製品輪郭線 PART OUTLINE C 1.82 MIN. 4.0 ±0.05 1.11 MIN. �6.8� 0.7 ±0.05 TYP.(2) �0.4� 0.6 ±0.05 0.1 MIN. C 嵌合相手 : 501189 シリーズ MATE WITH : 501189 SERIES �6.3� DISTANCE FROM CONNECTOR OUT-LINE TO EVEN TERMINAL PAD �1.0� D 製品レイアウト PRODUCT LAYOUT 嵌合図 MATED CONNECTORS DISTANCE FROM CONNECTOR OUT-LINE TO TERMINAL PAD TYP.(N) �1.35� 1.6 ±0.05 CIRCUIT 1 TYP.(2) 1.8 ±0.05 DISTANCE FROM CONNECTOR OUT-LINE TO ODD TERMINAL PAD B �1.0� B 0.85 MIN. 0.9 ±0.05 TYP.(2) THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION 推奨基板レイアウト(全極数適応)：実装面側 (参考：基板厚 1.0mm, メタルマスク厚さ 0.12mm, マスク開口率100%) DOCUMENT STATUS 9 P1 RELEASE DATE 2019/09/17 8 NTS ANGULAR TOL :パターン禁止エリア RESTRICTED AREA NO PCB COMPONENTS ALLOWED FORMAT: master-tb-prod-A3 REVISION: H DATE: 2018/01/18 SCALE mm ± 3.0 ° 4 PLACES ± 0.2 3 PLACES ± 0.2 2 PLACES ± 0.2 1 PLACE ± 0.2 0 PLACES ± 0.2 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 08:20:57 7 6 CURRENT REV DESC: GENERAL TOLERANCES (UNLESS SPECIFIED) POLARIZED RECOMMENDED PCB LAYOUT(APPLY TO ALL CIRCUIT) : COMPONENT SIDE (REFERENCE: PCB THICKNESS 1.0mm, STENCIL THICKNESS 0.12mm, APERTURE RATIO 100%) A DIMENSION UNITS 5 4 EC NO: 615136 DRWN: AISHIKAWA CHK'D: AIDA APPR: SAKIYAMA INITIAL REVISION: DRWN: AISHIKAWA APPR: KOMURAKAMI THIRD ANGLE PROJECTION DRAWING 2019/09/06 2019/09/11 2019/09/17 2019/03/29 2019/04/03 DOC TYPE DOC PART REVISION 2035640000-SD MATERIAL NUMBER SERIES 2 A PRODUCT CUSTOMER DRAWING DOCUMENT NUMBER A3-SIZE 203564 3 PICO-CLASP 1.0 W/B DUAL ROW VT SMT GOLD PLATING 0.38 MICRO-METER PSD 000 B SHEET NUMBER CUSTOMER SEE SHEET 5 2 OF 4 1 9 7 8 E 5 6 5 REEL 引き出し方向 4 3 2 1 E NOTES 10. 梱包数量:1100個/リール 　　NUMBER OF CONNECTORS : 1100 PIECES/REEL 11. リードテープ長さ 　　LEAD TAPE LENGTH トップテープ接着部(空エンボス) 100 MIN. ⌀ 380 ±2 �⌀80� PULL OUT DIRECTION TOP TAPE BONDED PART(EMPTY) 引き出し方向 PULL OUT DIRECTION D 部品挿入部 CONPONENT SUPPLIER D 末端部(空部) TAIL PART (EMPTY) 400 MIN. 110 MIN. Z D ±1.0 12. トップテープの剥離強度はIEC60286-3に準拠。 　 TOP TAPE PEELING FORCE IS DEFINED BY IEC60286-3. 13. 梱包仕様書：2035649200 PS 200 　 PACKAGE SPECIFICATION: 2.0 ±0.5 C C (2) 0°) B (12 (22) (⌀10) B (⌀21) 50 40 33.5 30 25.5 20 極数 D CIRCUIT SIZE �⌀ 13� 45.5 DETAIL Z THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DIMENSION UNITS SCALE mm NTS CURRENT REV DESC: GENERAL TOLERANCES (UNLESS SPECIFIED) A ANGULAR TOL 番号 部品 NO. PART 5 材質 MATERIAL リール ポリスチレン(PS) REEL POLYSTYRENE(PS) DOCUMENT STATUS FORMAT: master-tb-prod-A3 REVISION: H DATE: 2018/01/18 9 P1 RELEASE DATE 2019/09/17 8 3.0 ° 4 PLACES ± 0.2 3 PLACES ± 0.2 2 PLACES ± 0.2 1 PLACE ± 0.2 0 PLACES ± 0.2 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 08:20:57 7 ± 6 5 4 EC NO: 615136 DRWN: AISHIKAWA CHK'D: AIDA APPR: SAKIYAMA INITIAL REVISION: DRWN: AISHIKAWA APPR: KOMURAKAMI THIRD ANGLE PROJECTION DRAWING 2019/09/06 2019/09/11 2019/09/17 2019/03/29 2019/04/03 DOC TYPE DOC PART REVISION 2035640000-SD MATERIAL NUMBER SERIES 2 A PRODUCT CUSTOMER DRAWING DOCUMENT NUMBER A3-SIZE 203564 3 PICO-CLASP 1.0 W/B DUAL ROW VT SMT GOLD PLATING 0.38 MICRO-METER PSD 000 B SHEET NUMBER CUSTOMER SEE SHEET 5 3 OF 4 1 7 8 5 6 12.0 ±0.1 4 3 2 1 W 44mm幅テープ 0.5 ±0.05 TAPE WIDTH:44mm E �6.9� E �5.8� 32mm幅テープ TAPE WIDTH:32mm �6.8� 9 24mm幅テープ TAPE WIDTH:24mm Y 7 TOP TAPE D CIRCUIT 1 1.5 +0.1 0.0 R �0.75� CIRCUIT 2 (F) X X D ±0.3 CENTER OF CONNECTOR C コネクター中心位置 (G) CONNECTOR 0.2 +0.15 -0.05 E ±0.1 D SECTION X-X C DETAIL W B B ⌀ 1.5 +0.1 0.0 Y SECTION Y-Y �3.45� �6.9� �2.0� エンボスポケット中心位置 G CENTER OF EMBOSSED POCKET 累積ピッチ： 40 ±0.2 A 番号 部品 PART NO. 6 7 4.0 ±0.1 DOCUMENT STATUS FORMAT: master-tb-prod-A3 REVISION: H DATE: 2018/01/18 9 RELEASE DATE 2019/09/17 8 50 40 14.2 11.5 28.4 - 32.0 24.0 30 20 コネクタ中心位置 F CENTER OF CONNECTOR E DIMENSION UNITS SCALE mm NTS ANGULAR TOL ポリエチレン(PE)、その他 POLYETHYLENE(PE), etc P1 44.0 ± 3.0 ° 4 PLACES ± 0.2 3 PLACES ± 0.2 2 PLACES ± 0.2 1 PLACE ± 0.2 0 PLACES ± 0.2 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 08:20:57 7 極数 エンボステープ幅 D WIDTH OF TAPE CIRCUIT SIZE 6 CURRENT REV DESC: GENERAL TOLERANCES (UNLESS SPECIFIED) キャリアテープ ポリプロピレン(PP)、その他 CARRIER TAPE POLYPROPYLEN(PP), etc トップテープ TOP TAPE 40.4 THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION 引き出し方向 PULL OUT DIRECTION 材質 MATERIAL 20.2 27.6 22.6 17.6 12.6 1.75 ±0.1 6 CARRIER TAPE 5 4 EC NO: 615136 DRWN: AISHIKAWA CHK'D: AIDA APPR: SAKIYAMA INITIAL REVISION: DRWN: AISHIKAWA APPR: KOMURAKAMI THIRD ANGLE PROJECTION DRAWING 2019/09/06 2019/09/11 2019/09/17 2019/03/29 2019/04/03 DOC TYPE DOC PART REVISION 2035640000-SD MATERIAL NUMBER SERIES 2 A PRODUCT CUSTOMER DRAWING DOCUMENT NUMBER A3-SIZE 203564 3 PICO-CLASP 1.0 W/B DUAL ROW VT SMT GOLD PLATING 0.38 MICRO-METER PSD 000 B SHEET NUMBER CUSTOMER SEE SHEET 5 4 OF 4 1