2083810407

9 7 8 B �0.25� CIRCUIT N CAV NO. MOLD NO. (COVER TAPE) 3.0 �0.5� (PICTH) �0.13� (COVER TAPE) 3.5 (COVER TAPE) A 0.12 TRADE MARK 4 10 �0.05� (STAND OFF) 5.41 3 �0.35� �1.22� 2 1 2 0.6 �0.66� �1.05� (SOLDERING AREA) (SOLDERING AREA) B 2 TABLE 1 材質 MATERIAL 1 ウエハー WAFER ポリアミド(PA), ガラス充填, UL94V-0, LOW HALOGEN, 色：SEE SHEET 6 POLYAMIDE(PA), GLASS FILLED, UL94V-0, LOW HALOGEN, COLOR : SEE SHEET 6 C 極数 CIRCUIT SIZE ハウジングカラー HOUSING COLOR 製品識別番号(めっき厚) IDENTIFICATION NUMBER (PLATING THICKNESS) 0:NATURAL(BEIGE) 7: 0.1 MICRO-METER MIN 1:BLACK 5: 0.38 MICRO-METER MIN 3: 0.76 MICRO-METER MIN リン青銅 PHOSPHOR BRONZE 接点部 ソルダーピン CONTACT AREA SOLDER PIN テール部 TAIL AREA 下地めっき UNDER PLATING 金めっき： めっき厚はNOTES 10参照 GOLD PLATING：SEE NOTES 10 ABOUT THICKNESS 金めっき GOLD PLATING ニッケルめっき：1.0 MICRO-METER MIN NICKEL PLATING ネイル NAIL 3 4 下地めっき UNDER PLATING カバーテープ ポリイミドテープ COVER TAPE POLYIMIDE TAPE DOCUMENT STATUS FORMAT: tb-prod-A3 REVISION: H DATE: 2018/01/18 9 P1 RELEASE DATE 8 SCALE mm NTS ANGULAR TOL ニッケルめっき：1.0 MICRO-METER MIN NICKEL PLATING 2019/12/25 DIMENSION UNITS ± 3.0 ° 4 PLACES ± 0.2 3 PLACES ± 0.2 2 PLACES ± 0.2 1 PLACE ± 0.2 0 PLACES ± 0.2 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 07:30:31 7 6 4.0 3.0 2.0 1.0 7.0 6.0 5.0 4.0 5 4 3 2 B A 極数 CIRCUIT SIZE CURRENT REV DESC: GENERAL TOLERANCES (UNLESS SPECIFIED) 錫めっき： 1.0 MICRO-METER MIN MATTE TIN PLATING テール部 TAIL AREA B THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION リン青銅 PHOSPHOR BRONZE A D 208381 ** * * 1.1 部品 PART E 製品番号構成：発注番号はSHEET 6 参照 PRODUCT NUMBER COMPOSITION ORDER No.：SEE SHEET 6 (SOLDERING AREA) 0.1 番号 NO. 2 1 1. 本製品は極数によって、ロック形状が変わりますので御注意願います。 　 THE LOCK SHAPE OF THIS PRODUCT CHANGES ACCORDING TO THE NUMBER OF CIRCUIT. 　 2~5 CIRCUITS：フリクションロック FRICTION LOCK 　 6~15 CIRCUITS：インナーポジティブロック INNER POSITIVE LOCK 　 2 材料及び仕上げ(めっき仕様)：TABLE 1,2 参照 　 MATERIAL AND FINISHES : SEE TABLE 1 AND 2 3. 製品仕様書：5013300000-PS PS 004 　 PRODUCT SPECIFICATION: 4. 梱包形態：SEE SHEET 4 　 PACKAGING INFORMATION: 5 嵌合相手：501330 シリーズ 　MATES WITH:501330 SERIES 6. アプリケーション仕様書(コネクタ取扱い説明書)：5013300000-AS PS 001 　 APPLICATION SPECIFICATION(CONNECTOR MANUAL): 7. ソルダーピン及びネイルの平坦度:0.1 MAX 　SOLDER PIN AND NAIL COPLANARITY: 0.1 MAX 8 偶数極に適応 　 　APPLY FOR EVEN CIRCUIT 9. 錫めっき品は2083810000-SD PSD 001の図面を御参照下さい。 　 PLEASE REFER TO THE DRAWING OF 2083810000-SD PSD 001 FOR TIN PLATING VERSION. CIRCUIT No.1 INDICATOR MARK 1.0 C 3 NOTES 8 D 4 CIRCUIT 1 E 3.5 5 6 5 4 EC NO: 626442 DRWN: AISHIKAWA CHK'D: AIDA APPR: SAKIYAMA INITIAL REVISION: DRWN: AISHIKAWA APPR: SAKIYAMA THIRD ANGLE PROJECTION DRAWING 2019/06/21 2019/12/25 2019/12/25 PRODUCT CUSTOMER DRAWING DOC TYPE DOC PART REVISION DOCUMENT NUMBER 2019/06/21 2019/12/25 2083810000-SD MATERIAL NUMBER SERIES A3-SIZE 208381 3 PICO-CLASP 1.0 W/B SINGLE ROW VT SMT INNER LOCK GOLD PLATING LOW HALOGEN 2 PSD 000 A SHEET NUMBER CUSTOMER SEE SHEET 6 1 OF 6 1 A 9 7 8 5 6 4 3 2 1 B CIRCUIT N 8 1.0 CAV NO. MOLD NO. �0.5� �0.25� (PITCH) CIRCUIT 1 CIRCUIT No.1 INDICATOR MARK 4.47 3.0 E 4.5 5.0 (COVER TAPE) 5.0 (COVER TAPE) E D (COVER TAPE) �0.13� D A 4 0.12 TRADE MARK C �0.35� 2 C 2 0.6 �1.22� (SOLDERING AREA) B (STAND OFF) 5.41 �0.05� 1 �0.66� 3 TABLE 2 番号 NO. 部品 PART 材質 MATERIAL 1 ウエハー WAFER ポリアミド(PA), ガラス充填, UL94V-0, LOW HALOGEN, 色：SEE SHEET 6 POLYAMIDE(PA), GLASS FILLED, UL94V-0, LOW HALOGEN, COLOR : SEE SHEET 6 �1.05� (SOLDERING AREA) (SOLDERING AREA) 0.1 1.1 リン青銅 PHOSPHOR BRONZE 2 接点部 ソルダーピン CONTACT AREA SOLDER PIN テール部 TAIL AREA 下地めっき UNDER PLATING 金めっき： めっき厚はNOTES 10参照 GOLD PLATING：SEE NOTES 10 ABOUT THICKNESS 金めっき GOLD PLATING ニッケルめっき：1.0 MICRO-METER MIN NICKEL PLATING ネイル NAIL 3 4 下地めっき UNDER PLATING カバーテープ ポリイミドテープ COVER TAPE POLYIMIDE TAPE DOCUMENT STATUS FORMAT: master-tb-prod-A3 REVISION: H DATE: 2018/01/18 9 P1 RELEASE DATE 8 SCALE mm NTS ANGULAR TOL ニッケルめっき：1.0 MICRO-METER MIN NICKEL PLATING 2019/12/25 DIMENSION UNITS ± 3.0 ° 4 PLACES ± 0.2 3 PLACES ± 0.2 2 PLACES ± 0.2 1 PLACE ± 0.2 0 PLACES ± 0.2 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 07:30:31 7 6 15 14 13 12 11 10 9 8 7 6 B A 極数 CIRCUIT SIZE B CURRENT REV DESC: GENERAL TOLERANCES (UNLESS SPECIFIED) 錫めっき： 1.0 MICRO-METER MIN MATTE TIN PLATING テール部 TAIL AREA 17.0 16.0 15.0 14.0 13.0 12.0 11.0 10.0 9.0 8.0 THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION リン青銅 PHOSPHOR BRONZE A 14.0 13.0 12.0 11.0 10.0 9.0 8.0 7.0 6.0 5.0 5 4 EC NO: 626442 DRWN: AISHIKAWA CHK'D: AIDA APPR: SAKIYAMA INITIAL REVISION: DRWN: AISHIKAWA APPR: SAKIYAMA THIRD ANGLE PROJECTION DRAWING 2019/06/21 2019/12/25 2019/12/25 PRODUCT CUSTOMER DRAWING DOC TYPE DOC PART REVISION DOCUMENT NUMBER 2019/06/21 2019/12/25 2083810000-SD MATERIAL NUMBER SERIES A3-SIZE 208381 3 PICO-CLASP 1.0 W/B SINGLE ROW VT SMT INNER LOCK GOLD PLATING LOW HALOGEN 2 PSD 000 A SHEET NUMBER CUSTOMER SEE SHEET 6 2 OF 6 1 A 9 7 8 5 6 4 3 �A� 2 1 �0.12� �3.0� �0.6� E E 嵌合相手：501330 シリーズ MATE WITH : 501330 SERIES �6.3� 5 D 1.0 ±0.05 公差非累積 (PICTH) NON-ACCUMULATIVE TYP.(N) �0.39� 製品輪郭線 PART OUTLINE �1.0� 0.6 ±0.05 CIRCUIT N CIRCUIT 1 D a) 2~5 CIRCUITS 1.53 MIN. B ±0.05 DISTANCE FROM CONNECTOR OUT-LINE TO TERMINAL PAD 製品レイアウト(参考：6~15 CIRCUITS) PRODUCT LAYOUT(REFERENCE: 6~15 CIRCUITS) �A� �0.12� �4.8� �0.6� �0.8� DISTANCE FROM CONNECTOR OUT-LINE TO NAIL PAD 0.7 ±0.05 1.2 MIN. TYP.(2) TYP.(2) �6.3� TYP.(2) B �0.40� 1.8 ±0.05 �0.21� LAYOUT OR SOLDER PASTE RESTRICTED AREA �6.8� パターン及び 半田禁止エリア 4.2 ±0.05 C 2.65 ±0.05 C B 推奨基板レイアウト(全極数適応)：実装面側 (参考：基板厚 1.0mm, メタルマスク厚さ 0.12mm, マスク開口率100%) b) 6~15 CIRCUITS 嵌合図 MATED CONNECTORS POLARIZED RECOMMENDED PCB LAYOUT(APPLY TO ALL CIRCUIT) : COMPONENT SIDE (REFERENCE: PCB THICKNESS 1.0mm, STENCIL THICKNESS 0.12mm, APERTURE RATIO 100%) THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION :パターン禁止エリア RESTRICTED AREA NO PCB COMPONENTS ALLOWED A DOCUMENT STATUS FORMAT: master-tb-prod-A3 REVISION: H DATE: 2018/01/18 9 P1 RELEASE DATE 2019/12/25 8 DIMENSION UNITS SCALE mm NTS GENERAL TOLERANCES (UNLESS SPECIFIED) ANGULAR TOL ± 3.0 ° 4 PLACES ± 0.2 3 PLACES ± 0.2 2 PLACES ± 0.2 1 PLACE ± 0.2 0 PLACES ± 0.2 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 07:30:31 7 CURRENT REV DESC: 6 5 4 EC NO: 626442 DRWN: AISHIKAWA CHK'D: AIDA APPR: SAKIYAMA INITIAL REVISION: DRWN: AISHIKAWA APPR: SAKIYAMA THIRD ANGLE PROJECTION DRAWING 2019/06/21 2019/12/25 2019/12/25 PRODUCT CUSTOMER DRAWING DOC TYPE DOC PART REVISION DOCUMENT NUMBER 2019/06/21 2019/12/25 2083810000-SD MATERIAL NUMBER SERIES A3-SIZE 208381 3 PICO-CLASP 1.0 W/B SINGLE ROW VT SMT INNER LOCK GOLD PLATING LOW HALOGEN 2 PSD 000 A SHEET NUMBER CUSTOMER SEE SHEET 6 3 OF 6 1 A 9 7 8 E 5 6 5 REEL 引き出し方向 4 3 2 1 E NOTES 10. 梱包数量:1100個/リール 　　NUMBER OF CONNECTORS : 1100 PIECES/REEL 11. リードテープ長さ 　　LEAD TAPE LENGTH トップテープ接着部(空エンボス) 100 MIN ⌀ 380 ±2 �⌀80� PULL OUT DIRECTION TOP TAPE BONDED PART(EMPTY) 引き出し方向 PULL OUT DIRECTION D 部品挿入部 CONPONENT SUPPLIER D 末端部(空部) TAIL PART (EMPTY) 400 MIN 110 MIN Z 12. トップテープの剥離強度はIEC60286-3に準拠。 　 TOP TAPE PEELING FORCE IS DEFINED BY IEC60286-3. 13. 梱包仕様書：2083819200-SPK PS 200 　 PACKAGE SPECIFICATION: 2.0 ±0.5 C ±1.0 C 33.4 0°) B (12 (22) (⌀10) (2) 25.4 9 8 7 6 5 4 3 2 (⌀21) �⌀ 13� 17.5 DETAIL Z C C 15 14 13 12 11 10 B 極数 CIRCUIT SIZE THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DIMENSION UNITS SCALE mm NTS CURRENT REV DESC: GENERAL TOLERANCES (UNLESS SPECIFIED) A ANGULAR TOL 番号 部品 NO. PART 5 材質 MATERIAL リール ポリスチレン(PS) REEL POLYSTYRENE(PS) DOCUMENT STATUS FORMAT: master-tb-prod-A3 REVISION: H DATE: 2018/01/18 9 P1 RELEASE DATE 2019/12/25 8 3.0 ° 4 PLACES ± 0.2 3 PLACES ± 0.2 2 PLACES ± 0.2 1 PLACE ± 0.2 0 PLACES ± 0.2 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 07:30:31 7 ± 6 5 4 EC NO: 626442 DRWN: AISHIKAWA CHK'D: AIDA APPR: SAKIYAMA INITIAL REVISION: DRWN: AISHIKAWA APPR: SAKIYAMA THIRD ANGLE PROJECTION DRAWING 2019/06/21 2019/12/25 2019/12/25 PRODUCT CUSTOMER DRAWING DOC TYPE DOC PART REVISION DOCUMENT NUMBER 2019/06/21 2019/12/25 2083810000-SD MATERIAL NUMBER SERIES A3-SIZE 208381 3 PICO-CLASP 1.0 W/B SINGLE ROW VT SMT INNER LOCK GOLD PLATING LOW HALOGEN 2 PSD 000 A SHEET NUMBER CUSTOMER SEE SHEET 6 4 OF 6 1 A 9 7 8 5 6 4 3 2 1 引き出し方向 PULL OUT DIRECTION CIRCUIT 1 1.75 ±0.1 ⌀ 1.5 +0.1 0.0 �2.55� �5.1� R �0.75� DETAIL U 12 ±0.1 32mm幅テープ TAPE WIDTH:32mm 24mm幅テープ W D ±0.3 �F � 28.4 ±0.1 CONNECTOR V V �E� W 6 CARRIER TAPE �2.55� CIRCUIT 1 �5.67� 1.75 ±0.1 SECTION W-W F �2.0� エンボスポケット中心位置 4.0 ±0.1 累積ピッチ：40±0.2 部品 PART NO. 6 7 DOCUMENT STATUS ポリエチレン(PE)、その他 POLYETHYLENE(PE), etc 9 P1 RELEASE DATE 2019/12/25 8 DIMENSION UNITS SCALE mm NTS ANGULAR TOL キャリアテープ ポリプロピレン(PP)、その他 CARRIER TAPE POLYPROPYLEN(PP), etc FORMAT: master-tb-prod-A3 REVISION: H DATE: 2018/01/18 32 11.5 24 7.5 16 コネクタ中心位置 E エンボステープ幅 D CENTER OF CONNECTOR WIDTH OF TAPE ± 3.0 ° 4 PLACES ± 0.2 3 PLACES ± 0.2 2 PLACES ± 0.2 1 PLACE ± 0.2 0 PLACES ± 0.2 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 07:30:31 7 6 9 8 7 6 5 4 3 2 極数 CIRCUIT SIZE B CURRENT REV DESC: GENERAL TOLERANCES (UNLESS SPECIFIED) 材質 MATERIAL トップテープ TOP TAPE 14.2 C 15 14 13 12 11 10 THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION CENTER OF EMBOSSED POCKET ACUUMLATIVE PITCH: A 番号 D DETAIL U 18.3 17.3 16.3 15.3 14.3 13.3 12.3 11.3 10.3 9.3 8.3 7.3 6.3 5.3 TAPE WIDTH:24mm +0.1 ⌀ 1.5 0.0 SECTION V-V 1.5 +0.1 0 CENTER OF EMBOSSED POCKET ACCUMULATIVE PITCH: B �6.8� �0.5� SECTION X-X 7 TOP TAPE C E �2.55� X �2.0�エンボスポケット中心位置 4.0 ±0.1 累積ピッチ：40±0.2 6~15 CIRCUITS �5.67� �2.55� 0.2 +0.15 -0.05 SECTION Y-Y �6.8� �F � �E� D ±0.3 X Y D TAPE WIDTH:16mm �5.8� �4.2� Y E �4.2� 16mm幅テープ �0.5� 12 ±0.1 �5.8� 2~5 CIRCUITS 5 4 EC NO: 626442 DRWN: AISHIKAWA CHK'D: AIDA APPR: SAKIYAMA INITIAL REVISION: DRWN: AISHIKAWA APPR: SAKIYAMA THIRD ANGLE PROJECTION DRAWING 2019/06/21 2019/12/25 2019/12/25 PRODUCT CUSTOMER DRAWING DOC TYPE DOC PART REVISION DOCUMENT NUMBER 2019/06/21 2019/12/25 2083810000-SD MATERIAL NUMBER SERIES A3-SIZE 208381 3 PICO-CLASP 1.0 W/B SINGLE ROW VT SMT INNER LOCK GOLD PLATING LOW HALOGEN 2 PSD 000 A SHEET NUMBER CUSTOMER SEE SHEET 6 5 OF 6 1 A 9 7 8 5 6 4 3 2 1 E E D D 10 0.76 MICRO-METER 黒 BLACK 208381 1513 1413 1313 1213 1113 1013 0913 0813 0713 0613 0513 0413 0313 208381 0213 C B 製品一覧 PRODUCT LIST 0.38 MICRO-METER 黒 BLACK 208381 1515 1415 1315 1215 1115 1015 0915 0815 0715 0615 0515 0415 0315 208381 0215 自然色 NATURAL(BEIGE) 208381 1503 1403 1303 1203 1103 1003 0903 0803 0703 0603 0503 0403 0303 208381 0203 金めっき厚 GOLD PLATING THICKNESS 0.1 MICRO-METER 黒 BLACK 208381 1517 1417 1317 1217 1117 1017 0917 0817 0717 0617 0517 0417 0317 208381 0217 自然色 NATURAL(BEIGE) 208381 1505 1405 1305 1205 1105 1005 0905 0805 0705 0605 0505 0405 0305 208381 0205 色 COLOR 15 14 13 12 11 10 9 8 7 6 5 4 3 2 自然色 NATURAL(BEIGE) 208381 1507 1407 1307 1207 1107 1007 0907 0807 0707 0607 0507 0407 0307 208381 0207 発注番号 ORDER No. PACKAGING STYLE：EMBOSSED TAPE AND REEL C B 極数 CIRCUIT SIZE THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DIMENSION UNITS SCALE mm NTS CURRENT REV DESC: GENERAL TOLERANCES (UNLESS SPECIFIED) A ANGULAR TOL DOCUMENT STATUS FORMAT: master-tb-prod-A3 REVISION: H DATE: 2018/01/18 9 P1 RELEASE DATE 2019/12/25 8 ± 3.0 ° 4 PLACES ± 0.2 3 PLACES ± 0.2 2 PLACES ± 0.2 1 PLACE ± 0.2 0 PLACES ± 0.2 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 07:30:31 7 6 5 4 EC NO: 626442 DRWN: AISHIKAWA CHK'D: AIDA APPR: SAKIYAMA INITIAL REVISION: DRWN: AISHIKAWA APPR: SAKIYAMA THIRD ANGLE PROJECTION DRAWING 2019/06/21 2019/12/25 2019/12/25 PRODUCT CUSTOMER DRAWING DOC TYPE DOC PART REVISION DOCUMENT NUMBER 2019/06/21 2019/12/25 2083810000-SD MATERIAL NUMBER SERIES A3-SIZE 208381 3 PICO-CLASP 1.0 W/B SINGLE ROW VT SMT INNER LOCK GOLD PLATING LOW HALOGEN 2 PSD 000 A SHEET NUMBER CUSTOMER SEE SHEET 6 6 OF 6 1 A