213719-2041

厂商：
MOLEX10(莫仕)
封装：
-
描述：
213719-2041

数据手册：

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213719-2041 数据手册

DATASH EET Micro-Lock Plus Connector System Ideal for compact applications, the Micro-Lock Plus Connector System provides electrical and mechanical reliability in a high-temperature design that meets other industry requirements FEATURES AND ADVANTAGES Single and dual rows, 2 to 42 circuits, vertical and horizontal plug configurations Offer design flexibility Smallest 1.25mm-pitch connector with positive lock Delivers secure mating retention without sacrificing compactness Wide positive latch that delivers audible click Provides secure mating retention. Ensures proper mating Robust metal solder tabs Provide secure PCB retention and strain relief to solder joints Inner lock for dual-row versions; outer lock for single-row versions Strengthen lock for more reliable connection Dual-contact terminal design Offers secure contact and terminal retention Withstands up to 105˚C operating temperature Meets other industry requirements. Withstands harsh environments Micro-Lock Plus 1.25mm Wire-to-Board Connector NEW FEATURE WIRE-TO-WIRE Micro-Lock Plus 1.25mm Wire-to-Wire Single-Row Connector; 2 to 9 circuits Micro-Lock Plus 1.25mm Terminal ORDERING INFORMATION Series Number Pitch (mm) Component Plating 214525 1.25 Wire-to-Wire Plug Housing Tin 214524 1.25 Wire-to-Wire Plug Crimp Terminal Tin AWG/Allowable Current (current rating max.- two circuits) 26/ 3.2A 28/ 2.7A 30/ 2.2A Circuits Rows Cover Type 2 to 9 Single - - - - DATASH EET Micro-Lock Plus Connector System 2.00mm-pitch connector with positive lock Delivers secure mating retention without sacrificing compactness FEATURES AND ADVANTAGES Single-row plug in vertical and horizontal configurations, 2 to 16 circuits Offer design flexibility Wide positive latch that delivers audible click Provides secure mating retention. Ensures proper mating SMT terminals Prevent whiskering for a clean and uninterrupted signal. Supports terminal ruggedness and reliability Robust metal solder tabs Provide secure PCB retention and strain relief to solder joints Outer lock Strengthens lock for more reliable connection Micro-Lock Plus 2.00mm Wire-to-Board Connector Low-halogen and high-temperature capabilities Withstand harsh environments NEW FEATURE WIRE-TO-WIRE Micro-Lock Plus 2.00mm Terminal Micro-Lock Plus 2.00mm Wire-to-Wire Single-Row Connector; 2 to 9 circuits ORDERING INFORMATION Series Number Pitch (mm) Component Plating 213719 2.00 Wire-to-Wire Plug Housing Tin 213720 2.00 Wire-to-Wire Plug Crimp Terminal Tin AWG/Allowable Current (current rating max.- two circuits) 22/ 4.7A 24/ 3.9A 26/ 2.9A Circuits Rows Cover Type 2 to 9 Single - - - - DATASH EET Micro-Lock Plus Connector System MARKETS AND APPLICATIONS Datacom Servers Consumer White goods Gaming machines Drones Air conditioners Laser printers Vacuum cleaners Desktop PCs Power tools Air Condition White Goods Steering Wheel Switches Servers Drones Industrial Automation Automotive Steering wheel, paddle shift, combination switches Internal connection with other units SPECIFICATIONS 1.25MM REFERENCE INFORMATION ELECTRICAL PHYSICAL Packaging: Reel (Terminal); Voltage (max.): 50V Housing: Embossed (Header Assembly); Current (max.): 3.6A/Single (2 circuit/AWG 26) Bag (Receptacle Housing); 2.4A/Dual (8 circuit/AWG 26) Receptacle − PBT Header − PA Mates with: Micro-Lock Plus Connectors Contact Resistance (max.): 20 milliohms Crimp terminal: Copper alloy, Tin or Au plating Designed In: Millimeters Dielectric Withstanding Voltage: 500V AC Header pin: Copper alloy, Tin Bismuth or Au plating RoHS: Yes Insulation Resistance (min.): 100 Megohms Operating Temperature: -40 to +105˚C Low Halogen: Yes *Depends on series number MECHANICAL Durability (max.): 30 Cycles Crimp Terminal Insertion Force (max.): 4.9N Crimp Terminal Retention Force (min.): 9.8N Crimping Pull Out Force: 19.6N (min.) (AWG 26) Housing Lock Strength: 68.6N(min.) (Single 14-16 circuits) / 98.0N(min.) (Dual 38-42 circuits) Durability (max.): 30 Cycles Single AWG# Dual Amps [A] 2-circuit 8-circuit 16-circuit 26 3.6 2.4 2.2 28 3.1 2.1 30 2.8 1.8 AWG# Amps [A] 8-circuit 16-circuit 24-circuit 32-circuit 42-circuit 26 2.4 1.8 1.7 1.6 1.5 1.8 28 2.1 1.6 1.5 1.4 1.3 1.5 30 1.8 1.4 1.3 1.2 1.1 DATASH EET Micro-Lock Plus Connector System SPECIFICATIONS 2.00MM REFERENCE INFORMATION ELECTRICAL PHYSICAL Packaging: Reel (Terminal); Voltage (max.): 250V Housing: Embossed (Header Assembly); Current (max.): 4.7A (2 circuit/AWG 22) Bag (Receptacle Housing); Contact Resistance (max.): 10 Milliohms Mates With: Micro-Lock Plus Connectors Dielectric Withstanding Voltage: 800V AC Header Pin: Copper Alloy, Tin Designed In: Millimeters Insulation Resistance (min.): 1000 Megaohms Crimp Terminal: Copper Alloy, Tin RoHS: Yes Header−PA Header Pin: Copper Alloy, Tin MECHANICAL Low Halogen : Yes Crimp Terminal Insertion Force (max.): 9.8N Crimp Terminal Retention Force (min.): 25.0N Crimping Pull Out Force: 39.2N (min.) (AWG 22) Housing Lock Strength: 80N (min.) (6-16 circuits) Durability (max.): 30 Cycles AWG# Receptacle−PBT Amps [A] 2-circuit 8-circuit 16-circuit 22 4.7 3.5 3.4 24 3.9 3.1 3.0 26 2.9 2.7 2.6 Operating Temperature: -40 to +105˚C DATASH EET Micro-Lock Plus Connector System ORDERING INFORMATION Rows Cover Type - - - Gold, 0.10μm - - - Receptacle Terminal Gold, 0.38μm - - - 505431-1300 Receptacle Terminal Gold, 0.76μm - - - 505565-XX01 Receptacle Housing - No 505567-XX31 Right-Angle Header Gold, 0.38μm No 505567-XX51 Right-Angle Header Gold, 0.76μm No 505567-XX71 Right-Angle Header Tin-Bismuth No 505567-XX81 Right-Angle Header Gold, 0.10μm 505568-XX31 Vertical Header Gold, 0.38μm Yes 505568-XX51 Vertical Header Gold, 0.76μm Yes 505568-XX71 Vertical Header Tin-Bismuth Series No. Pitch (mm) Component Plating 505431-1000 Receptacle Terminal Tin 505431-1100 Receptacle Terminal 505431-1200 505568-XX81 AWG/Allowable Current* Circuits 2 to 16 Single No Yes 26 28 30 Vertical Header Gold, 0.10μm Receptacle Housing - 505433-XX21 Vertical Header Gold, 0.38μm No 505433-XX31 Vertical Header Gold, 0.38μm Yes 505433-XX41 Vertical Header Gold, 0.76μm No 505433-XX51 Vertical Header Gold, 0.76μm Yes 505433-XX61 Vertical Header Gold, 0.10μm No 505433-XX71 Vertical Header Tin-Bismuth 505433-XX81 Vertical Header Tin-Bismuth Yes 505433-XX91 Vertical Header Gold, 0.10μm Yes 505448-XX31 Right-Angle Header Gold, 0.38μm No 505448-XX51 Right-Angle Header Gold, 0.76μm No 505448-XX71 Right-Angle Header Tin-Bismuth No 505448-XX91 Right-Angle Header Gold, 0.10μm No 505572-1000 Receptacle Terminal Tin 505570-XX01 Receptacle Housing - Right-Angle Header Tin 505575-XX71 Vertical Header Tin 505575-XX81 Vertical Header Tin 505432-XX01 505578-XX71 1.25 2.00 Yes No 8 to 42 22 24 26 Dual - No No 2 to 16 Single No No Yes *Allowable current is different for each wire gauge by combination. www.molex.com/link/microlockplus.html Molex is a registered trademark of Molex, LLC in the United States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners Order No. 987651-4888 Rev. 6 USA/0k/GF/2022.07 ©2022 Molex

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213719-2041

物料型号： - 1.25mm间距：214525（Wire-to-Wire Plug Housing），214524（Wire-to-Wire Plug Crimp Terminal） - 2.00mm间距：213719（Wire-to-Wire Plug Housing），213720（Wire-to-Wire Plug Crimp Terminal）

器件简介： Micro-Lock Plus Connector System是一款适合紧凑应用的连接器系统，提供高温设计中的电气和机械可靠性，并满足其他行业要求。

引脚分配： - 1.25mm间距：单排和双排，2至42个电路，垂直和水平插头配置 - 2.00mm间距：单排，2至16个电路

参数特性： - 1.25mm间距：操作温度高达105°C - 2.00mm间距：操作温度范围为-40至+105°C

功能详解： - 提供1.25mm和2.00mm两种间距的连接器 - 具有正锁机制，确保安全配对和保持 - 有单排和双排配置选项 - 采用SMT端子，防止须状物生长，支持信号的清洁和不间断传输

应用信息：适用于多种市场和应用，包括数据通信服务器、消费电子、白色家电、游戏机、无人机等。

封装信息： - 提供详细的订购信息，包括系列号、间距、组件、镀层、AWG/允许电流、电路、排数和盖类型 - 1.25mm间距：例如，214525系列提供2至9个电路的Wire-to-Wire插头外壳，镀锡 - 2.00mm间距：例如，213719系列提供2至9个电路的Wire-to-Wire插头外壳，镀锡

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