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26-61-5080

26-61-5080

  • 厂商:

    MOLEX10(莫仕)

  • 封装:

    -

  • 描述:

    CONN HEADER 8POS .156 R/A GOLD

  • 数据手册
  • 价格&库存
26-61-5080 数据手册
9 7 8 6 5 4 3 5.11 .201 GOLD ±0.38 M ±.015 11.33±0.51 .446±.020 1 CKT DIM. A 2 7.77 .306 3.96±0.05 .156±.002 11.73 .462 15.70 .618 19.66 .774 23.62 .930 27.58 1.086 31.55 1.242 35.51 1.398 39.47 1.554 43.43 1.710 47.40 1.866 51.36 2.022 55.32 2.178 59.28 2.334 63.25 2.490 67.21 2.646 71.17 2.802 7.92±0.08 .312±.003 11.89±0.08 .468±.003 15.85±0.10 .624±.004 19.81±0.10 .780±.004 23.77±0.10 .936±.004 27.74±0.13 1.092±.005 31.70±0.13 1.248±.005 35.66±0.13 1.404±.005 39.62±0.15 1.560±.006 43.59±0.15 1.716±.006 47.55±0.15 1.872±.006 DIM. A REF. 3 DIM. B 4 3.96REF. .156 TYP. BETWEEN ANY 2 CONSECUTIVE CIRCUITS AT DATUM -D- 2.41 .095 E 2 5 6 SEE NOTE 9 7 CENTERLINE OF PIN AT TIP NOT TO VARY FROM CENTERLINE OF PIN AT DATUM -D- BY MORE THAN 0.20 / .008 IN ANY DIRECTION. TYP 3.30 REF .130 8 9 D 10 ±0.25 Y ±.010 TYP 11 12 D TIN 10.01±0.51 .394±.020 CENTERLINE OF PIN AT TIP NOT TO VARY FROM CENTERLINE OF PIN AT DATUM -D- BY MORE THAN 0.20 / .008 IN ANY DIRECTION. OPTIONAL VOIDED CIRCUIT SEE CHART FOR LOCATIONS 13 CIRCUIT 1 REF. SEE NOTE 10 14 P REF. 15 16 17 18 NONE NONE NONE E NONE 3&4 4&5 4&5 5&6 5&6 6&7 4&5 8&9 4&5 9 & 10 5&6 9 & 10 5&6 10 & 11 5&6 11 & 12 6&7 11 & 12 6&7 12 & 13 51.51±0.18 2.028±.007 55.47±0.18 2.184±.007 59.44±0.18 2.340±.007 63.40±0.20 2.496±.008 67.36±0.20 2.652±.008 NOTES: 1. MATERIAL: HEADER-GLASS FILLED POLYESTER, 94V-0, MOLDED NATURAL (WHITE). 2. FINISH: (197) OVERALL REFLOWED MATTE TIN: 0.00152/.000060 MIN. OVER 0.00127/.000050 MIN. NICKEL OVERALL. (154) OVERALL TIN: .00254/.000100 MIN OVER .00127/.000050 MIN NICKEL. (208) SELECT GOLD: .00038/.000015 MIN, SELECT TIN: .00254/.000100 MIN, OVERALL NICKEL UNDERPLATE: .00127/.000050 MIN. (228) SELECT GOLD: .00076/.000030 MIN, SELECT TIN: .00254/.000100 MIN, OVERALL NICKEL UNDERPLATE: .00127/.000050 MIN. (241) SELECT GOLD: 0.00051/.000020 MIN. SELECT TIN: 0.00254/.000100 MIN. OVERALL NICKEL UNDERPLATE: 0.00127/.000050 MIN. FOR ADDITIONAL PLATING INFO, SEE SDES-88. 3. PRODUCT SPECIFICATION AND PROCESS PARAMETERS: SEE PS-08-50. 4. PACKAGING INFORMATION: SEE CHART 5. SOLDERABILITY: PER SMES-152. 6. PIN PUSH-OUT FORCE: PRIOR TO SOLDERING, A 3 LB. MINIMUM FORCE (IN EITHER DIRECTION) 7. PARTS ARE STACKABLE END TO END ON 3.96/.156 CENTERS. 8. THIS PART CONFORMS TO CLASS B REQUIREMENTS OF COSMETIC SPECIFICATION PS-45499-002. 9. SLOTS ON BACKWALL ARE BETWEEN CIRCUITS. SEE CHART FOR LOCATION. 10. CIRCUIT 1 DESIGNATION IS USED TO DEFINE VOID LOCATION. CIRCUIT 1 MAY OR MAY NOT LINE UP WITH CIRCUIT 1 ON THE MATING HOUSING. C 3.96±0.05 .156±.002 TYP NON-ACCUM. 1.70±0.05 .067±.002 DIA TYP B SLOT LOC BETWEEN CKTS DIM. B D C B = 0 = 0 = 0 = Model: EM-41792 (SD Package) RELEASE STATUS FORMAT: Eng-lega-master-tb-prod-B REVISION: C DATE: 2016/04/04 9 C RELEASE DATE 8 7 6 5 0 = 0 EC NO: DRWN: CHK'D: APPR: = 0 = 0 K4 REV A 0 ADD 41792-0704 PCB LAYOUT: COMPONENT SIDE 112230 MKIPPER JDFOX FSMITH = 2017/01/10 2017/01/19 2017/01/30 QUALITY THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DIMENSION UNITS SCALE SYMBOLS GENERAL TOLERANCES (UNLESS SPECIFIED) INCH MM MM/IN 2:1 DRWN BY DATE 4 PLACES ± ± JSCHAFER 3 PLACES ± ± 0.01 CHK'D BY 2 PLACES ± 0.25 ± 0.015 KSAMIEC 1 PLACES ± 0.38 ± APPR BY 0 PLACES ± ± ANGULAR TOL ± 0.5 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 4 11-07-03 KK .156 HEADER ASSEMBLY FRICTION LOCK RIGHT ANGLE W/O PEGS DATE 11-10-03 DATE MARGULIS DRAWING SIZE PRODUCT CUSTOMER DRAWING 11-17-03 THIRD ANGLE PROJECTION B SERIES MATERIAL NUMBER 41792 SEE CHART DOCUMENT NUMBER SDA-41792 3 CUSTOMER 2 GENERAL MARKET DOC TYPE DOC PART SHEET NUMBER PSD 1 OF * 000 1 A
26-61-5080 价格&库存

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26-61-5080
  •  国内价格
  • 41+11.87464
  • 300+11.20009
  • 600+10.62736
  • 1200+10.05463

库存:0