47494-0001

PRODUCT SPECIFICATION TITLE 1.0 SCOPE This Product Specification covers the 2.54 mm pitch Mega SIM card connector. 2.0 PRODUCT DESCRIPTION 2.1 PRODUCT NAME AND SERIES NUMBER (S) Scalable SIM card connector 47494 series 3.0 APPLICABLE DOCUMENTS AND SPECIFICATIONS See sales drawings and other sections of this specification for the relevant reference documents. In cases where the specification differs from the drawings, the drawings take precedence. 4.0 RATINGS 4.1 VOLTAGE MAX 15V DC 4.2 CURRENT MAX 0.5A per contact 4.3 TEMPERATURE Operating: - 40°C to + 85°C Storage: - 40°C to + 85°C 5.0 Mechanical interface 5.1 Card interface: SIM card interface: GSM 11.11 specification. 5.2 PWB interface Plating on PWB pads: OSP plated copper. REVISION: ECR/ECN INFORMATION: TITLE: 1 EC NO: SHEET NO. MEGA SIM CARD CONNECTOR 1 OF 6 DATE: 2006/07/14 DOCUMENT NUMBER: PS-47494-001 WRITTEN BY: CYZHU CHECKED BY: XIXU APPROVED BY: FILE NAME JNCHEN TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC PRODUCT SPECIFICATION 6.0 PERFORMANCE 6.1 ELECTRICAL REQUIREMENTS TEST REF. DESCRIPTION Test Condition Requirement 50 milliohms Maximum [Initial] Value includes bulk resistance of terminal. Contact Resistance Mate connectors with dry circuit (20mV, 100mA Max) at minimum deflection Per EIA-364-23 6.2 Insulation Resistance Unmated connectors: apply a voltage of 500 VDC between adjacent contact for 1 minute Per EIA-364-21 6.3 Dielectric Withstanding Voltage Unmated connectors: apply a voltage of 500 VAC for 1 minute between adjacent contact. Per EIA-364-20 6.1 Temperature Rise 6.4 1000 Mega ohms Minimum No voltage breakdown; Mated connectors: measure the temperature rise at the rated current 0.5A after: 96 hours Per EIA-364-70 method 1 Temperature rise: +30°C MAXIMUM 7 ENVIRONMENTAL PERFORMANCE TEST REF. 7.1 7.2 ITEM High Relative Humidity Exposure TEST CONDITION REQUIREMENTS Upper air temp 25-55°C and 90100%RH for 6 cycles of 24hrs. Cycle is: temp change 25°C->55°C in 3 hours; then maintain at 55°C for 9hours Temp change: 55°C->25°C in 3 hours; then maintain at 25°C for 9hours. Recovery at 25°C and 75%RH for 2 hours. No mechanical damage. No change to performance Contact resistance 100 milliohms MAXIMUM Insulation resistance in spec. Low Temperature Exposure At -40°C for 96 hours Recovery: 2hours No mechanical damage. No change to performance of connector. Contact resistance 100 milliohms MAXIMUM REVISION: ECR/ECN INFORMATION: TITLE: 1 EC NO: SHEET NO. MEGA SIM CARD CONNECTOR 2 OF 6 DATE: 2006/07/14 DOCUMENT NUMBER: PS-47494-001 WRITTEN BY: CYZHU CHECKED BY: XIXU APPROVED BY: FILE NAME JNCHEN TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC PRODUCT SPECIFICATION 7.3 7.4 High Temperature Exposure Thermal Shock 7.5 Salt Spray IEC60068-2-11 Test Ka 7.6 Solderability 7.7 Resistance to Soldering reflow Heat At +85°C for 96 hours Recovery: 2hours 50 cycle at Ta=-55°C for 0.5 hours, then change of temp=25°C Maximum 5min,then Tb=+85°C for 0.5 hours, then cool to ambient Recovery: 2hours at ambient atmosphere Per EIA-364-32 48 hours spray, at temp 35+/-2°C, R/H 90-95%, Salt NaCl mist 5% after test wash parts and return to room ambient for 1-2hours Dip solder tails into the molten solder (held at 250 5 ) up to 0.5mm from the tip of tails for 3 0.5 seconds. Infrared reflow condition No mechanical damage. No change to performance of connector. Contact resistance 100 milliohms MAXIMUM No mechanical damage. No change to performance of connector. Contact resistance 100 milliohms MAXIMUM No mechanical damage. No change to performance of connector. Contact resistance 100 milliohms Contact solder Pad shall have a Min. 95% solder coverage No damage After 2 times of reflow TEMPERATURE CONDITION GRAPH (TEMPERATURE ON BOARD PATTERN SIDE) REVISION: ECR/ECN INFORMATION: TITLE: 1 EC NO: SHEET NO. MEGA SIM CARD CONNECTOR 3 OF 6 DATE: 2006/07/14 DOCUMENT NUMBER: PS-47494-001 WRITTEN BY: CYZHU CHECKED BY: XIXU APPROVED BY: FILE NAME JNCHEN TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC PRODUCT SPECIFICATION 8 MECHANICAL PERFORMANCE TEST REF. 8.1 8.2 DESCRIPTION Test Condition Terminal Normal force Measure normal force: Displaced to 0.20mm above the housing surface at 2.54mm/min. Terminal Retention Force Requirement Axial pullout force on the terminal in the housing at a rate of 25 ± 6 mm (1 ± ¼ inch) per minute. 8.3 Durability (Horizontal Direction 1) Mate connectors at 400-600 cycles/hour to 500 cycles. Horizontal insertion for maximum deflection case. 8.4 Durability (Horizontal Direction 2) Mate connectors at 400-600 cycles/hour to 500 cycles. Horizontal insertion for maximum deflection case. 8.5 Durability 8.5 8.6 0.5~0.7N Mate connectors at 2.54cm/minute (Vertical) to 500cycles.Vertical insertion for maximum deflection case Mechanical Shock Vibration Pulse shape=half sine Peak acceleration=490m/s2 (50G) Duration of pulse=11ms Apply 3 successive shocks in each direction along the 3 mutually perpendicular axes Per EIA-364-27B Frequency: 10~100 HZ, 0.0132 g2/Hz; Frequency: 100~500 Hz, -3dB/Oct. Applied for 1 hours in each 3 mutually perpendicular axes 3N MINIMUM per contact No mechanical damage. Contact resistance 100 milliohms MAX Normal force within spec. No mechanical damage. Contact resistance 100 milliohms MAX Normal force within spec. Normal force within spec. No mechanical damage. Contact resistance 100 milliohms MAX No mechanical damage. No change to performance of connector. Contact resistance 100 milliohms Maximum Discontinuity < 1 microsecond No mechanical damage. No change to performance of connector. Contact resistance 100 milliohms Maximum Discontinuity < 1 microsecond Card insertion directions REVISION: ECR/ECN INFORMATION: TITLE: 1 EC NO: SHEET NO. MEGA SIM CARD CONNECTOR 4 OF 6 DATE: 2006/07/14 DOCUMENT NUMBER: PS-47494-001 WRITTEN BY: CYZHU CHECKED BY: XIXU APPROVED BY: FILE NAME JNCHEN TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC PRODUCT SPECIFICATION 8.0 PACKAGING See packaging specification and pack assembly drawing. Parts shall be packaged to protect against damage during handing, transit and storage. REVISION: ECR/ECN INFORMATION: TITLE: 1 EC NO: SHEET NO. MEGA SIM CARD CONNECTOR 5 OF 6 DATE: 2006/07/14 DOCUMENT NUMBER: PS-47494-001 WRITTEN BY: CYZHU CHECKED BY: XIXU APPROVED BY: FILE NAME JNCHEN TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC PRODUCT SPECIFICATION 9.0 TEST SEQUENCES FOR MS DUO : ( SAMPLE GROUP SIZE: 5PCS) GROUP NUMBER Contact resistance 1 2 3 1,4 2,5 2,5 4 5 6 7 1,6 1,3 1,4 Insulation resistance 2,7 Dielectric withstanding voltage 3,8 Temperature Rise High Relative Humidity Exposure 5 Low Temperature Exposure 2 High Temperature Exposure 3 Thermal Shock 4 Salt Spray Test 2 Solderability Resistance to Soldering reflow Heat Normal force Terminal Retention Force 1,4 1,4 1 Durability (Horizontal Direction 1&2) Durability (Vertical) 3 3 Mechanical Shock 2 Vibration 3 REVISION: ECR/ECN INFORMATION: TITLE: 1 EC NO: SHEET NO. MEGA SIM CARD CONNECTOR 6 OF 6 DATE: 2006/07/14 DOCUMENT NUMBER: PS-47494-001 WRITTEN BY: CYZHU CHECKED BY: XIXU APPROVED BY: FILE NAME JNCHEN TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC