5011932000

10 9 7 8 6 5 4 3 2 1.07 0.96 1.25 F 0.98 F ⌀ 1.5 SECTION B-B SECTION A-A E 1 E NOTES: 1. 適合ハウジング: 501189**** 4 CONTACT POINT 1.75 APPLICABLE HOUSING 1.7 501330**** 501939**** (GOLD PLATING) 0.65 0.55 0.78 2. めっき仕様：表題欄参照 PLATING:SEE TABLE B A 3. 本製品は501193の部分金めっき品である。 THIS PRODUCT IS A PARTIAL GOLD-PLATED ITEM OF 501193. 0.28 PLEASE REFER TO CRIMP SPECIFICATION (CS-501193-001). 5. 製品の取扱いについては、コネクタ取扱い 説明書(5013300000 PS A00) を参照願います。 PLEASE REFER TO INSTRUCTION MANUAL(5013300000 PS A00). B A D 4. 圧着条件については、 圧着仕様書(CS-501193-001)を参照願います。 (0.12) 1.3 D CONTACT POINT (GOLD PLATING) Z C C TREAD MARK MXJ 1.0μm MIN. VIEW Z 0.1μm MIN. 5011932000 連鎖状 CHAIN 下地：ニッケルめっき 接点部：金めっき UNDER PLATING: CONTACT AREA： オーダー番号 NICKEL PLATING GOLD PLATING ODER NO. めっき仕様(前めっき) : PLATING(PRE-PLATING) B THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION MATERIAL りん青銅　下地ニッケル、部分金めっき SELECTIVE GOLD PLATING、UNDER NICKEL PLATING DOCUMENT STATUS FORMAT: master-tb-prod-A3 REVISION: H DATE: 2018/01/18 10 P1 RELEASE DATE 9 2018/06/22 FINISH 　　　　　　　　　SEE NOTE WIRE RANGE 　　　　　　　　　AWG#28-32 INS. RANGE 　　　　　　　　　⌀0.4-0.8 08:13:32 8 7 6 DIMENSION UNITS SCALE mm 20:1 CURRENT REV DESC: REDRAWN AND REVISED GENERAL TOLERANCES (UNLESS SPECIFIED) PHOSPHOR BRONZE t=0.12 A B 端子形状 FORM ANGULAR TOL ± 3.0 ° 4 PLACES ± 0.2 3 PLACES ± 0.2 2 PLACES ± 0.2 1 PLACE ± 0.2 0 PLACES ± 0.2 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 5 4 EC NO: 178320 DRWN: MOYAMA CHK'D: SAKIYAMA APPR: TKANEKO INITIAL REVISION: DRWN: KYAMADA02 APPR: TKANEKO THIRD ANGLE PROJECTION DRAWING 2018/06/22 2018/06/22 2018/06/22 PRODUCT CUSTOMER DRAWING DOC TYPE DOC PART REVISION DOCUMENT NUMBER 2017/04/04 2017/04/06 SERIES A3-SIZE 501193 3 PICO-CLASP 1.0 W/B CONN CRIMP REC TERM (GOLD PLATING) 5011930000 MATERIAL NUMBER CUSTOMER SEE TABLE PSD 001 C SHEET NUMBER 1 OF 1 2 1 A