501331-0907

9 7 8 B CIRCUIT N �0.25� CAV NO. MOLD NO. CIRCUIT 1 3.0 (COVER TAPE) 8 �0.13� D (COVER TAPE) (PICTH) �0.5� 3.5 (COVER TAPE) A 0.12 TRADE MARK �0.05� 5.41 3 �0.35� �1.22� B 1 ウエハー WAFER 2 0.6 �0.66� (SOLDERING AREA) 2 部品 PART 1 �1.05� (SOLDERING AREA) 番号 NO. (STAND OFF) 4 C 3 2 0.1 TABLE 1 1.1 GOLD PLATING THICKNESS [micro-meter MIN.] SERIES No. DRAWING No. 0.1 0.38 0.76 504449 203556 203557 A (SOLDERING AREA) B ポリアミド(PA), UL94V-0, 色：SEE SHEET 6 POLYAMIDE(PA), UL94V-0, COLOR : SEE SHEET 6 錫めっき： 1.0 MICRO-METER MIN. MATTE TIN PLATING 錫めっき： 1.0 MICRO-METER MIN. MATTE TIN PLATING ニッケルめっき：1.0 MICRO-METER MIN. NICKEL 4 ネイル NAIL 下地めっき UNDER PLATING カバーテープ ポリイミドテープ COVER TAPE POLYIMIDE TAPE DOCUMENT STATUS FORMAT: tb-prod-A3 REVISION: H DATE: 2018/01/18 9 P1 RELEASE DATE ニッケルめっき：1.0 MICRO-METER MIN. NICKEL 2019/04/05 8 DIMENSION UNITS SCALE mm NTS GENERAL TOLERANCES (UNLESS SPECIFIED) 錫めっき： 1.0 MICRO-METER MIN. MATTE TIN PLATING テール部 TAIL AREA ANGULAR TOL ± 3.0 ° 4 PLACES ± 0.2 3 PLACES ± 0.2 2 PLACES ± 0.2 1 PLACE ± 0.2 0 PLACES ± 0.2 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 01:07:45 7 4.0 3.0 2.0 1.0 7.0 6.0 5.0 4.0 5 4 3 2 B A 極数 CIRCUIT SIZE THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION リン青銅 PHOSPHOR BRONZE 3 D 5044490000-SD PSD 000 2035560000-SD PSD 000 2035570000-SD PSD 000 材質 MATERIAL 接点部 ソルダーピン CONTACT AREA SOLDER PIN テール部 TAIL AREA 下地めっき UNDER PLATING E C リン青銅 PHOSPHOR BRONZE 2 1 1. 本製品は極数によって、ロック形状が変わりますので御注意願います。 　 THE LOCK SHAPE OF THIS PRODUCT CHANGES ACCORDING TO THE NUMBER OF CIRCUIT. 　 2~5 CIRCUITS：フリクションロック FRICTION LOCK 　 6~15 CIRCUITS：インナーポジティブロック INNER POSITIVE LOCK 　 2 材料及び仕上げ(めっき仕様)：TABLE 1,2 参照 　 MATERIAL AND FINISHES : SEE TABLE 1 AND 2 3. 製品仕様書：5013300000-PS 001 　 PRODUCT SPECIFICATION: 4. 梱包形態：SEE SHEET 4 　 PACKAGING INFORMATION: 5 嵌合相手：501330 シリーズ 　MATES WITH:501330 SERIES 6. アプリケーション仕様書(コネクタ取扱い説明書)：5013300000-AS A00(JAPANESE)/-A01(ENGLISH) 　 APPLICATION SPECIFICATION(CONNECTOR MANUAL): 7. ソルダーピン及びネイルの平坦度:0.1 MAX. 　SOLDER PIN AND NAIL COPLANARITY: 0.1 MAX. 　 8 偶数極に適応 　APPLY FOR EVEN CIRCUIT 9. 本製品は錫めっき品である。金めっき品は以下の図面を御参照下さい。 　 THIS PRODUCT IS A TIN PLATING. PLEASE REFER TO THE FOLLOWING DRAWING 　 FOR GOLD PLATING VERSION. CIRCUIT No.1 INDICATOR MARK 1.0 4 NOTES E 3.5 5 6 6 5 4 CURRENT REV DESC: EC NO: 614886 DRWN: AISHIKAWA CHK'D: AIDA APPR: KOMURAKAMI INITIAL REVISION: DRWN: AISHIKAWA APPR: KOMURAKAMI THIRD ANGLE PROJECTION DRAWING 2019/02/18 2019/04/03 2019/04/05 2019/02/18 2019/04/05 PRODUCT CUSTOMER DRAWING 2 DOC TYPE DOC PART REVISION DOCUMENT NUMBER 5013310000-SD MATERIAL NUMBER SERIES A3-SIZE 501331 3 PICO-CLASP 1.0 W/B SINGLE ROW VT SMT INNER LOCK TIN PLATING PSD 000 A SHEET NUMBER CUSTOMER SEE SHEET 6 1 OF 6 1 A 9 7 8 1.0 8 �0.5� �0.25� (PITCH) 3.0 E (COVER TAPE) D (COVER TAPE) A 番号 NO. 部品 PART 1 ウエハー WAFER 4 0.12 TABLE 2 C 2 0.6 �1.22� 2 1 (STAND OFF) �0.05� TRADE MARK 5.41 �0.13� 4.5 5.0 (SOLDERING AREA) 3 材質 MATERIAL �0.66� �1.05� (SOLDERING AREA) (SOLDERING AREA) ポリアミド(PA), UL94V-0, 色：SEE SHEET 6 POLYAMIDE(PA), UL94V-0, COLOR : SEE SHEET 6 0.1 リン青銅 PHOSPHOR BRONZE 1.1 錫めっき： 1.0 MICRO-METER MIN. MATTE TIN PLATING 錫めっき： 1.0 MICRO-METER MIN. MATTE TIN PLATING ニッケルめっき：1.0 MICRO-METER MIN. NICKEL 接点部 ソルダーピン CONTACT AREA SOLDER PIN テール部 TAIL AREA 下地めっき UNDER PLATING ネイル NAIL 4 下地めっき UNDER PLATING カバーテープ ポリイミドテープ COVER TAPE POLYIMIDE TAPE DOCUMENT STATUS FORMAT: master-tb-prod-A3 REVISION: H DATE: 2018/01/18 9 P1 RELEASE DATE ニッケルめっき：1.0 MICRO-METER MIN. NICKEL 2019/04/05 8 DIMENSION UNITS SCALE mm NTS GENERAL TOLERANCES (UNLESS SPECIFIED) 錫めっき： 1.0 MICRO-METER MIN. MATTE TIN PLATING テール部 TAIL AREA ANGULAR TOL ± 3.0 ° 4 PLACES ± 0.2 3 PLACES ± 0.2 2 PLACES ± 0.2 1 PLACE ± 0.2 0 PLACES ± 0.2 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 01:07:45 7 14.0 13.0 12.0 11.0 10.0 9.0 8.0 7.0 6.0 5.0 17.0 16.0 15.0 14.0 13.0 12.0 11.0 10.0 9.0 8.0 15 14 13 12 11 10 9 8 7 6 B A 極数 CIRCUIT SIZE B THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION リン青銅 PHOSPHOR BRONZE 3 1 CIRCUIT No.1 INDICATOR MARK �0.35� A 2 4.47 5.0 (COVER TAPE) D 2 3 CIRCUIT 1 E B 4 B CIRCUIT N CAV NO. MOLD NO. C 5 6 6 5 4 CURRENT REV DESC: EC NO: 614886 DRWN: AISHIKAWA CHK'D: AIDA APPR: KOMURAKAMI INITIAL REVISION: DRWN: AISHIKAWA APPR: KOMURAKAMI THIRD ANGLE PROJECTION DRAWING 2019/02/18 2019/04/03 2019/04/05 2019/02/18 2019/04/05 PRODUCT CUSTOMER DRAWING 2 DOC TYPE DOC PART REVISION DOCUMENT NUMBER 5013310000-SD MATERIAL NUMBER SERIES A3-SIZE 501331 3 PICO-CLASP 1.0 W/B SINGLE ROW VT SMT INNER LOCK TIN PLATING PSD 000 A SHEET NUMBER CUSTOMER SEE SHEET 6 2 OF 6 1 A 9 7 8 5 6 4 3 �A� 2 1 �0.12� �3.0� �0.6� E E 嵌合相手：501330 シリーズ MATE WITH : 501330 SERIES �6.3� 5 D 1.0 ±0.05 公差非累積 (PICTH) NON-ACCUMULATIVE TYP.(N) �0.39� 製品輪郭線 PART OUTLINE �1.0� 0.6 ±0.05 CIRCUIT N CIRCUIT 1 D a) 2~5 CIRCUITS 1.53 MIN. B ±0.05 DISTANCE FROM CONNECTOR OUT-LINE TO TERMINAL PAD 製品レイアウト(参考：6~15 CIRCUITS) PRODUCT LAYOUT(REFERENCE: 6~15 CIRCUITS) �A� �0.12� �4.8� �0.6� C �0.40� �0.8� B DISTANCE FROM CONNECTOR OUT-LINE TO NAIL PAD 1.2 MIN. 0.7 ±0.05 TYP.(2) TYP.(2) 推奨基板レイアウト(全極数適応)：実装面側 (参考：基板厚 1.0mm, メタルマスク厚さ 0.12mm, マスク開口率100%) b) 6~15 CIRCUITS 嵌合図 MATED CONNECTORS POLARIZED RECOMMENDED PCB LAYOUT(APPLY TO ALL CIRCUIT) : COMPONENT SIDE (REFERENCE: PCB THICKNESS 1.0mm, STENCIL THICKNESS 0.12mmm, APERTURE RATIO 100%) THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION :パターン禁止エリア RESTRICTED AREA NO PCB COMPONENTS ALLOWED A DOCUMENT STATUS FORMAT: master-tb-prod-A3 REVISION: H DATE: 2018/01/18 9 P1 RELEASE DATE 2019/04/05 8 �6.3� TYP.(2) B 1.8 ±0.05 �0.21� LAYOUT OR SOLDER PASTE RESTRICTED AREA �6.8� 2.65 ±0.05 パターン及び 半田禁止エリア 4.2 ±0.05 C DIMENSION UNITS SCALE mm NTS GENERAL TOLERANCES (UNLESS SPECIFIED) ANGULAR TOL ± 3.0 ° 4 PLACES ± 0.2 3 PLACES ± 0.2 2 PLACES ± 0.2 1 PLACE ± 0.2 0 PLACES ± 0.2 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 01:07:45 7 6 5 4 CURRENT REV DESC: EC NO: 614886 DRWN: AISHIKAWA CHK'D: AIDA APPR: KOMURAKAMI INITIAL REVISION: DRWN: AISHIKAWA APPR: KOMURAKAMI THIRD ANGLE PROJECTION DRAWING 2019/02/18 2019/04/03 2019/04/05 2019/02/18 2019/04/05 PRODUCT CUSTOMER DRAWING 2 DOC TYPE DOC PART REVISION DOCUMENT NUMBER 5013310000-SD MATERIAL NUMBER SERIES A3-SIZE 501331 3 PICO-CLASP 1.0 W/B SINGLE ROW VT SMT INNER LOCK TIN PLATING PSD 000 A SHEET NUMBER CUSTOMER SEE SHEET 6 3 OF 6 1 A 7 8 E 5 6 5 REEL 引き出し方向 �⌀80� PULL OUT DIRECTION 4 3 E TOP TAPE BONDED PART(EMPTY) 引き出し方向 PULL OUT DIRECTION D 末端部(空部) TAIL PART (EMPTY) 110 MIN. 12. トップテープの剥離強度はIEC60286-3に準拠。 　 TOP TAPE PEELING FORCE IS DEFINED BY IEC60286-3. 　 13 2~5極品は乾燥剤入り、ハイバリア梱包による納品となります。 　 2~5 CIRCUITS IS DELIVERED IN A HIGH BARIER PACKAGE WITH DESOCCANT. 14. 梱包仕様書：SPK-501331-001 　 PACKAGE SPECIFICATION: 33.4 15 発注番号：SHEET 6 参照 ORDER No.：PLEASE REFER TO SHEET 6 FOR PRODUCT LIST. 2.0 ±0.5 C ±1.0 C (⌀10) 501331 ** * * (12 0°) (22) 部品挿入部 CONPONENT SUPPLIER 400 MIN. Z B 1 10. 梱包数量:1100個/リール 　　NUMBER OF CONNECTORS : 1100 PIECES/REEL 11. リードテープ長さ 　　LEAD TAPE LENGTH トップテープ接着部(空エンボス) 100 MIN. D (2) 2 NOTES ⌀ 380 ±2 9 極数 CIRCUIT SIZE (⌀21) ハウジングカラー HOUSING COLOR 0:NATURAL(BEIGE) 25.4 9 8 7 6 5 4 3 2 製品識別番号 IDENTIFICATION NUMBER 7:EMBOSSED PACKAGE �⌀ 13� 17.5 DETAIL Z C C 15 14 13 12 11 10 B 極数 CIRCUIT SIZE THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DIMENSION UNITS SCALE mm NTS GENERAL TOLERANCES (UNLESS SPECIFIED) A 番号 部品 NO. PART 5 材質 MATERIAL リール ポリスチレン(PS) REEL POLYSTYRENE(PS) DOCUMENT STATUS FORMAT: master-tb-prod-A3 REVISION: H DATE: 2018/01/18 9 P1 RELEASE DATE 2019/04/05 8 ± 3.0 ° 4 PLACES ± 0.2 3 PLACES ± 0.2 2 PLACES ± 0.2 1 PLACE ± 0.2 0 PLACES ± 0.2 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 01:07:45 7 ANGULAR TOL 6 5 4 CURRENT REV DESC: EC NO: 614886 DRWN: AISHIKAWA CHK'D: AIDA APPR: KOMURAKAMI INITIAL REVISION: DRWN: AISHIKAWA APPR: KOMURAKAMI THIRD ANGLE PROJECTION DRAWING 2019/02/18 2019/04/03 2019/04/05 2019/02/18 2019/04/05 PRODUCT CUSTOMER DRAWING 2 DOC TYPE DOC PART REVISION DOCUMENT NUMBER 5013310000-SD MATERIAL NUMBER SERIES A3-SIZE 501331 3 PICO-CLASP 1.0 W/B SINGLE ROW VT SMT INNER LOCK TIN PLATING PSD 000 A SHEET NUMBER CUSTOMER SEE SHEET 6 4 OF 6 1 A 9 7 8 Y CIRCUIT 1 1.75 ±0.1 SECTION X-X R �0.75� DETAIL U 12 ±0.1 32mm幅テープ TAPE WIDTH:32mm 24mm幅テープ �F � 28.4 ±0.1 D ±0.3 V V �E� W �2.55� 1.75 ±0.1 CIRCUIT 1 �5.67� F �2.0� エンボスポケット中心位置 4.0 ±0.1 累積ピッチ：40±0.2 部品 PART NO. 6 7 材質 MATERIAL DOCUMENT STATUS FORMAT: master-tb-prod-A3 REVISION: H DATE: 2018/01/18 9 P1 ポリエチレン(PE)、その他 POLYETHYLENE(PE), etc RELEASE DATE 2019/04/05 8 DIMENSION UNITS SCALE mm NTS GENERAL TOLERANCES (UNLESS SPECIFIED) キャリアテープ ポリプロピレン(PP)、その他 CARRIER TAPE POLYPROPYLEN(PP), etc トップテープ TOP TAPE ANGULAR TOL ± 3.0 ° 4 PLACES ± 0.2 3 PLACES ± 0.2 2 PLACES ± 0.2 1 PLACE ± 0.2 0 PLACES ± 0.2 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 01:07:45 7 6 14.2 32 11.5 24 7.5 C 15 14 13 12 11 10 16 コネクタ中心位置 E エンボステープ幅 D SENTER OF CONNECTOR WIDTH OF TAPE 9 8 7 6 5 4 3 2 極数 CIRCUIT SIZE B THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION CENTER OF EMBOSSED POCKET ACUUMLATIVE PITCH: A 番号 DETAIL U 18.3 17.3 16.3 15.3 14.3 13.3 12.3 11.3 10.3 9.3 8.3 7.3 6.3 5.3 W CONNECTOR +0.1 ⌀ 1.5 0.0 D CENTER OF EMBOSSED POCKET TAPE WIDTH:24mm 6 CARRIER TAPE SECTION V-V 1.5 +0.1 0 �2.0�エンボスポケット中心位置 ACCUMULATIVE PITCH: B �5.8� �0.5� �5.8� �2.55� �5.1� E �2.55� �6.8� X 7 TOP TAPE SECTION W-W 1 �5.67� �2.55� 0.2 +0.15 -0.05 ⌀ 1.5 +0.1 0.0 �6.8� � F� �E� D ±0.3 TAPE WIDTH:16mm X 4.0 ±0.1 累積ピッチ：40±0.2 C 2 �4.2� 16mm幅テープ �4.2� Y 6~15 CIRCUITS 3 �0.5� 12 ±0.1 E SECTION Y-Y 4 引き出し方向 PULL OUT DIRECTION 2~5 CIRCUITS D 5 6 5 4 CURRENT REV DESC: EC NO: 614886 DRWN: AISHIKAWA CHK'D: AIDA APPR: KOMURAKAMI INITIAL REVISION: DRWN: AISHIKAWA APPR: KOMURAKAMI THIRD ANGLE PROJECTION DRAWING 2019/02/18 2019/04/03 2019/04/05 2019/02/18 2019/04/05 PRODUCT CUSTOMER DRAWING 2 DOC TYPE DOC PART REVISION DOCUMENT NUMBER 5013310000-SD MATERIAL NUMBER SERIES A3-SIZE 501331 3 PICO-CLASP 1.0 W/B SINGLE ROW VT SMT INNER LOCK TIN PLATING PSD 000 A SHEET NUMBER CUSTOMER SEE SHEET 6 5 OF 6 1 A 9 7 8 6 5 4 3 2 1 E E D D 15 13 製品一覧 PRODUCT LIST HOUSING COLOR NATURAL(BEIGE) 501331 1507 1407 1307 1207 1107 1007 0907 0807 0707 0607 0507 0407 0307 501331 0207 C B 15 14 13 12 11 C 10 9 8 7 6 5 4 3 2 B 発注番号 ORDER No. 極数 梱包形態：エンボスリール　 CIRCUIT SIZE PACKAGE:EMBOSSED REEL THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DIMENSION UNITS SCALE mm NTS GENERAL TOLERANCES (UNLESS SPECIFIED) A DOCUMENT STATUS FORMAT: master-tb-prod-A3 REVISION: H DATE: 2018/01/18 9 P1 RELEASE DATE 2019/04/05 8 ANGULAR TOL ± 3.0 ° 4 PLACES ± 0.2 3 PLACES ± 0.2 2 PLACES ± 0.2 1 PLACE ± 0.2 0 PLACES ± 0.2 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 01:07:45 7 6 5 4 CURRENT REV DESC: EC NO: 614886 DRWN: AISHIKAWA CHK'D: AIDA APPR: KOMURAKAMI INITIAL REVISION: DRWN: AISHIKAWA APPR: KOMURAKAMI THIRD ANGLE PROJECTION DRAWING 2019/02/18 2019/04/03 2019/04/05 2019/02/18 2019/04/05 PRODUCT CUSTOMER DRAWING 2 DOC TYPE DOC PART REVISION DOCUMENT NUMBER 5013310000-SD MATERIAL NUMBER SERIES A3-SIZE 501331 3 PICO-CLASP 1.0 W/B SINGLE ROW VT SMT INNER LOCK TIN PLATING PSD 000 A SHEET NUMBER CUSTOMER SEE SHEET 6 6 OF 6 1 A 9 7 8 5 6 4 3 2 1 CONFIDENTIAL NOTES. １．製品詳細寸法については製品単体図面を参照ください. ABOUT DETAILED DIMENSION, SEE PRODUCT DRAWING. ２．梱包数量：１１００個／リール NUMBER OF CONNECTORS : 1100PIECES/REEL ３．リードテープ長さ LEAD TAPE LENGTH トップテープ接着部（空エンボス） 20 PIECES. MIN. TOP TAPE BONDED PART (EMPTY) E (⌀80) PULL OUT DIRECTION ⌀380 ±2 引き出し方向 引き出し方向 PULL OUT DIRECTION D 部品挿入部 COMPONENT SUPPLIER 400MIN. (⌀ 10) E ±1.0 (22) 0°) C (12 (2) (⌀ 21) 緑 GREEN 5013311562 5013311462 5013311362 5013311262 5013311162 5013311062 5013310962 5013310862 5013310762 5013310662 B EMBOSSED PACKAGE オーダー番号 ORDER NO. 赤 青 BLUE 5013311542 5013311442 5013311342 5013311242 5013311142 5013311042 5013310942 5013310842 5013310742 5013310642 EMBOSSED PACKAGE 10 120301 QHE31 SAKIYAMA TKANEKO RELEASED 04.08.2017 8 A 10:10:40 7 6 5 REV RELEASE DATE EMBOSSED PACKAGE 501331 1507 501331 1407 501331 1307 501331 1207 501331 1107 501331 1007 501331 0907 501331 0807 501331 0707 501331 0607 15 14 13 12 11 10 EMBOSSED PACKAGE 9 8 7 6 B 極数 CIRCUTIS 10 オーダー番号 ORDER NO. 10 オーダー番号 ORDER NO. 10 オーダー番号 ORDER NO. THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION EC NO: DRWN: CHK'D: APPR: 9 P1 色 COLOR オーダー番号 ORDER NO. A RELEASE STATUS C NATURAL 5013311512 5013311412 5013311312 5013311212 5013311112 5013311012 5013310912 5013310812 5013310712 5013310612 EMBOSSED PACKAGE GENERAL TOLERANCES (UNLESS SPECIFIED) ANGULAR TOL ± 3.0 ° FORMAT: tb-prod-A3 REVISION: G DATE: 2017/02/06 D 自然色 黒 BLACK RED 5013311522 5013311422 5013311322 5013311222 5013311122 5013311022 5013310922 5013310822 5013310722 5013310622 2017/08/03 2017/08/04 2017/08/04 10 末端部 （空部） TAIL PART (EMPTY) 40MIN. ４．材料 MATERIAL キャリアテープ：ポリプロピレン CARRIER TAPE : POLYPROPYLENE トップテープ：ＰＥＴ,ＰＥ,ＲＥＦ TOP TAPE リール：ポリスチレン（リサイクル材を含む） REEL : POLYSTYLENE (RECYCLE MATERIAL CONTAINED) D ±1.0 E E 4 PLACES ± 0.2 3 PLACES ± 0.2 2 PLACES ± 0.2 1 PLACE ± 0.2 0 PLACES ± 0.2 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 4 DIMENSION UNITS SCALE MM 1:1 DRWN BY DATE 2017/08/03 QHE31 2017/08/04 SAKIYAMA APPR BY TKANEKO DRAWING SIZE PICO-CLASP 1.0 W/B SINGLE-ROW ST EMBSTP PKG WAFER ASS'Y DATE CHK'D BY A DATE 2017/08/04 THIRD ANGLE PROJECTION A3 PRODUCT CUSTOMER DRAWING SERIES MATERIAL NUMBER 501331 SEE TABLE OF SHEET 1 DOCUMENT NUMBER DOC TYPE DOC PART SHEET NUMBER 5013310612-SD 3 CUSTOMER 2 PSD 1 OF 3 000 1 9 7 8 5 6 4 3 2 1 CONFIDENTIAL Y X (B) EMBOSSED TAPE ( 6.8 ) ( 2.55 ) C ±0.3 Y ( 5.67 ) ( 5.8 ) (A) ２４幅テープ 24 WIDTH TAPE CONNECTOR E コネクター中心 ３２幅テープ 32 WIDTH TAPE 0.5 ±0.05 E CENTER OF CONNECTOR 12 ±0.1 X D D SECT. X-X ⌀ 1.5 +0.1 0 (2) 累積ピッチ：40±0.2 ACUUMLATIVE PITCH 4 ±0.1 ( 5.67 ) 引き出し方向 PULL OUT DIRECTION C ( 2.55 ) (SCALE 4:1) 1.75 ±0.1 SECT. Y-Y TOP TAPE CKT NO.1 37.4 33.4 29.4 25.4 B D E 15 14 13 12 11 10 9 8 7 6 18.3 32 14.2 17.3 16.3 15.3 14.3 13.3 24 11.5 12.3 11.3 10.3 9.3 C (B) (A) C B 極数 CIRCUITS 2017/08/03 2017/08/04 2017/08/04 THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION GENERAL TOLERANCES (UNLESS SPECIFIED) RELEASED RELEASE STATUS FORMAT: master-tb-prod-A3 REVISION: G DATE: 2017/02/06 9 P1 RELEASE DATE 04.08.2017 8 A 10:10:40 7 6 5 REV EC NO: DRWN: CHK'D: APPR: A 120301 QHE31 SAKIYAMA TKANEKO ANGULAR TOL ± 3.0 ° 4 PLACES ± 0.2 3 PLACES ± 0.2 2 PLACES ± 0.2 1 PLACE ± 0.2 0 PLACES ± 0.2 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 4 DIMENSION UNITS SCALE MM 1:1 DRWN BY DATE 2017/08/03 QHE31 2017/08/04 SAKIYAMA APPR BY TKANEKO DRAWING SIZE PICO-CLASP 1.0 W/B SINGLE-ROW ST EMBSTP PKG WAFER ASS'Y DATE CHK'D BY A DATE 2017/08/04 THIRD ANGLE PROJECTION A3 PRODUCT CUSTOMER DRAWING SERIES MATERIAL NUMBER 501331 SEE TABLE OF SHEET 1 DOCUMENT NUMBER DOC TYPE DOC PART SHEET NUMBER 5013310612-SD 3 CUSTOMER 2 PSD 2 OF 3 000 1 9 7 8 5 6 G 1.0 9 CAV. NO. 0.5 (PITCH) 4 CONFIDENTIAL G ±0.05 7 1.0 ±0.05 (0.25) 9 3 番号 NO. 　 公差非累積 E (0.13) 4.2 ±0.05 2.65 ±0.05 RECCOMENDED PATTERN DIM. (REF) SCALE:5:1 0.12 9 材質 MATERIAL 10 りん青銅 PHOSPHOR BRONZE 錫メッキ:1.0μｍＭＩＮ． TIN ニッケルメッキ（下地）:1.0μｍＭＩＮ． NICKEL(UNDER PLATING) 3 ネイル NAIL 4 カバーテープ COVER TAPE 参考パターンレイアウト 4.5 5 F D 1.8 ±0.05 4.47 5 3 2 1.2MIN 1 耐熱ナイロン樹脂 ,色：表参照 HEAT RESISTANCE NYLON , COLOR : SEE TABLE UL94V-0 E りん青銅 PHOSPHOR BRONZE ソルダーピン 錫メッキ:1.0μｍＭＩＮ． SOLDER PIN TIN ニッケルメッキ（下地）:1.0μｍＭＩＮ． NICKEL(UNDER PLATING) CKT NO.1 0.7 ±0.05 部品 PART ウエハー WAFER 1 (PITCH) NON-ACCUMULATIVE 0.6 ±0.05 CKT NO. 2 D ポリイミドテープ POLYIMIDE TAPE ④ TRADE MARK ① 10 501331 * * * * 5.41 C (0.2) 0.6 極数 CIRCUIT SIZE ② ③ 0.1 1.1 0.6 NOTES. B オーダー番号 ORDER NO. 5. 嵌合相手：501330**** MATE WITH : 501330**** 6. ソルダーピン及びネイル平坦度は,0.1ＭＡＸ． SOLDER PIN AND NAIL COPLANARITY TO BE 0.1MAX. 極数＝偶数に適用 APPLY FOR CKT SIZE=EVEN 2017/08/03 2017/08/04 2017/08/04 8. ２～５極は, 5013310400-SD を参照下さい. REFER TO 5013310400-SD ABOUT 2-5CKT. RELEASE STATUS 9 P1 RELEASE DATE 04.08.2017 8 EC NO: DRWN: CHK'D: APPR: FORMED BY MX AND 1 MORE LETTER OF ALPHABET WHICH MEAN THE MANUFACTORY, BUT "J" MEANS JAPAN. (TO TRADE MARK) AND BY I DIGIT NUMBER (TO CAVITY NO.) AND BY I LETTER OF ALPHABET (TO MOLD NO.) FORMAT: master-tb-prod-A3 REVISION: G DATE: 2017/02/06 A 10:10:40 7 6 GENERAL TOLERANCES (UNLESS SPECIFIED) ANGULAR TOL ± 3.0 ° 5 REV A トレードマーク：MXプラス1文字の製造工場を示すアルファベットにて構成 但し,"J"はJAPANを示す. キャビティー番号：1桁から2桁の数字で表示 金型番号：アルファベット1文字にて構成. RELEASED 9 17.0 16.0 12.0 15.0 11.0 10.0 14.0 13.0 15 14 C 13 12 HSG COLOR No. 9.0 12.0 11 10 自然色 NATURAL 07 8.0 11.0 9 黒 BLACK 12 7.0 10.0 8 赤 RED 22 6.0 9.0 7 青 BLUE 42 5.0 8.0 6 緑 GREEN 62 G F 極数 CKT. B THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION 120301 QHE31 SAKIYAMA TKANEKO 7 色 COLOR 14.0 13.0 4 PLACES ± 0.2 3 PLACES ± 0.2 2 PLACES ± 0.2 1 PLACE ± 0.2 0 PLACES ± 0.2 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 4 DIMENSION UNITS SCALE MM 10:1 DRWN BY DATE 2017/08/03 QHE31 2017/08/04 SAKIYAMA APPR BY TKANEKO DRAWING SIZE PICO-CLASP 1.0 W/B SINGLE-ROW ST EMBSTP PKG WAFER ASS'Y DATE CHK'D BY A DATE 2017/08/04 THIRD ANGLE PROJECTION A3 PRODUCT CUSTOMER DRAWING SERIES MATERIAL NUMBER 501331 SEE TABLE OF SHEET 1 DOCUMENT NUMBER DOC TYPE DOC PART SHEET NUMBER 5013310612-SD 3 CUSTOMER 2 PSD 3 OF 3 000 1