5014610491

9 7 8 5 6 NOTES E 引き出し方向 3 1. 製品詳細寸法については製品単体図面を参照下さい。 2. 梱包数量：3000個／リール 3. REEL 4 1 FOR DETAIL OF CONNECTOR DIMENSIONS,　SEE PRODUCT DRAWING. NUMBER OF CONNECTORS : 3000 PCS/REEL. E リードテープ長さ LEAD TAPE LENGTH. 引き出し方向 PULL OUT DIRECTION PULL OUT DIRECTION 2 20PCS.MIN. トップテープ接着部(空エンボス) D ⌀ 330 ± 2 ( ⌀ 80) TOP TAPE BONDED PART.(EMPTY) 部品挿入部 COMPONENT SUPPLIER . トップテープリーダー部 TOP TAPE LEADER PART 400MIN. 4. 5. 末端部(空部) TAIL PART (EMPTY) 160MIN. D .カバーテープの剥離強度については、IEC60286-3に準拠 　COVER TAPE PEEL FORCE IS DEFINED BY IEC 60286-3. 材料 MATERIAL (CARRIER TAPE) キャリアテープ　　　　　　 　：ポリスチレン (POLYSTYRENE) (TOP TAPE)：PET, PE, PEF トップテープ　　　 (REEL) 　(PS) リール　 　 ：ポリスチレン　　 POLYSTYRENE (PS) F C C ±1 6. D ±1 ELV及びRoHS適合品 ELV AND RoHS COMPLIANT C (⌀10) B (120 °) B (22) (2) 501461**91 MODEL NO. 2015/12/09 2015/12/24 2015/12/24 THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION (⌀21) REDRAW DETAIL F RELEASE STATUS FORMAT: master-tb-prod-A3 REVISION: F DATE: 2015/11/16 9 P1 RELEASE DATE 2015/12/24 8 03:08:15 7 6 5 A REV EC NO: DRWN: CHK'D: APPR: 102256 NVELUSAMY YNOGAWA YNOGAWA ANGULAR TOL ± (⌀13) A GENERAL TOLERANCES (UNLESS SPECIFIED) 4 PLACES ± 3 PLACES ± 2 PLACES ± 1 PLACE ± 0 PLACES ± ° DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 4 DIMENSION UNITS SCALE mm --- DRWN BY DATE 2015/12/09 NVELUSAMY 0.5 FPC CONN BACK FLIP H=0.8 EMBSTP PKG LOW-HALOGEN DATE CHK'D BY HIIJIMA APPR BY YNOGAWA DRAWING SIZE A DATE 2015/12/24 THIRD ANGLE PROJECTION A3 PRODUCT CUSTOMER DRAWING SERIES MATERIAL NUMBER 501461 SEE CHART DOCUMENT NUMBER 3 CUSTOMER GENERAL DOC TYPE DOC PART SHEET NUMBER 5014610001 2 PSD 000 1 1 OF 2 9 7 8 E 5 6 4 3 2 1 E 引き出し方向 PULL OUT DIRECTION �3.37� �3.2� 501461**92 �1.115� トップテープ TOP TAPE X �3.37� �3.2� �0.97� �7.5� 16 ±0.3 �B� �A� D �B� D SECT. Y-Y 1.75 ±0.1 C 0.3 ±0.05 �1.62� � 2� C Y Y 12 ±0.1 X ⌀ 1.5 +0.1 0 16mm 幅キャリアテープ 16mm WIDTH CARRIER TAPE SECT. X-X 4 ±0.1 累積ピッチ 40±0.2 ACCUMULATIVE PITCH 40±0.2 5.7 4.7 21.4 17.4 4.2 3.7 16 B キャリアテープ幅 CARRIER TAPE WIDTH D C (B) 6.2 5.2 4.7 4.2 5014610891 5014610691 5014610591 5014610491 EMBOSSED PACKAGE (A) ORDER NO. オーダー番号 8 6 5 4 B 極数 CIRCUITS CONNECTOR SERIES NO:501461**92 2015/12/09 2015/12/24 2015/12/24 THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION GENERAL TOLERANCES (UNLESS SPECIFIED) REDRAW RELEASE STATUS FORMAT: tb-prod-A3 REVISION: F DATE: 2015/11/16 9 P1 RELEASE DATE 2015/12/24 8 A 03:08:15 7 6 5 REV EC NO: DRWN: CHK'D: APPR: A 102256 NVELUSAMY YNOGAWA YNOGAWA ANGULAR TOL ± 4 PLACES ± 3 PLACES ± 2 PLACES ± 1 PLACE ± 0 PLACES ± ° DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 4 DIMENSION UNITS SCALE mm --- DRWN BY DATE 2015/12/09 NVELUSAMY 0.5 FPC CONN BACK FLIP H=0.8 EMBSTP PKG LOW-HALOGEN DATE CHK'D BY HIIJIMA APPR BY YNOGAWA DRAWING SIZE A DATE 2015/12/24 THIRD ANGLE PROJECTION A3 PRODUCT CUSTOMER DRAWING SERIES MATERIAL NUMBER 501461 SEE CHART DOCUMENT NUMBER GENERAL DOC TYPE DOC PART SHEET NUMBER 5014610001 3 CUSTOMER 2 PSD 2 OF 2 000 1 9 7 8 5 6 4 0.8 ±0.1 ハウジング HOUSING 0.27 ±0.1 �0.2� C ±0.1 0.46 ±0.2 アクチュエータ ACTUATOR （アクチュエータが開口した状態） (WHEN ACTUATOR IS OPENED) A ±0.1 0.5 ±0.1 0.15 ±0.1 E ±0.1 B ±0.1 1.64 ±0.2 3.1 ±0.2 0.58 ±0.1 回路番号１ CIRCUIT NO.1 3.2 ±0.25 3 ±0.1 D 補強金具 FITTING NAIL 0.15 ±0.1 ターミナル TERMINAL D ±0.2 Z Z B ISO VIEW (参考） �1� 9 P1 2016/01/18 8 102468 MTAKAHASHI04 TKUSUHARA01 TKUSUHARA01 REVISED RELEASE DATE B 09:21:29 7 6 5 REV RELEASE STATUS FORMAT: tb-prod-A3 REVISION: F DATE: 2015/11/16 SECTION Z-Z EC NO: DRWN: CHK'D: APPR: 接点部（下面） CONTACT POINT (BOTTOM CONTACT) E D C 4.97 3.97 3.47 2.97 4.18 3.18 2.68 2.18 5.5 4.5 4.0 3.5 E D C B 3.5 2.5 2.0 1.5 5014610891 8 5014610691 6 5 5014610591 4 5014610491 EMBOSSED TAPE PKG. 極　数(N) A ORDER NO. オーダー番号 CIRCUITS(N) B 5014610492 THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION GENERAL TOLERANCES (UNLESS SPECIFIED) ANGULAR TOL ± A 4.5 3.5 3.0 2.5 CONNECTOR NO. FPC挿入深さ INSERTION DEPTH OF FPC 接点位置 LENGTH TO CONTACT POINT 2016/01/12 2016/01/18 2016/01/18 �1.7� 1 パッド面 FPC挿入方向 C 2 注記 NOTES: 1. 材質 　　 MATERIAL 　　 ハウジング：黒色、ポリアミド(PA46)、ガラス充填、UL94HB 　　 HOUSING:BLACK,POLYAMIDE,GLASS FILLED,UL94HB 　　 アクチュエーター：ナチュラル（白色）、ポリアミド(PA46)、ガラス充填、UL94HB 　　 ACTUATOR:NATURAL(WHITE),POLYAMIDE,GLASS FILLED,UL94HB 　　 ターミナル：リン青銅（ｔ＝0.15） 　　 TERMINAL:PHOSPHOR BRONZE (t=0.15) 　　 補強金具：リン青銅（ｔ＝0.15） 　　 NAIL:PHOSPHOR BRONZE (t=0.15) 2. めっき仕様 　　 PLATING ターミナル: 接点部：部分金メッキ(0.1μm以上） 　 　　　　　　　 テール部 :部分金メッキ 　　　　　　　 下地　ニッケルメッキ(1.0μm以上) 　　 TERMINAL : CONTACT AREA :SEPARATED GOLD PLATING (0.1 MICROMETER MINIMUM) SOLDER TAIL AREA :SEPARATED GOLD PLATING UNDER PLATING ; NICKEL PLATING OVERALL (1.0 MICROMETER MINIMUM) 補強金具： 錫メッキ(1.0μm以上) 　　　　　　　 下地　ニッケルメッキ(1.0μm以上） FITTING NAIL : TIN PLATING 1.0 MICROMETER MINIMUM. UNDER PLATING ; NICKEL PLATING OVERALL (1.0 MICROMETER MINIMUM) 3. 平坦度は、０.１ｍｍ以下とする。 TAILS AND NAILS COPLANARITY TO BE 0.1mm MAXIMUM. 4. ELV&RoHS COMPLIANT E �3.01� 3 4 PLACES ± 3 PLACES ± 2 PLACES ± 1 PLACE ± 0 PLACES ± ° DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 4 DIMENSION UNITS SCALE mm 10:1 DRWN BY DATE 2015/12/09 NVELUSAMY HIIJIMA 2015/12/24 APPR BY A DATE YNOGAWA DRAWING SIZE 0.5 FPC CONN BACK FLIP HGT=0.8 HSG ASSY LOW-HALOGEN DATE CHK'D BY 2015/12/24 THIRD ANGLE PROJECTION A3 PRODUCT CUSTOMER DRAWING SERIES MATERIAL NUMBER 501461 SEE CHART DOCUMENT NUMBER GENERAL DOC TYPE DOC PART SHEET NUMBER 5014611004 3 CUSTOMER 2 PSD 1 OF 2 000 1 4 0.5(N+1) ±0.05 E A ±0.03 1.21 ±0.05 3 MIN. 2.35 +0.15 0 0.3 ±0.03 1 ±0.05 9 RELEASE DATE 2016/01/18 8 09:21:29 7 6 2016/01/12 2016/01/18 2016/01/18 REVISED 5 B REV P1 GENERAL TOLERANCES (UNLESS SPECIFIED) ANGULAR TOL ± EC NO: DRWN: CHK'D: APPR: RELEASE STATUS B THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION A FORMAT: master-tb-prod-A3 REVISION: F DATE: 2015/11/16 C カバーレイ：ポリイミド（12μm） COVER FILM: POLYIMIDE（12μm） FPCについて： 　　　抜き方向は、導体側から補強板側を推奨します。 　　　補強フィルム材質は、ポリイミドを推奨します。 　　　接着剤は、熱硬化接着剤を推奨します。 　　　尚、接着剤の接点部への付着は、導通不良の原因となりますので染み出しが無いよう、お願いします。 ABOUT FPC : RECOMMENDED PUNCHER DIRECTION : FROM CONDUCTOR SIDE TO STIFFNER FILME SIDE. RECOMMENDED MATERIAL : STIFFNER FILME : POLYIMIDE BONDING AGENT : THRMOSETTING AGENT PLEASE PUT APPROPRIATE AMOUNT OF ADHESIVE MAY CAUSE THE DEFECT IN ELECTRICAL CONTINUITY. 熱硬化接着剤 THERMOSETTING ADHESHIVE B 導体部：銅箔（18μm） COPPER FOIL（18μm） C 熱硬化接着剤 THERMOSETTING ADHESHIVE 適合金メッキＦＰＣ推奨寸法 APPLICABLE FPC OF GOLD PLATING RECOMMENDED DIMENSION 仕上がり厚さ：0.12±0.03 THICKNESS : 0.12+0.03/-0.03 推奨基板レイアウト RECOMMENDED P.C.BOARD PATTERN LAYOUT マスク厚 ：120μm マスク開口率：100% SCREEN THICKNESS : 120μm SCREEN OPEN RATIO : 100% ベースフィルム：ポリイミド（12μm） BASE FILM: POLYIMIDE（12μm） パターン禁止範囲 PATTERN 　　　PROHIBITION AREA 熱硬化接着剤 THERMOSETTING ADHESHIVE B ±0.05 D 0.3 ±0.03 補強板：ポリイミド STIFFNER BOARD: POLYIMIDE 0.3 ±0.05 E R 0.2 MAX. 102468 MTAKAHASHI04 TKUSUHARA01 TKUSUHARA01 0.77 ±0.05 0.52 ±0.05 R 0.2 ±0.1 シャープエッジのこと �1.64� D 0.5 ±0.1 R 0.2 ±0.1 1.96 ±0.05 0.64 ±0.05 0.3 ±0.05 仕上がり厚さ THISCKNESS ⌯ 0.04 A 0.5 ±0.03 1 0.12 ±0.03 ⌯ 0.04 A A ±0.05 0.12 ±0.03 2 A 0.5(N-1)+0.3 ±0.03 0.5 ±0.05 3 端子部メッキ：金メッキ(0.1μm以上)、 下地ニッケルメッキ(2～6μm) PLATING：GOLD PLATING(0.1μm MIN.), NICKEL UNDER PLATING(2～6μm) 5 6 1.4 ±0.2 7 8 0.7 ±0.1 9 4 PLACES ± 3 PLACES ± 2 PLACES ± 1 PLACE ± 0 PLACES ± ° DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 4 DIMENSION UNITS SCALE mm 10:1 DRWN BY DATE 2015/12/09 NVELUSAMY HIIJIMA 2015/12/24 APPR BY A DATE YNOGAWA DRAWING SIZE 0.5 FPC CONN BACK FLIP HGT=0.8 HSG ASSY LOW-HALOGEN DATE CHK'D BY 2015/12/24 THIRD ANGLE PROJECTION A3 PRODUCT CUSTOMER DRAWING SERIES MATERIAL NUMBER 501461 SEE CHART DOCUMENT NUMBER 3 CUSTOMER GENERAL DOC TYPE DOC PART SHEET NUMBER 5014611004 2 PSD 000 1 2 OF 2