5015713007

9 7 8 5 6 4 3 2 1 NOTES 材料及び仕上げ(めっき仕様)：TABLE 1 参照 　 MATERIAL AND FINISHES : SEE TABLE 1 2. 製品仕様書：PS-501571-001 　 PRODUCT SPECIFICATION: E 3. 梱包形態：SEE SHEET 3 　 PACKAGING INFORMATION: 4 嵌合相手：501189 シリーズ 　MATES WITH:501189 SERIES 5. アプリケーション仕様書(コネクタ取扱い説明書)：5011890000-AS A00(JAPANESE)/A01(ENGLISH) 　 APPLICATION SPECIFICATION(CONNECTOR MANUAL): 6. ソルダーピン及びネイルの平坦度:0.1 MAX. 　SOLDER PIN AND NAIL COPLANARITY: 0.1 MAX. 　 7 極数/2=偶数に適応 　APPLICABLE FOR CIRCUIT SIZE/2=EVEN 　 8 凹形状はキャビティにより、反対側面に存在します。 D 　 THE CONCAVE AREA TO BE SET ON THE REVERSE SIDE DEPENDING ON THE MOLDING CAVITY. 9. 本製品は複数の金めっき厚を展開しております。その他の金めっき厚は以下の図面を御参照下さい。 　 THIS PRODUCT EXIST MULTIPLE GOLD PLATING. 　 PLEASE REFER TO THE FOLLOWING DRAWING FOR OTHER GOLD PLATING THICKNESS. 1 B 7 1.0 (PICTH) 5.9 �3.0� �0.25� CIRCUIT 1 �0.5� (SUCTION AREA) �3.0� D (SUCTION AREA) A CIRCUIT No.1 & No.2 INDICATOR MARK 4.9 TRADE MARK Z 1.33 1 8 3 �0.1� 1.33 �4.07� CIRCUIT N B 部品 PART 1 ウエハー WAFER �0.2� Z CAV. & MOLD No. 番号 NO. 6.8 (STAND OFF) C �1.6� �1.1� CIRCUIT 2 1 2 �0.75� GOLD PLATING THICKNESS [micro-meter MIN.] SERIES No. DRAWING No. 0.38 0.76 203566 203567 1.3 (SOLDERING AREA) B 材質 MATERIAL �0.0� ポリアミド(PA), UL94V-0, 色：SEE SHEET 5 POLYAMIDE(PA), UL94V-0, COLOR : SEE SHEET 5 接点部 ソルダーピン CONTACT AREA SOLDER PIN テール部 TAIL AREA 下地めっき UNDER PLATING A (SOLDER TAIL PROTRUSION) �0.7� (SOLDERING AREA) SECTION Z-Z 金めっき： 0.1 MICRO-METER MIN. GOLD PLATING 金めっき： 0.1 MICRO-METER MIN. GOLD PLATING ニッケルめっき：1.0 MICRO-METER MIN. NICKEL ネイル NAIL DOCUMENT STATUS FORMAT: tb-prod-A3 REVISION: H DATE: 2018/01/18 9 錫めっき： 1.0 MICRO-METER MIN. MATTE TIN PLATING 下地めっき UNDER PLATING ニッケルめっき：1.0 MICRO-METER MIN. NICKEL P1 RELEASE DATE DIMENSION UNITS SCALE mm NTS 2019/04/03 8 ± 3.0 ° 4 PLACES ± 0.2 3 PLACES ± 0.2 2 PLACES ± 0.2 1 PLACE ± 0.2 0 PLACES ± 0.2 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 09:49:00 7 28.0 23.0 18.0 13.0 B A 50 40 30 20 極数 CIRCUIT SIZE CURRENT REV DESC: GENERAL TOLERANCES (UNLESS SPECIFIED) ANGULAR TOL テール部 TAIL AREA 24.0 19.0 14.0 9.0 THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION 黄銅 BRASS 3 C 0.6 リン青銅 PHOSPHOR BRONZE 2 2035660000-SD PSD 000 2035670000-SD PSD 000 �0.7� (SOLDERING AREA) TABLE 1 8.25 �0.25� E 6 5 4 EC NO: 614725 DRWN: AISHIKAWA CHK'D: AIDA APPR: KOMURAKAMI INITIAL REVISION: DRWN: AISHIKAWA APPR: KOMURAKAMI THIRD ANGLE PROJECTION DRAWING 2019/03/20 2019/04/03 2019/04/03 2019/03/20 2019/04/03 DOC TYPE DOC PART REVISION 5015710000-SD MATERIAL NUMBER SERIES 2 A PRODUCT CUSTOMER DRAWING DOCUMENT NUMBER A3-SIZE 501571 3 PICO-CLASP 1.0 W/B DUAL ROW RA SMT GOLD PLATING 0.1 MICRO-METER PSD 000 A SHEET NUMBER CUSTOMER SEE SHEET 5 1 OF 5 1 9 7 8 5 6 4 3 2 1 �7.29� E �A� E 4 製品レイアウト PRODUCT LAYOUT �B� LAYOUT OR SOLDER PASTE RESTRICTED AREA 1.0 ±0.05 公差非累積 (PICTH) NON-ACCUMULATIVE 1.1 MIN. 0.6 ±0.05 CIRCUIT 1 TYP.(2) 製品輪郭線 TYP.(N) D �0.6� �8.25� �8.48� �6.79� C 4.1 ±0.05 TYP.(2) 1.8 ±0.05 RESTRICTED AREA 3.6 MIN. C �0.4� PART OUTLINE DISTANCE FROM CONNECTOR OUT-LINE TO ODD TERMINAL PAD パターン及び 半田禁止エリア �1.0� D 嵌合相手:501189シリーズ MATE WITH : 501189 SERIES 　　　　嵌合図　　　　 MATED CONNECTORS 1.25 ±0.05 0.85 MIN. TYP.(2) TYP.(2) 推奨基板レイアウト(全極数適応)：実装面側 (参考：基板厚 1.0mm, メタルマスク厚さ 0.12mm, マスク開口率100%) A POLARIZED RECOMMENDED PCB LAYOUT(APPLY TO ALL CIRCUIT) : COMPONENT SIDE (REFERENCE: PCB THICKNESS 1.0mm, STENCIL THICKNESS 0.12mmm, APERTURE RATIO 100%) �0.4� DISTANCE FROM CONNECTOR OUT-LINE TO TERMINAL PAD TYP.(N) 1.6 ±0.05 �1.7� DISTANCE FROM CONNECTOR OUT-LINE TO EVEN TERMINAL PAD CIRCUIT 2 CIRCUIT N TYP.(2) 0.9 ±0.05 RESTRICTED AREA B 0.9 MIN. B THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT STATUS 9 P1 RELEASE DATE 2019/04/03 8 NTS ANGULAR TOL ± 3.0 ° 4 PLACES ± 0.2 3 PLACES ± 0.2 2 PLACES ± 0.2 1 PLACE ± 0.2 0 PLACES ± 0.2 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 09:49:00 7 SCALE mm 6 5 CURRENT REV DESC: GENERAL TOLERANCES (UNLESS SPECIFIED) :パターン禁止エリア RESTRICTED AREA NO PCB COMPONENTS ALLOWED FORMAT: master-tb-prod-A3 REVISION: H DATE: 2018/01/18 DIMENSION UNITS 4 EC NO: 614725 DRWN: AISHIKAWA CHK'D: AIDA APPR: KOMURAKAMI INITIAL REVISION: DRWN: AISHIKAWA APPR: KOMURAKAMI THIRD ANGLE PROJECTION DRAWING 2019/03/20 2019/04/03 2019/04/03 2019/03/20 2019/04/03 DOC TYPE DOC PART REVISION 5015710000-SD MATERIAL NUMBER SERIES 2 A PRODUCT CUSTOMER DRAWING DOCUMENT NUMBER A3-SIZE 501571 3 PICO-CLASP 1.0 W/B DUAL ROW RA SMT GOLD PLATING 0.1 MICRO-METER PSD 000 A SHEET NUMBER CUSTOMER SEE SHEET 5 2 OF 5 1 9 7 8 E 5 6 5 REEL 引き出し方向 4 3 2 1 E NOTES 10. 梱包数量:800個/リール 　　NUMBER OF CONNECTORS : 800 PIECES/REEL 11. リードテープ長さ 　　LEAD TAPE LENGTH トップテープ接着部(空エンボス) 100 MIN. ⌀ 380 ±2 �⌀80� PULL OUT DIRECTION TOP TAPE BONDED PART(EMPTY) 引き出し方向 PULL OUT DIRECTION D 部品挿入部 CONPONENT SUPPLIER 400 MIN. D 末端部(空部) TAIL PART (EMPTY) 160 MIN. Z D ±1.0 12. トップテープの剥離強度はIEC60286-3に準拠。 　 TOP TAPE PEELING FORCE IS DEFINED BY IEC60286-3. 13. 梱包仕様書：SPK-501571-001 　 PACKAGE SPECIFICATION: 14 発注番号：SHEET 5 参照 ORDER No.：PLEASE REFER TO SHEET 5 FOR PRODUCT LIST. 2.0 ±0.5 C (2) 0°) B 501571 ** * * (12 (22) (⌀10) C 極数 CIRCUIT SIZE ハウジングカラー HOUSING COLOR 0:NATURAL(BEIGE) 製品識別番号 IDENTIFICATION NUMBER 7:EMBOSSED PACKAGE B (⌀21) 50 40 33.5 30 25.5 20 極数 D CIRCUIT SIZE �⌀ 13� 45.5 DETAIL Z THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DIMENSION UNITS SCALE mm NTS CURRENT REV DESC: GENERAL TOLERANCES (UNLESS SPECIFIED) A ANGULAR TOL 番号 部品 NO. PART 5 材質 MATERIAL リール ポリスチレン(PS) REEL POLYSTYRENE(PS) DOCUMENT STATUS FORMAT: master-tb-prod-A3 REVISION: H DATE: 2018/01/18 9 P1 RELEASE DATE 2019/04/03 8 3.0 ° 4 PLACES ± 0.2 3 PLACES ± 0.2 2 PLACES ± 0.2 1 PLACE ± 0.2 0 PLACES ± 0.2 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 09:49:00 7 ± 6 5 4 EC NO: 614725 DRWN: AISHIKAWA CHK'D: AIDA APPR: KOMURAKAMI INITIAL REVISION: DRWN: AISHIKAWA APPR: KOMURAKAMI THIRD ANGLE PROJECTION DRAWING 2019/03/20 2019/04/03 2019/04/03 2019/03/20 2019/04/03 DOC TYPE DOC PART REVISION 5015710000-SD MATERIAL NUMBER SERIES 2 A PRODUCT CUSTOMER DRAWING DOCUMENT NUMBER A3-SIZE 501571 3 PICO-CLASP 1.0 W/B DUAL ROW RA SMT GOLD PLATING 0.1 MICRO-METER PSD 000 A SHEET NUMBER CUSTOMER SEE SHEET 5 3 OF 5 1 9 7 8 44mm幅テープ 4 3 2 1 W 12.0 ±0.1 TAPE WIDTH:44mm 5 6 1.5 +0.1 0.0 R �0.75� E E 0.2 +0.15 -0.05 32mm幅テープ DETAIL W SCALE 10:1 24mm幅テープ D 0.5 ±0.05 Y TAPE WIDTH:24mm X �F� X C D ±0.3 CENTER OF CONNECTOR C コネクター中心位置 E ±0.1 CONNECTOR D �8.65� 7 TOP TAPE �6.2� �9.65� TAPE WIDTH:32mm SECTION X-X B SECTION Y-Y �3.1� ⌀ 1.5 +0.1 0.0 Y �6.2� �2.0� エンボスポケット中心位置 CENTER OF EMBOSSED POCKET G 累積ピッチ： 40 ±0.2 20.2 40.4 44.0 50 40 14.2 11.5 28.4 - 32.0 24.0 30 20 コネクタ中心位置 F CENTER OF CONNECTOR E 28.3 23.3 18.3 13.3 1.75 ±0.1 6 CARRIER TAPE �G� B 4.0 ±0.1 THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION ACUUMLATIVE PITCH: DIMENSION UNITS SCALE mm NTS CURRENT REV DESC: GENERAL TOLERANCES (UNLESS SPECIFIED) A 番号 部品 PART NO. 6 7 材質 MATERIAL ANGULAR TOL 引き出し方向 PULL OUT DIRECTION キャリアテープ ポリプロピレン(PP)、その他 CARRIER TAPE POLYPROPYLEN(PP), etc ポリエチレン(PE)、その他 POLYETHYLENE(PE), etc トップテープ TOP TAPE DOCUMENT STATUS FORMAT: master-tb-prod-A3 REVISION: H DATE: 2018/01/18 9 P1 RELEASE DATE 2019/04/03 8 極数 エンボステープ幅 D WIDTH OF TAPE CIRCUIT SIZE ± 3.0 ° 4 PLACES ± 0.2 3 PLACES ± 0.2 2 PLACES ± 0.2 1 PLACE ± 0.2 0 PLACES ± 0.2 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 09:49:00 7 6 5 4 EC NO: 614725 DRWN: AISHIKAWA CHK'D: AIDA APPR: KOMURAKAMI INITIAL REVISION: DRWN: AISHIKAWA APPR: KOMURAKAMI THIRD ANGLE PROJECTION DRAWING 2019/03/20 2019/04/03 2019/04/03 2019/03/20 2019/04/03 DOC TYPE DOC PART REVISION 5015710000-SD MATERIAL NUMBER SERIES 2 A PRODUCT CUSTOMER DRAWING DOCUMENT NUMBER A3-SIZE 501571 3 PICO-CLASP 1.0 W/B DUAL ROW RA SMT GOLD PLATING 0.1 MICRO-METER PSD 000 A SHEET NUMBER CUSTOMER SEE SHEET 5 4 OF 5 1 9 7 8 6 5 4 3 2 1 E E D D C C 14 製品一覧 PRODUCT LIST HOUSING COLOR NATURAL(BEIGE) B 501571 5007 501571 4007 501571 3007 501571 2007 B 50 40 30 20 発注番号 ORDER No. 極数 梱包形態：エンボスリール　 CIRCUIT SIZE PACKAGE:EMBOSSED REEL THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DIMENSION UNITS SCALE mm NTS CURRENT REV DESC: GENERAL TOLERANCES (UNLESS SPECIFIED) A ANGULAR TOL DOCUMENT STATUS FORMAT: master-tb-prod-A3 REVISION: H DATE: 2018/01/18 9 P1 RELEASE DATE 2019/04/03 8 ± 3.0 ° 4 PLACES ± 0.2 3 PLACES ± 0.2 2 PLACES ± 0.2 1 PLACE ± 0.2 0 PLACES ± 0.2 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 09:49:00 7 6 5 4 EC NO: 614725 DRWN: AISHIKAWA CHK'D: AIDA APPR: KOMURAKAMI INITIAL REVISION: DRWN: AISHIKAWA APPR: KOMURAKAMI THIRD ANGLE PROJECTION DRAWING 2019/03/20 2019/04/03 2019/04/03 2019/03/20 2019/04/03 DOC TYPE DOC PART REVISION 5015710000-SD MATERIAL NUMBER SERIES 2 A PRODUCT CUSTOMER DRAWING DOCUMENT NUMBER A3-SIZE 501571 3 PICO-CLASP 1.0 W/B DUAL ROW RA SMT GOLD PLATING 0.1 MICRO-METER PSD 000 A SHEET NUMBER CUSTOMER SEE SHEET 5 5 OF 5 1