5033005310

10 9 7 8 5 6 4 3 2 1 (1.85) ( FPC挿入深さ) (INSERTION DEPTH OD FPC) (0.1) A: 0.25*(N-1)+2 ±0.3 (2.65) (1.1) CL F 偶数端子 EVEN TERMINAL 注記 NOTES 1. 使用材料 MATERIALS 　ハウジング ：液晶ポリマー(UL94V-0、黒色) 　アクチュエータ ：ポリアミド樹脂(UL94V-0、ベージュ) 　奇数端子 ：リン青銅 　偶数端子 ：リン青銅 　補強金具 ：リン青銅 吸着エリア VACUUM AREA F (0.7) (接点位置) E (1.45) (接点位置) HOUSING ACTUATOR ODD TERMINAL EVEN TERMINAL FITTING NAIL 2.メッキ仕様 PLATING 端子 TERMINAL (CONTACT POSITION) (CONTACT POSITION) (0.25) Y X 接点間ピッチ CL (PITCH OF CONTACTS) 奇数端子 ODD TERMINAL ハウジング HOUSING 1.2±0.1 7 全面：スズメッキ 1.0 μm 以上 下地：ニッケルメッキ 1.0 μm 以上 D ALL OVER : Tin PLATING 1.0µm MINIMUM UNDER PLATING : Nickel PLATING 1.0µm MINIMUM (1.99) D TAIL AREA : Gold PLATING CONTACT AREA : Gold PLATING 0.1µm MINIMUM UNDER PLATING : Nickel PLATING 1.0µm MINIMUM 金具 FITTING NAIL アクチュエータ ACTUATOR 補強金具 FTTING NAIL E テール部：金メッキ 接点部：金メッキ 0.1μm 以上 下地：ニッケルメッキ 1.0 μm以上 SECTION Y-Y 6 : G.F. LCP (BLACK) : G.F. POLYAMIDE (BEIGE) : PHOSPHOR BRONZE : PHOSPHOR BRONZE : PHOSPHOR BRONZE 3 端子、補強金具のコプラナリティーは0.1以下とする COPLANALITY OF SOLDER TAILS AND FITTING NAILS : 0.1MAX. 4. 一般公差：±0.3 GENERAL TOLERANCES: ±0.3 5. ELV及びRoHS適合品 X Y (D: 0.25*(N+1)) (0.33) (0.1) 0.55 (テール部長さ） (DIMENSION OF SOLDER TAIL) (E: 0.25*(N-1)+1.34) B: 0.25*(N-1)±0.1 (1.0) 0.5±0.07 0.25±0.07 (PITCH) (0.15) (0.1) (DIMENSION OF SOLDER TAIL) (FPC INSERTION HEIGHT) C (0.25) (FPC挿入高さ) (3.2) 0.52 (テール部長さ) (1.86) SECTION X-X ELV AND RoHS COMPLIANT 0.37 (テール部長さ) 6 (DIMENSION OF SOLDER TAIL) THIS SHAPE IS FOR GATE IT DEPENDS ON THE NUMBER OF CIRCUITS C 503300-5310 53 503300-4310 43 503300-4110 41 503300-3710 37 503300-3110 31 503300-2910 29 B 503300-2110 21 ORDER NO. E D B A C CIRCUITS EMBOSSED TAPE PACKAGE CONNECTOR SERIES NO. 503300-**18 14.34 11.84 11.34 10.34 8.84 8.34 6.34 CL アクチュエータ閉じ位置 ACTUATOR CLOSED POSITION B ゲート部形状とする 本形状は極数により異なります 13.5 11 10.5 9.5 8 7.5 5.5 12.5 13 15 10 10.5 12.5 9.5 10 12 8.5 9 11 7 7.5 9.5 7 6.5 9 4.5 5 7 THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DIMENSION UNITS SCALE mm 20:1 CURRENT REV DESC: REVISED GENERAL TOLERANCES (UNLESS SPECIFIED) (0.1) 0.5±0.07 A (1.25) DOCUMENT STATUS FORMAT: master-tb-prod-A3 REVISION: J DATE: 2020/01/14 P1 (PITCH) C: 0.25*(N-3) ±0.1 RELEASE DATE 9 2021/08/23 ± 1.0 ° 4 PLACES ± 0.3 3 PLACES ± 0.3 2 PLACES ± 0.3 1 PLACE ± 0.3 0 PLACES ± 0.3 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 08:45:28 8 ANGULAR TOL 7 6 5 4 0.25 PITCH FPC CONN. E/O HGT=1.2 UPR CONTACT TYPE LOW-HALOGEN EC NO: 674869 DRWN: NARENC CHK'D: TKON APPR: SHOSHIKAWA INITIAL REVISION: DRWN: MNIITA APPR: SHOSHIKAWA THIRD ANGLE PROJECTION 2021/08/23 2021/08/23 2021/08/23 PRODUCT CUSTOMER DRAWING DOC TYPE DOC PART REVISION DOCUMENT NUMBER 2010/08/23 2010/08/27 DRAWING SERIES A3-SIZE 503300 3 SD-503300-001 MATERIAL NUMBER CUSTOMER GENERAL SEE TABLE 2 PSD 001 E SHEET NUMBER 1 OF 2 1 A 10 9 7 8 5 6 4 3 2 1 0.25*(N+1)±0.05 0.25*(N-1)±0.03 0.25+0.04 -0.03 1 3 0.15±0.05 0.5±0.05 (PITCH) 0.25±0.03 (0.2: メタルマスク) (0.08) D 0.4±0.05 (PATTERN WIDTH) (PITCH) 0.09MAX. (NARROW PATTERN WIDTH) 0.72±0.05 0.25+0.04 -0.03 0.5±0.02 E 0.95±0.05 3.3±0.5 補強板 0.25±0.02 (PITCH) (PATTERN WIDTH) 1 端子部メッキ PLATING D 0.25±0.03 (0.2: メタルマスク) 0.5±0.05 (0.25) (PITCH) (PATTERN GAP) F 0.25*(N-3)±0.05 0.25±0.05 0.57±0.05 0.5±0.02 (0.08) 1.76±0.05 0.25±0.15 (PLATING LEAD) 0.25±0.07 (MARGIN WIDTH) 0.95±0.15 1.8MIN. 2.15±0.3 (COVER FILM END) 0.5MIN. E (OVERLAP) THICKNESS 1.05±0.15 0.2±0.03 仕上がり厚さ (0.09) (PLATING LEAD) F (STIFFENER BOARD) 0.25±0.07 (MARGIN WIDTH) 0.25*(N-1)±0.05 0.67 (PATTERN GAP) 適合するFPC推奨寸法 APPLICABLE FPC RECOMMENDED DIMENSION (端子部仕上がり厚さ：0.2±0.03 ) (THICKNESS: 0.2±0.03) B C 注記 NOTES 補強板：ポリイミド STIFFENER BOARD: POLYIMIDE 熱硬化接着剤 THERMOSETTING ADHESIVE ベースフィルム：ポリイミド (25µm) BASE FILM: POLYIMIDE(25µm) 熱硬化接着剤 THERMOSETTING ADHESIVE 導体部：銅箔 (35µm) COPPER FOIL (35µm) 熱硬化接着剤 THERMOSETTING ADHESIVE カバーレイ：ポリイミド (25µm) COVER FILM: POLYIMIDE(25µm) C 1 2 補強板長さが図面通り確保できない場合は、カバーレイと 補強板のオーバーラップ寸法を0.5mm以上としてください 3 WHEN STIFFENER BOARD DIMENSION CAN NOT SECURE AS DRAWING, PLEASE GIVE THE OVERLAP SIZE OF COVER FILM AND STIFFENER BOARD AS 0.5mm MINIMUM 推奨ペースト厚 : 100µm 推奨マスク開口率 : 80% RECOMMEND SCREEN THICKNESS : 100µm RECOMMEND SCREEN OPEN RATIO : 80% 4 FPC について(ABOUT FPC) 抜き方向は、導体側から補強板側を推奨します 補強板材質は、ポリイミドを推奨します 接着剤は熱硬化接着剤を推奨します なお、接着剤の接点部への付着は導通不良の 原因となりますので染み出しがないよう、お願いします FPC パターンのメッキ仕様は 金メッキ：0.1µm 以上 下地ニッケルメッキ：2~6µm FPC PATTERN PLATING : 0.1µm MINIMUM GOLD PLATING NICKEL UNDER PLATING : 2~6µm RECOMMENDED PUNCHER DIRECTION: FROM CONDUCTOR SIDE TO STIFFENER BORAD SIDE RECOMMENDED MATERIAL: STIFFENER BOARD: POLYIMIDE BONDING AGENT: THERMOSETTING AGENT PLEASE PUT APPROPRIATE AMOUNT OF ADHESIVE ON THE CONTACT AREA BECAUSE THE EXTRA ADHESIVE MAY CAUSE THE DEFECT IN ELECTRICAL CONTINUITY B THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION FPC 構成材料例 EXAMPLE OF FPC COMPOSITION MATERIAL DOCUMENT STATUS P1 RELEASE DATE 9 SCALE mm 20:1 CURRENT REV DESC: REVISED GENERAL TOLERANCES (UNLESS SPECIFIED) A FORMAT: master-tb-prod-A3 REVISION: J DATE: 2020/01/14 DIMENSION UNITS 2021/08/23 ± 1.0 ° 4 PLACES ± 0.3 3 PLACES ± 0.3 2 PLACES ± 0.3 1 PLACE ± 0.3 0 PLACES ± 0.3 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 08:45:28 8 ANGULAR TOL 7 6 5 4 0.25 PITCH FPC CONN. E/O HGT=1.2 UPR CONTACT TYPE LOW-HALOGEN EC NO: 674869 DRWN: NARENC CHK'D: TKON APPR: SHOSHIKAWA INITIAL REVISION: DRWN: MNIITA APPR: SHOSHIKAWA THIRD ANGLE PROJECTION 2021/08/23 2021/08/23 2021/08/23 PRODUCT CUSTOMER DRAWING DOC TYPE DOC PART REVISION DOCUMENT NUMBER 2010/08/23 2010/08/27 DRAWING SERIES A3-SIZE 503300 3 SD-503300-001 MATERIAL NUMBER CUSTOMER SEE SHEET 1 2 GENERAL PSD 001 E SHEET NUMBER 2 OF 2 1 A