10
9
7
8
5
6
4
3
2
1
2
(FPC挿入深さ)
(INSERTION DEPTH OF FPC)
F
A
注記 NOTES
1. 使用材料 MATERIALS
ハウジング :液晶ポリマー(LCP)、ガラス充填、UL94 V-0、
ナチュラル(白色系)
アクチュエータ :ポリアミド(PA)、ガラス充填,UL94、HB、黒色
奇数端子 :リン青銅 t=0.12mm
偶数端子 :リン青銅 t=0.12mm
HOUSING
:LIQUID CRYSTAL POLYMER(LCP)、
GLASS FILLED、UL94、V-0、NATURAL(WHITE)
ACTUATOR :POLYMIDE(PA)、GLASS FILLED、UL94、HB、
BLACK
ODD TERMINAL
:PHOSPHOR BRONZE t=0.12mm
EVEN TERMINAL
:PHOSPHOR BRONZE t=0.12mm
2.メッキ仕様 PLATING
端子 TERMINAL
テール部 :金メッキ
接点部 :金メッキ 0.1μm以上
下地
:ニッケルメッキ 1.0μm以上
TAIL AREA: Gold PLATING
CONTACT AREA : Gold PLATING 0.1μm MINIMUM
UNDER PLATING: Nickel PLATING 1.0μm MINIMUM
3.端子の平坦度は0.1mm以下とする
COPLANALITY OF SOLDER TAILS: 0.1mmMAX.
4.ELV及びRoHS適合品
0.7
X
(接点位置)
(CONTACT POSITION)
アクチュエータ
ACTUATOR
ハウジング
HOUSING
奇数極端子
ODD TERMINAL
SECTION X-X
1.4
E
(接点位置)
(CONTACT POSITION)
偶数極端子
EVEN TERMINAL
0.3
(接点ピッチ)
(PITCH OF
CONTACTS)
E
ELV AND RoHS COMPLIANT
SECTION Y-Y
Y
D
F
ISO VIEW (参考)
D
3.45
�1.65�
X
D
0.6
3.8
�0.35�
C
0.12 ±0.03
0.3
15.6
13.8
12.6
12.0
11.4
10.2
7.8
7.2
6.0
3.6
0.95 ±0.05
FPC
Y
B
18.6 17.4 18.0 19.4
ACTUATOR OPEN
X
�2�
ACTUATOR CLOSE
⌖ 0.15 X
(PITCH)
14.4
12.6
11.4
10.8
10.2
9.0
6.6
6.0
4.8
2.4
15.0
13.2
12.0
11.4
10.8
9.6
7.2
6.6
5.4
3.0
16.4
14.6
13.4
12.8
12.2
11.0
8.6
8.0
6.8
4.4
B
A
(テール間)
0.4
3.4
0.4
D
C
DOCUMENT STATUS
FORMAT: master-tb-prod-A3
REVISION: J
DATE: 2020/01/14
P1
RELEASE DATE
9
2020/10/14
A
ORDER NO. オーダー番号
51
45
41
39
37
33
25
23
19
11
C
B
CIRCUITS
CONNECTOR SERIES NO. 504740-**09
DIMENSION UNITS
SCALE
mm
10:1
CURRENT REV DESC:
GENERAL TOLERANCES
(UNLESS SPECIFIED)
0.12 ±0.03
⌖ 0.15 X
7
ANGULAR TOL
±
1.0 °
4 PLACES
±
0.03
3 PLACES
±
0.03
2 PLACES
±
0.05
1 PLACE
±
0.1
0 PLACES
±
0.2
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
11:49:44
8
B
61
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
0.6
(PITCH)
C
504740-6100
504740-5100
504740-4500
504740-4100
504740-3900
504740-3700
504740-3300
504740-2500
504740-2300
504740-1900
504740-1100
EMBOSSED TAPE
6
5
4
EC NO: 646888
DRWN: TNAKAGAWA01
CHK'D: YMATSUMOTO
APPR: SHOSHIKAWA
INITIAL REVISION:
DRWN: SHIRATA
APPR: KMORIKAWA
THIRD ANGLE PROJECTION
DRAWING
0.3 FPC CONN. BF H=0.95 HOUSING ASSY
2020/10/08
2020/10/14
2020/10/14
PRODUCT CUSTOMER DRAWING
DOC TYPE DOC PART REVISION
DOCUMENT NUMBER
2015/03/03
2016/08/02
SERIES
5047401000
MATERIAL NUMBER
CUSTOMER
A3-SIZE 504740
3
GENERAL
2
PSD 000
C
SHEET NUMBER
1 OF 2
1
A
9
7
8
5
6
4
3
(N+1)×0.3 ±0.05
(N-1)×0.3 ±0.03
0.6 ±0.02
0.3 ±0.02
0.3 ±0.03
0.3 ±0.05
�0.25�
0.9 ±0.1
0.25 ±0.15
仕上がり厚さ
THICHKNESS
(N-3)×0.3 ±0.05
1.7 ±0.15
1.15 ±0.1
2.4 ±0.3
0.2 ±0.03
�0.25�
F
1.95 ±0.15
0.3 ±0.07
2
0.3 ±0.07
F
2-R0.3MAX.
0.1MAX.
0.6 ±0.05
SOFT NICKEL UNDER(1-5μm)
PLATING:GOLD(0.1μmMIN.)
0.1 ±0.02
0.6 ±0.02
(N-3)×0.3 ±0.03
0.6 ±0.07
D
適合FPC推奨寸法
(PITCH)
(仕上がり厚さ:0.20±0.03)
APPLY FPC RECOMMENDED DIM.
(THICHKNESS:0.20±0.03)
COVER FILM:POLYMIDE(25μm)
カバーレイ:ポリイミド(25μm)
THERMOSETTING ADHESIVE
熱硬化接着剤
導体部:銅箔(35μm)
COPPER FOIL(35μm)
THERMOSETTING ADHESIVE
熱硬化接着剤
BASE FILM:POLYMIDE(25μm)
推奨開口率 : 80%
APERTURE RATE : 80%
THERMOSETTING ADHESIVE
推奨メタルマスク厚さ:0.1mm
RECOMMENDED METAL MASK THICKNESS:0.1mm
ベースフィルム:ポリイミド(25μm)
DIM.(REF)
REINFORCE BOARD:POLYMIDE
参照基板レイアウト(マウント面)
P.W.BOARD PATTERN
熱硬化接着剤
(N-1)×0.3 ±0.05
C
0.2 ±0.02
0.3 ±0.03
0.24 ±0.03
0.6 ±0.05
E
0.1MAX.
0.6 ±0.07
補強板:ポリイミド
0.65 ±0.05
3.7 ±0.05
POSITION
下地ソフトニッケル(1-5μm)
めっき:金めっき(0.1μm以上)
�0.1�
0.24 ±0.03
コネクタ位置
CONNCTOR
D
3.9 ±0.5
0.65 ±0.05
(PITCH)
E
1
補強板
(STIFFENER BOARD)
10
FPCについて (ABOUT FPC)
抜き方向は、導体側から補強版側を推奨致します。
補強板材質はポリイミド、接着剤は熱硬化接着剤を推奨します。
尚、接着剤の接点部への付着は導通不良の原因になりますので、染み出しが無い様、お願い致します。
RECOMMENDED PUNCHER DIRECTION:
FROM CONDUCTOR SIDE TO STIFFENER BOARD SIDE.
RECOMMENDED MATERIAL:
STIFFENER BOARD: POLYIMIDE
BONDING AGENT: THERMOSETTING AGENT
PLEASE PUT APPROPRIATE AMOUNT OF ADHESIVE ON ADHEREND
BECAUSE THERE IS A POSSIBILITY THAT
FPC構成推奨仕様
STRUCTURE OF FPC
C
THE EXTRA ADHESIVE CAUSES THE DEFECT IN ELECTRICAL CONTINUITY.
※1 補強板の長さが図面通りに確保できない場合は、カバーレイと
補強板のオーバーラップ寸法を0.5mm以上としてください。
WHEN STIFFNER BOARD DIMENSION CAN NOT SECURE
AS DRAWING, PLEASE GIVE THE OVERLAP SIZE OF
COVER FILM AND STIFFNER BOARD AS 0.5mm MINIMUM.
B
B
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
DIMENSION UNITS
SCALE
mm
1:1
CURRENT REV DESC:
GENERAL TOLERANCES
(UNLESS SPECIFIED)
A
tb_frame_A3_J_AM_S
Rev H 2014/11/25
DOCUMENT STATUS
FORMAT: master-tb-prod-A3
REVISION: J
DATE: 2020/01/14
P1
RELEASE DATE
9
2020/10/14
±
1.0 °
4 PLACES
±
0.03
3 PLACES
±
0.03
2 PLACES
±
0.05
1 PLACE
±
0.1
0 PLACES
±
0.2
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
11:49:44
8
ANGULAR TOL
7
6
5
4
EC NO: 646888
DRWN: TNAKAGAWA01
CHK'D: YMATSUMOTO
APPR: SHOSHIKAWA
INITIAL REVISION:
DRWN: SHIRATA
APPR: KMORIKAWA
THIRD ANGLE PROJECTION
DRAWING
0.3 FPC CONN. BF H=0.95 HOUSING ASSY
2020/10/08
2020/10/14
2020/10/14
PRODUCT CUSTOMER DRAWING
DOC TYPE DOC PART REVISION
DOCUMENT NUMBER
2015/03/03
2016/08/02
SERIES
5047401000
MATERIAL NUMBER
CUSTOMER
A3-SIZE 504740
3
GENERAL
2
PSD 000
C
SHEET NUMBER
2 OF 2
1
A
10
9
7
8
5
6
4
3
2
1
F
F
NOTES
1. 製品詳細寸法については、図面 5047401000をご参照下さい。
REEL
REFER TO THE 5047401000 ABOUT DIMENSIONS IN DETAIL.
2.
梱包数量 :5000 個/リ-ル
3.
リ-ドテ-プ長さ
NUMBER OF CONNECTORS : 5000 PCS/REEL
引き出し方向
LEAD TAPE LENGTH
トップテ-プ未接着部
(⌀380)
PULL OUT
DIRECTION
E
TOP TAPE NON-BONDED PART
トップテ-プ接着部
100MIN. TOP TAPE BONDED PART
25±10
(空きエンボス)
E
(EMPTY)
引き出し方向
トップテ-プ
PULL OUT DIRECTION
リ-ダ-部
部品挿入部
末端部(空部)
TOP TAPE LEADER PART
COMPONENT
SUPPLIER
TAIL PART
(EMPTY)
400MIN.
25
160MIN
に準拠
トップテ-プの剥離強度については、IEC60286-3
4.
TOP TAPE PEEL FORCE IS DEFINED BY IEC60286-3.
A±1
B±1
5.
材料
キャリアテープ :ポリスチレン(PS)
トップテープ :PET, OTHER
D
D
リール :ポリスチレン(PS)
MATERIAL
CARRIER TAPE :POLYSTYRENE(PS)
:PET, OTHER
TOP TAPE
;POLYSTYRENE(PS)
REEL
32幅テープ
32 WIDTH TAPE
24幅テープ
TOP TAPE
(32)
(28.4)
16 WIDTH TAPE
(24)
16幅テープ
32
37.4 33.4
24
29.4 25.4
16
21.4 17.4
(16)
CONNECTOR
C
24 WIDTH TAPE
CONNECTOR
EMBOSSED TAPE
(2)
4±0.1
8±0.1
引き出し方向
PULL OUT DIRECTION
B
テープ幅
TAPE WIDTH
エンボステ-プ内の製品の向き
B
A
B
CIRCUIT
オーダー番号 ORDER NO.
CONNECTOR SERIES NO.
504740-**09
DIRECTION OF CONNECTOR IN
EMBOSSED TAPE
C
61
51
45
41
39
37
33
25
23
19
11
504740-6100
504740-5100
504740-4500
504740-4100
504740-3900
504740-3700
504740-3300
504740-2500
504740-2300
504740-1900
504740-1100
EMBOSSED PACKAGE
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
DIMENSION UNITS
SCALE
mm
1:1
CURRENT REV DESC:
GENERAL TOLERANCES
(UNLESS SPECIFIED)
A
DOCUMENT STATUS
FORMAT: master-tb-prod-A3
REVISION: J1
DATE: 2021/05/01
P1
RELEASE DATE
9
2022/01/20
±
1.0 °
4 PLACES
±
0.2
3 PLACES
±
0.25
2 PLACES
±
0.3
1 PLACE
±
0 PLACES
±
0.1
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
04:08:20
8
ANGULAR TOL
7
6
5
4
0.3 FPC CONN. BACK FLIP
HGT=0.95MM EMBSTP PKG
EC NO: 692510
DRWN: NARENC
CHK'D: TKON
APPR: SHOSHIKAWA
INITIAL REVISION:
DRWN: TONO
APPR: YNOGAWA
THIRD ANGLE PROJECTION
2022/01/17
2022/01/19
2022/01/20
PRODUCT CUSTOMER DRAWING
DOC TYPE DOC PART REVISION
DOCUMENT NUMBER
2013/12/03
2014/03/05
DRAWING
SERIES
A3-SIZE 504740
3
SD-504740-002
MATERIAL NUMBER
PSD 001
CUSTOMER
GENERAL MARKET
SEE TABLE
2
C
SHEET NUMBER
1 OF 1
1
A
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