52271-1279

厂商：
MOLEX10(莫仕)
封装：
SMD
描述：
52271-1279

数据手册：

下载52271-1279.pdf

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数据手册
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52271-1279 数据手册

10 9 7 8 5 6 4 3 2 1 F F 　　　　 E 1.10 E ５２２７１－＊＊９０ 4.30 (アクチュエータが開口した状態) 8 テール及び金具の平坦度は、0.15以下とする。 D TAIL AND NAIL COPLANARITY TO BE 0.15 MAXIMUM. 3 ±0.2 D THIS PRODUCT IS LEAD FREE OF 52271-**90 2.90 8 C B 35 34 33 32 31 30 29.0 28.0 27.0 26.0 25.0 24.0 23.0 22.0 21.0 20.0 19.0 18.0 17.0 16.0 15.0 14.0 13.0 12.0 11.0 10.0 9.00 31.2 30.2 29.2 28.2 27.2 26.2 25.2 24.2 23.2 22.2 21.2 20.2 19.2 18.2 17.2 16.2 15.2 14.2 13.2 12.2 11.2 10.2 9.2 8.2 7.2 6.2 5.2 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 C B A 52271-3079 52271-2979 52271-2879 52271-2779 52271-2679 52271-2579 52271-2479 52271-2379 52271-2279 52271-2179 52271-2079 52271-1979 52271-1879 52271-1779 52271-1679 52271-1579 52271-1479 52271-1379 52271-1279 52271-1179 52271-1079 52271-0979 52271-0879 52271-0779 52271-0679 52271-0579 52271-0479 EMBOSSED PACKAGE Order No. 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 C B CKT No. THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DIMENSION UNITS SCALE mm 8:1 CURRENT REV DESC: GENERAL TOLERANCES (UNLESS SPECIFIED) A DOCUMENT STATUS FORMAT: master-tb-prod-A3 REVISION: J DATE: 2020/01/14 P1 RELEASE DATE 9 2021/08/03 ± 3.0 ° 4 PLACES ± 0.2 3 PLACES ± 0.2 2 PLACES ± 0.2 1 PLACE ± 0.25 0 PLACES ± 0.3 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 12:33:51 8 ANGULAR TOL 7 6 5 4 1.0 FPC CONN ZIF SMT (BOTTOM CONTACT) -LEAD FREE- EC NO: 672151 DRWN: DGONDO CHK'D: TKON APPR: SHOSHIKAWA INITIAL REVISION: DRWN: HKAWABATA APPR: MSASAO THIRD ANGLE PROJECTION 2021/08/02 2021/08/03 2021/08/03 PRODUCT CUSTOMER DRAWING DOC TYPE DOC PART REVISION DOCUMENT NUMBER 2004/03/18 2004/03/19 DRAWING SERIES A3-SIZE 52271 3 SD-52271-036 MATERIAL NUMBER PSD 001 CUSTOMER GENERAL MARKET SEE TABLE 2 F SHEET NUMBER 1 OF 2 1 A 10 9 7 8 6 F 5 4 3 2 0.3 ±0.05 0.3 ±0.05 仕上がり厚さ THICKNESS 仕上がり厚さ THICKNESS 1 F めっき：錫めっき(0.5-1.2μm)　　下地ニッケル(1-5μm) PLATING: TIN(0.5-1.2μm)　　　　 NICKEL UNDER(1-5μm) めっき：錫めっき(0.5-1.2μm)　　下地ニッケル(1-5μm) PLATING: TIN(0.5-1.2μm)　　　　 NICKEL UNDER(1-5μm) 3.60 2 - C0.30 E 適合FPC/FFC推奨寸法 APPLICABLE FPC/FFC RECOMMENDED DIMENSION E 接着剤(難燃ポリエステル系) ADHESIVE（FLAME-RETARDANT POLYESTER ADHESIVE) 絶縁テープ：ポリエステル系(25μm) INSULATING FILM: PET(25μm) RECOMMENDED STRUCTURE OF FFC RECOMMENDED STRUCTURE OF FPC FPC/FFCについて：　抜き方向は、導体側から補強板側を推奨致します。　尚、接着剤の接点部への付着は導通不良の原因になりますので、　染み出しが無い様お願い致します。 ABOUT FPC/FFC: RECOMMENDED PUNCHER DIRECTION: FROM CONDUCTOR SIDE TO STIFFNER SIDE PLEASE PUT APPROPRIATE AMOUNT OF ADHESIVE ON ADHEREND BECAUSE THERE IS A POSSIBILITY THAT THE EXTRA ADHESIVE　 CAUSES THE　DEFECT IN ELECTRICAL CONTINUITY. 2.10 4.20 B C FFC構成推奨仕様 FPC構成推奨仕様 2.10 接着剤(難燃ポリエステル系) ADHESIVE（FLAME-RETARDANT POLYESTER ADHESIVE) 導体部：　銅箔(35μm) COPPER FOIL (35μm) 補強板：ポリエステル系 REINFORCE BOARD: PET 接着剤(難燃ポリエステル系) ADHESIVE（FLAME-RETARDANT POLYESTER ADHESIVE) 絶縁テープ：ポリエステル系(25μm) INSULATING FILM: PET(25μm) 1.60 C カバーレイ　:　ポリイミド(25μm) COVER FILM: POLYIMIDE(25μm) 2.80 1.90 補強板：ポリイミド REINFORCE BOARD: POLYMIDE 熱硬化接着剤 THERMOSETTING ADHESIVE ベースフィルム：ポリイミド(25μm) BASE FILM: POLYIMIDE(25μm) 熱硬化接着剤 THERMOSETTING ADHESIVE 導体部：　銅箔(35μm) COPPER FOIL (35μm) 熱硬化接着剤 THERMOSETTING ADHESIVE D 0.60 D 4.20 SCALE 5:1 B THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DIMENSION UNITS SCALE mm 10:1 CURRENT REV DESC: GENERAL TOLERANCES (UNLESS SPECIFIED) A DOCUMENT STATUS FORMAT: master-tb-prod-A3 REVISION: J DATE: 2020/01/14 P1 RELEASE DATE 9 2021/08/03 ± 3.0 ° 4 PLACES ± 0.2 3 PLACES ± 0.2 2 PLACES ± 0.2 1 PLACE ± 0.25 0 PLACES ± 0.3 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 12:33:51 8 ANGULAR TOL 7 6 5 4 1.0 FPC CONN ZIF SMT (BOTTOM CONTACT) -LEAD FREE- EC NO: 672151 DRWN: DGONDO CHK'D: TKON APPR: SHOSHIKAWA INITIAL REVISION: DRWN: HKAWABATA APPR: MSASAO THIRD ANGLE PROJECTION 2021/08/02 2021/08/03 2021/08/03 PRODUCT CUSTOMER DRAWING DOC TYPE DOC PART REVISION DOCUMENT NUMBER 2004/03/18 2004/03/19 DRAWING SERIES A3-SIZE 52271 3 SD-52271-036 MATERIAL NUMBER PSD 001 CUSTOMER SEE SHEET 1 2 GENERAL MARKET F SHEET NUMBER 2 OF 2 1 A

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52271-1279

1. 物料型号：文档中提到了多个型号，例如52271-90、52271-19、52271-1179等。 2. 器件简介：文档中没有直接提供器件简介，但提到了产品是无铅的(LEAD FREE)，并且有提到FPC CONN ZIF SMT (BOTTOM CONTACT)，意味着这是一个FPC（Flexible Printed Circuit，柔性印刷电路）连接器，采用ZIF（Zero Insertion Force，零插入力）SMT（Surface Mount Technology，表面贴装技术）。 3. 引脚分配：文档中提到了引脚分配，但具体的引脚图或分配表没有直接提供。 4. 参数特性：文档中提到了一些参数，例如接触点的材料、镀层、尺寸公差等。例如，镀锡(0.5-1.2μm)、镍底层(1-5μm)、聚酯胶(25μm)等。 5. 功能详解：文档中没有提供详细的功能解释，但提到了产品是用于FPC/FFC（Flexible Flat Cable，柔性扁平电缆）的连接器。 6. 应用信息：文档中提到了产品适用于FPC/FFC，推荐了尺寸和结构，例如导体部使用铜箔(35μm)、补强板使用聚酰亚胺等。 7. 封装信息：文档中提到了封装相关的信息，如封装材料、尺寸等。

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