9
7
8
6
5
4
3
2
1
NOTES
1.使用材料
MATERIAL
ハウジング:ポリアミド(PA)、ナチュラル(白色)、ガラス充填、UL94V-0
HOUSING:POLYAMIDE NATURAL(WHITE)、GLASS FILLED,UL94V-0
アクチュエータ:ポリフェニレンサルファイド(PPS)、ナチュラル(茶色)、
ガラス充填、UL94V-0
ACTUATOR: PPS ,NATURAL(BROWN), GLASS FILLED, UL94V-0
ターミナル:リン青銅( t = 0.2)
TERMINAL:PHOSPHOR BRONZE( t = 0.2)
金具:リン青銅( t = 0.2)
FITTING NAIL: PHOSPHOR BRONZE( t = 0.2)
2.メッキ仕様 PLATING
ターミナル TERMINAL
錫銀ビスマスメッキ (1.0μm以上)
TIN SILVER BISMUTH PLATING (1.0 MICROMETER MINIMUM)
下地メッキ:ニッケルメッキ (1.0μm以上)
UNDER PLATING : NICKEL PLATING (1.0 MICROMETER MINIMUM)
金具 NAIL
錫メッキ (1.0μm以上)
TIN PLATING (1.0 MICROMETER MINIMUM)
下地メッキ:ニッケルメッキ (1.0μm以上)
UNDER PLATING : NICKEL PLATING (1.0 MICROMETER MINIMUM)
3.エンボステープ梱包時は、アクチュエータがロックした状態になります。
IN THE PACKAGE,ACTUATOR OF PART
NO.52437-**22 SHOULD BE LOCKED.
4. 偶数極に適用
APPLY FOR EVEN CIRCUIT.
5. パターン剥離止め金具
FITTING NAIL FOR PREVENTION OF PEELING OF P.W.B. PATTERN.
6. R0.3は、FPCの導体部にかからないこと
R0.3 MUST NOT BE OVERLAPED TO PATTERN OF FPC.
7.
ソルダーテール半田付け面のズレ量、及び金具半田付け面のズレ量は、
基準面 H に対して上方向に0.1MAXIMUM、下方向に0.15MAXIMUMとする。
MISALIGNMENT OF SOLDER TAILS AND FITTING NAILS FROM DATUM H.
UPPER DIRECTION : 0.1 MAXIMUM
LOWER DORECTION : 0.15MAXIMUM
8.ELV及びRoHS適合品
ELV AND RoHS COMPLIANT
E
0.5
0.25
D
C
B
7.
K
5
金具
FITTING NAIL
1.65
0.9
0.65
9
18.15
15.65
15.15
14.65
14.15
13.65
13.15
12.65
12.15
11.65
11.15
17.0
14.5
14.0
13.5
13.0
12.5
12.0
11.5
11.0
10.5
10.0
D
C
B
(A)
52437-3533
52437-3033
52437-2933
52437-2833
52437-2733
52437-2633
52437-2533
52437-2433
52437-2333
52437-2233
52437-2133
C
35
30
29
28
27
26
25
24
23
22
21
B
極数
EMBOSSED PACKAGE
CKT.
ORDER No. オーダー番号
CONNECTOR SERIES NO. : 52437-**22
VIEW K
0.7
0.63
(金具部投影図)
(DETAIL OF FITTING NAIL)
2.605
DOCUMENT STATUS
22.1
19.6
19.1
18.6
18.1
17.6
17.1
16.6
16.1
15.6
15.1
D
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
A
FORMAT: master-tb-prod-A3
REVISION: H
DATE: 2018/01/18
24.1
21.6
21.1
20.6
20.1
19.6
19.1
18.6
18.1
17.6
17.1
E
P1
RELEASE DATE
2018/03/14
8
07:58:48
7
6
5
GENERAL TOLERANCES
(UNLESS SPECIFIED)
10 UNDER
± 0.2
10 OVER 30 UNDER ± 0.25
± 0.3
30 OVER
ANGULAR ± 3 °
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
4
DIMENSION UNITS
SCALE
mm
10:1
GENERAL TOLERANCES
(UNLESS SPECIFIED)
ANGULAR TOL
±
3.0 °
4 PLACES
±
0.2
3 PLACES
±
0.25
2 PLACES
±
0.3
1 PLACE
±
0 PLACES
±
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
CURRENT REV DESC:
EC NO: 600082
DRWN: YCHEN128
CHK'D: KTAKAHASHI
APPR: NUKITA
INITIAL REVISION:
DRWN: KMIYAHARA
APPR: KMORIKAWA
THIRD ANGLE PROJECTION
3
2018/03/02
2018/03/14
2018/03/14
2012/09/05
2013/04/05
PRODUCT CUSTOMER DRAWING
SERIES
A3-SIZE
52437
2
DOC TYPE DOC PART REVISION
DOCUMENT NUMBER
SD-52437-023
MATERIAL NUMBER
DRAWING
A
0.5MM FPC CONN ZIF R/A
HOUSING ASSY (LOWER CONTACT)
SEE TABLE
PSD 001
A
SHEET NUMBER
CUSTOMER
GENERAL MARKET
1
1 OF 2
7
8
5
6
4
3
2
0.3 ±0.05
0.3 ±0.05
仕上がり厚さ
THICKNESS
0.5(N+1)±0.07
THICKNESS: 0.3+0.05/-0.05
KEEPING OUT AREA OF
PATTERN AND SOLDERING
±0.05
0.5(N-1)
3.65
(0.3)
(ピッチ)
0.5±0.05 (PITCH)
(公差非累積)
0.8
0.55MAX.
C
1.85MIN.
3.65
2.2
0.45MAX.
金具パターンエリア
M
SOLDERING AREA
OF FITTING NAIL
B
(0.3)
(0.3)
3.05
(NON-ACCUMULATIVE)
DETAIL L
CONNECTOR
POSITION
PATTERN
マスク厚 : 100μm
マスク開口率 : 100%
SCREEN THICKNESS : 100μm
SCREEN OPEN RATIO : 100%
(FROM PATTERN EDGE)
A
1.1
B
1.25
FPC/FFCについて ABOUT FPC/FFC
打ち抜き方向は導体側から補強板側を推奨します。
接着剤の接点部への付着は導通不良の原因になりますので、染み出しが無い様、お願い致します。
推奨基板レイアウト
RECOMMENDED
PUNCHING DIRECTION: FROM CONDUCTOR SIDE TO STIFFENER SIDE
(マウンド面)
PLEASE
PUT
APPROPRIATE
AMOUNT OF ADHESIVE ON ADHEREND BECAUSE
RECOMMENDED P.C.BOARD
THERE IS A POSSIBILITY THAT THE EXTRA ADHESIVE CAUSES THE DEFECT IN
PATTERN DIMENSION
ELECTRICAL CONTINUITY.
(MOUNTING SIDE)
1.25
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
R0.3
(0.605)
BOARD
VIEW M
(DETAIL OF FITTING NAIL
ON PATTERN)
DOCUMENT STATUS
FORMAT: master-tb-prod-A3
REVISION: H
DATE: 2018/01/18
9
P1
RELEASE DATE
2018/03/14
8
07:58:48
C
FFC構成推奨仕様
STRUCTURE OF FFC
FPC構成推奨仕様
STRUCTURE OF FPC
L
コネクタ位置
補強板:ポリイミド
REINFORCE BOARD: POLYMIDE
熱硬化接着剤
THERMOSETTING ADHESIVE
ベースフィルム:ポリイミド(25μm)
BASE FILM: POLYIMIDE(25μm)
熱硬化接着剤
THERMOSETTING ADHESIVE
導体部: 銅箔(35 か 50μm)
COPPER FOIL (35 or 50μm)
熱硬化接着剤
THERMOSETTING ADHESIVE
仕上がり厚さ:0.3±0.05
(0.2)
仕上がり厚さ:0.3±0.05
めっき:錫めっき(0.5~1.2μm)
下地ニッケル(1-5μm)
PLATING: TIN(0.5~1.2μm)
NICKEL UNDER(1-5μm)
THICKNESS: 0.3+0.05/-0.05
D
接着剤(難燃ポリエステル系)
ADHESIVE(FLAME-RETARDANT
POLYESTER ADHESIVE)
絶縁テープ:ポリエステル系(25μm)
INSULATING FILM: PET(25μm)
適合FFC推奨寸法
APPLICABLE FFC
PLATING RECOMMENDED DIMENSION
補強板:ポリエステル系
REINFORCE BOARD: PET
接着剤(難燃ポリエステル系)
ADHESIVE(FLAME-RETARDANT
POLYESTER ADHESIVE)
絶縁テープ:ポリエステル系(25μm)
INSULATING FILM: PET(25μm)
適合FPC推奨寸法
APPLICABLE FPC
PLATING RECOMMENDED DIMENSION
パターンおよび
半田禁止エリア
めっき:錫めっき(0.5~1.2μm)
下地ニッケル(1-5μm)
PLATING: TIN(0.5~1.2μm)
NICKEL UNDER(1-5μm)
6±0.5
4±0.5
6±0.5
4±0.5
D
0.3±0.03
(PITCH)
6
補強板
(STIFFENER BOARD)
R0.3
0.5±0.05
E
0.5±0.08
カバーレイ : ポリイミド(25μm)
COVER FILM: POLYIMIDE(25μm)
0.35+0.04
-0.03
(PITCH)
0.5(N-1)±0.05
0.5±0.08
補強板
(STIFFENER BOARD)
0.5±0.05
仕上がり厚さ
THICKNESS
0.5(N+1)±0.07
0.5±0.1
(0.3)
0.5(N-1)±0.05
0.5±0.1
E
1
接着剤(難燃ポリエステル系)
ADHESIVE(FLAME-RETARDANT
POLYESTER ADHESIVE)
導体部: 銅箔(35μmか50μm)
COPPER FOIL (35μm or 50μm)
9
7
6
5
GENERAL TOLERANCES
(UNLESS SPECIFIED)
10 UNDER
± 0.2
10 OVER 30 UNDER ± 0.25
± 0.3
30 OVER
ANGULAR ± 3 °
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
4
DIMENSION UNITS
SCALE
mm
5:1
GENERAL TOLERANCES
(UNLESS SPECIFIED)
ANGULAR TOL
±
3.0 °
4 PLACES
±
0.2
3 PLACES
±
0.25
2 PLACES
±
0.3
1 PLACE
±
0 PLACES
±
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
CURRENT REV DESC:
EC NO: 600082
DRWN: YCHEN128
CHK'D: KTAKAHASHI
APPR: NUKITA
INITIAL REVISION:
DRWN: KMIYAHARA
APPR: KMORIKAWA
THIRD ANGLE PROJECTION
3
2018/03/02
2018/03/14
2018/03/14
2012/09/05
2013/04/05
PRODUCT CUSTOMER DRAWING
SERIES
A3-SIZE
52437
2
DOC TYPE DOC PART REVISION
DOCUMENT NUMBER
SD-52437-023
MATERIAL NUMBER
DRAWING
A
0.5MM FPC CONN ZIF R/A
HOUSING ASSY (LOWER CONTACT)
SEE TABLE
PSD 001
A
SHEET NUMBER
CUSTOMER
GENERAL MARKET
1
2 OF 2
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