52745-2097

10 9 7 8 6 5 0.5±0.1 3 0.5+0.1 0 D C 接点部(上面) K CONTACT POINT (UPPER SIDE) 5 B 金具 FITTING NAIL 0.85 1.28 DOCUMENT STATUS 10 16.1 15.6 15.1 14.6 14.1 13.6 13.1 12.6 12.1 11.6 11.1 10.6 10.1 9.6 9.1 8.1 14.3 13.8 13.3 12.8 12.3 11.8 11.3 10.8 10.3 9.8 9.3 8.8 8.3 7.8 7.3 6.3 10.65 10.15 9.65 9.15 8.65 8.15 7.65 7.15 6.65 6.15 5.65 5.15 4.65 4.15 3.65 2.65 9.5 9 8.5 8 7.5 7 6.5 6 5.5 5 4.5 4 3.5 3 2.5 1.5 D C B (A) 52745-2097 52745-1997 52745-1897 52745-1797 52745-1697 52745-1597 52745-1497 52745-1397 52745-1297 52745-1197 52745-1097 52745-0997 52745-0897 52745-0797 52745-0697 52745-0497 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 4 極数 EMBOSSED PACKAGE ORDER No. オーダー番号 F E E D C C B CKT. CONNECTOR SERIES NO. : 52745-**59 VIEW K 0.74 0.66 (金具部投影図) 2.455 FORMAT: master-tb-prod-A3 REVISION: H DATE: 2018/01/18 1 THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION 1.02 A 2 注記NOTES 　1.使用材料 MATERIAL ハウジング：46ナイロン、ガラス充填、UL94V-0、白 HOUSING:PA46,GLASS FILLED,UL94V-0,WHITE アクチュエータ：ポリフェニレンサルファイド（PPS）、 ガラス充填、UL94V-0、黒 ACTUATOR:POLYPHENYLENE SULFIDE,GLASS FILLED,UL94V-0,BLACK ターミナル：リン青銅、ニッケル下地金めっき（t=0.2） TERMINAL:PHOSPHOR BRONZE,GOLD OVER NICKEL PLATING 金具：リン青銅、ニッケル下地錫めっき（t=0.2） FITTING NAIL: PHOSPHOR BRONZE,TIN OVER NICKEL PLATING 　2.エンボステープ梱包時は、アクチュエータがロックした状態になります。 IN THE PACKAGE,ACTUATOR OF PART NO.52745-**59 SHOULD BE LOCKED. 3 ソルダーテール半田付け面のズレ量、及び金具半田付け面のズレ量は、 基準面Hに対して上方向に0.1MAXIMUM、下方向0.15MAXIMUMとする。 MISALIGNMENT OF SOLDER TAILS AND FITTING NAILS FROM DATUM-H. UPPER DIRECTON:0.1MAXIMUM LOWER DIRECTION:0.15 MAXIMUM 4 偶数極に適用 APPLY FOR EVEN CIRCUIT. 5 パターン剥離止め金具 FITTING NAIL FOR PREVENTION OF PEELING OF P.W.B. PATTERN. 6 R0.3は、FPCの胴体部にかからないこと R0.3 MUST NOT BE OVERLAPED TO PATTERN OF FPC. 7.ELV 及び RoHS 適合品 ELV AND RoHS COMPLIANT F E 4 P1 RELEASE DATE 9 (DETAIL OF FITTING NAIL) 2018/03/14 07:58:49 8 7 6 GENERAL TOLERANCES (UNLESS SPECIFIED) 10 UNDER ±　0.2 10 OVER 30 UNDER ±　0.25 ±　0.3 30 OVER ANGULAR 　　±　3　° DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 5 DIMENSION UNITS SCALE mm 10:1 GENERAL TOLERANCES (UNLESS SPECIFIED) ANGULAR TOL ± 3.0 ° 4 PLACES ± 0.2 3 PLACES ± 0.25 2 PLACES ± 0.3 1 PLACE ± 0 PLACES ± DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 4 CURRENT REV DESC: EC NO: 600082 DRWN: YCHEN128 CHK'D: KTAKAHASHI APPR: NUKITA INITIAL REVISION: DRWN: KTOJO APPR: NUKITA THIRD ANGLE PROJECTION 2018/02/27 2018/03/14 2018/03/14 2005/02/23 2005/03/16 DRAWING SERIES A3-SIZE 52745 3 0.5 FPC CONN. ZIF FOR SMT R/A (UPPER CONTACT) GOLD PLATING PRODUCT CUSTOMER DRAWING DOC TYPE DOC PART REVISION DOCUMENT NUMBER SD-52745-050 MATERIAL NUMBER PSD 001 CUSTOMER GENERAL MARKET SEE TABLE 2 D SHEET NUMBER 1 OF 2 1 A 7 8 5 6 4 3 2 0.3 ±0.03 0.3 ±0.03 仕上がり厚さ THICKNESS 0.5(N+1)±0.07 0.5(N+1)±0.07 0.5±0.05 適合金めっきFPC推奨寸法 適合金めっきFFC推奨寸法 　　　APPLICABLE FPC OF GOLD PLATING RECOMMENDED DIMENSION 　　　APPLICABLE FFC OF GOLD PLATING RECOMMENDED DIMENSION THICKNESS: 0.3+0.03/-0.03 THICKNESS: 0.3+0.03/-0.03 0.5(N-1)±0.05 0.5±0.05 0.8 (0.3) (PITCH) (NON-ACCUMULATIVE) B コネクタ位置 M CONNECTOR POSITION DETAIL L 1.25 1.25 (0.2) SOLDERING AREA OF FITTING NAIL L (0.3) 金具パターンエリア (0.3) 2.2 KEEPING OUT AREA OF PATTERN AND SOLDERING (0.3) 1.94MIN. 0.6MAX. パターンおよび 半田禁止エリア C 3.65 1.1 3.05 3.65 0.45MAX. カバーレイ　:　ポリイミド(25μm) COVER FILM: POLYIMIDE(25μm) 仕上がり厚さ：0.3±0.03 補強板：ポリイミド REINFORCE BOARD: POLYMIDE 熱硬化接着剤 THERMOSETTING ADHESIVE ベースフィルム：ポリイミド(25μm) BASE FILM: POLYIMIDE(25μm) 熱硬化接着剤 THERMOSETTING ADHESIVE 導体部：　銅箔(35μm) COPPER FOIL (35μm) 熱硬化接着剤 THERMOSETTING ADHESIVE 仕上がり厚さ：0.3±0.03 めっき：金めっき(0.２μm)　 　下地ニッケル(1-5μm) PLATING: GOLD(0.2μm)　 　　　 NICKEL UNDER(1-5μm) 6±0.5 4±0.5 補強板 (STIFFENER BOARD) 4±0.5 D 0.3±0.03 (PITCH) 6 D 導体部：　銅箔(35μm) COPPER FOIL (35μm) 接着剤(難燃ポリエステル系) ADHESIVE（FLAME-RETARDANT POLYESTER ADHESIVE) 絶縁テープ：ポリエステル系(25μm) INSULATING FILM: PET(25μm) R0.3 0.5±0.08 めっき：金めっき(0.２μm)　 　下地ニッケル(1-5μm) PLATING: GOLD(0.2μm)　 　　　 NICKEL UNDER(1-5μm) 0.35 (PITCH) 0.5(N-1)±0.05 0.5±0.08 +0.04 -0.03 E 補強板：ポリエステル系 REINFORCE BOARD: PET 接着剤(難燃ポリエステル系) ADHESIVE（FLAME-RETARDANT POLYESTER ADHESIVE) 絶縁テープ：ポリエステル系(25μm) INSULATING FILM: PET(25μm) 0.5±0.1 補強板 (STIFFENER BOARD) 0.5±0.05 仕上がり厚さ THICKNESS 6±0.5 0.5(N-1)±0.05 0.5±0.1 E 1 接着剤(難燃ポリエステル系) ADHESIVE（FLAME-RETARDANT POLYESTER ADHESIVE) 9 C FFC構成推奨仕様 STRUCTURE OF FFC FPC構成推奨仕様 STRUCTURE OF FPC B 参考基板レイアウト (マウント面) RECOMMENDED P.C.BOARD PATTERN DIMENSION(REF.) (MOUNTING SIDE) PATTERN THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION R0.303 BOARD (0.605) (FROM PATTERN EDGE) A VIEW M (DETAIL OF FITTING NAIL ON PATTERN) DOCUMENT STATUS FORMAT: master-tb-prod-A3 REVISION: H DATE: 2018/01/18 9 P1 RELEASE DATE 2018/03/14 8 07:58:49 7 6 5 GENERAL TOLERANCES (UNLESS SPECIFIED) ±　--10 UNDER 10 OVER 30 UNDER ±　--±　--30 OVER ANGULAR 　　±　---　° DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 4 DIMENSION UNITS SCALE mm 5:1 GENERAL TOLERANCES (UNLESS SPECIFIED) ANGULAR TOL ± 3.0 ° 4 PLACES ± 0.2 3 PLACES ± 0.25 2 PLACES ± 0.3 1 PLACE ± 0 PLACES ± DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS CURRENT REV DESC: EC NO: 600082 DRWN: YCHEN128 CHK'D: KTAKAHASHI APPR: NUKITA INITIAL REVISION: DRWN: KTOJO APPR: NUKITA THIRD ANGLE PROJECTION 3 2018/02/27 2018/03/14 2018/03/14 2005/02/23 2005/03/16 PRODUCT CUSTOMER DRAWING SERIES A3-SIZE 52745 2 DOC TYPE DOC PART REVISION DOCUMENT NUMBER SD-52745-050 MATERIAL NUMBER DRAWING A 0.5 FPC CONN. ZIF FOR SMT R/A (UPPER CONTACT) GOLD PLATING SEE TABLE PSD 001 D SHEET NUMBER CUSTOMER GENERAL MARKET 1 2 OF 2