52746-0871

10 9 7 8 6 5 4 0.25 E D C K 5 金具 FITTING NAIL 0.85 1.28 B 2 1 注記NOTES 　1.使用材料 F MATERIAL ハウジング：46ナイロン、ガラス充填、UL94V-0、白 HOUSING:PA46,GLASS FILLED,UL94V-0,WHITE アクチュエータ：ポリフェニレンサルファイド（PPS）、ガラス充填、 UL94V-0、茶色 ACTUATOR:POLYPHENYLENE SULFIDE,GLASS FILLED, UL94V-0,BROWN ターミナル：リン青銅、ニッケル下地金めっき（t=0.2） TERMINAL:PHOSPHOR BRONZE,GOLD OVER NICKEL PLATING 金具：リン青銅、ニッケル下地錫めっき（t=0.2） FITTING NAIL: PHOSPHOR BRONZE,TIN OVER NICKEL PLATING 　2.エンボステープ梱包時は、アクチュエータがロックした状態になります。 E IN THE PACKAGE,ACTUATOR OF PART NO.52746-**39 SHOULD BE LOCKED. 3 ソルダーテール半田付け面のズレ量、及び金具半田付け面のズレ量は、 基準面Hに対して上方向に0.1MAXIMUM、下方向0.15MAXIMUMとする。 MISALIGNMENT OF SOLDER TAILS AND FITTING NAILS FROM DATUM-H. UPPER DIRECTON:0.1MAXIMUM LOWER DIRECTION:0.15 MAXIMUM 4 偶数極に適用 APPLY FOR EVEN CIRCUIT. ﾊﾟﾀｰﾝ剥離止め金具 5 D FITTING NAIL FOR PREVENTION OF PEELING OF P.W.B. PATTERN. R0.3は、FPCの導体部にかからないこと 6 R0.3 MUST NOT BE OVERLAPED TO PATTERN OF FPC. 7.ELV 及び RoHS 適合品 ELV AND RoHS COMPLIANT F 0.5 3 16.1 15.6 15.1 14.6 14.1 13.6 13.1 12.6 12.1 11.6 11.1 10.6 10.1 9.6 9.1 8.1 14.3 13.8 13.3 12.8 12.3 11.8 11.3 10.8 10.3 9.8 9.3 8.8 8.3 7.8 7.3 6.3 10.65 10.15 9.65 9.15 8.65 8.15 7.65 7.15 6.65 6.15 5.65 5.15 4.65 4.15 3.65 2.65 9.5 9 8.5 8 7.5 7 6.5 6 5.5 5 4.5 4 3.5 3 2.5 1.5 D C B (A) 52746-2071 52746-1971 52746-1871 52746-1771 52746-1671 52746-1571 52746-1471 52746-1371 52746-1271 52746-1171 52746-1071 52746-0971 52746-0871 52746-0771 52746-0671 52746-0471 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 4 極数 EMBOSSED PACKAGE ORDER No. オーダー番号 C B CKT. CONNECTOR SERIES NO. : 52746-**39 A 0.66 0.74 1.02 THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION 2.455 VIEW K (金具部投影図) (DETAIL OF FITTING NAIL) DOCUMENT STATUS 10 FORMAT: master-tb-prod-A3 REVISION: H DATE: 2018/01/18 P1 RELEASE DATE 9 2018/03/14 07:58:50 8 7 6 GENERAL TOLERANCES (UNLESS SPECIFIED) 10 UNDER ±　0.2 10 OVER 30 UNDER ±　0.25 ±　0.3 30 OVER ANGULAR 　　±　3　° DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 5 DIMENSION UNITS SCALE mm 10:1 GENERAL TOLERANCES (UNLESS SPECIFIED) ANGULAR TOL ± 3.0 ° 4 PLACES ± 0.2 3 PLACES ± 0.25 2 PLACES ± 0.3 1 PLACE ± 0 PLACES ± DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 4 CURRENT REV DESC: EC NO: 600082 DRWN: YCHEN128 CHK'D: KTAKAHASHI APPR: NUKITA INITIAL REVISION: DRWN: HSHIMABUKURO APPR: MSASAO THIRD ANGLE PROJECTION 2018/02/27 2018/03/14 2018/03/14 2004/02/05 2004/02/06 DRAWING SERIES A3-SIZE 52746 3 0.5 FPC CONN. ZIF FOR SMT R/A (BOTTOM CONTACT) GOLD PLATING PRODUCT CUSTOMER DRAWING DOC TYPE DOC PART REVISION DOCUMENT NUMBER SD-52746-025 MATERIAL NUMBER PSD 001 CUSTOMER GENERAL MARKET SEE TABLE 2 K SHEET NUMBER 1 OF 2 1 A 7 8 5 6 4 3 2 0.3 ±0.03 0.3 ±0.03 仕上がり厚さ THICKNESS 0.5(N+1)±0.07 　　　APPLICABLE FPC OF GOLD PLATING RECOMMENDED DIMENSION 　　　APPLICABLE FFC OF GOLD PLATING RECOMMENDED DIMENSION THICKNESS: 0.3+0.03/-0.03 THICKNESS: 0.3+0.03/-0.03 仕上がり厚さ：0.3±0.03 仕上がり厚さ：0.3±0.03 0.5(N-1)±0.05 3.65 0.5±0.05 (0.3) (PITCH) (NON-ACCUMULATIVE) 2.2 KEEPING OUT AREA OF PATTERN AND SOLDERING (0.3) 0.6MAX. パターンおよび 半田禁止エリア 1.94MIN. 3.65 0.8 0.45MAX. (0.3) M L コネクタ位置 DETAIL L 1.25 CONNECTOR POSITION 1.25 1.1 FPCについて 打ち抜き方向は導体側から補強板を推奨いたします。 補強フィルム材質はポリイミドを推奨いたします。 参考基板レイアウト (マウント面) B R0.303 BOARD (0.605) VIEW M (DETAIL OF FITTING NAIL ON PATTERN) DOCUMENT STATUS 10 FORMAT: master-tb-prod-A3 REVISION: H DATE: 2018/01/18 P1 RELEASE DATE 9 2018/03/14 07:58:50 8 B THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION (FROM PATTERN EDGE) A ABOUT FPC : RECOMMENDED PUNCHER DIRECTION : FROM CONDUCTOR SIDE TO STIFFNER BOARD SIDE. RECOMMENDED MATERIAL : STIFFNER FILM : POLYIMIDE BONDING AGENT : THERMOSETTING BONDING AGENT RECOMMENDED P.C.BOARD PATTERN DIMENSION(REF.) (MOUNTING SIDE) PATTERN C FFC構成推奨仕様 STRUCTURE OF FFC FPC構成推奨仕様 STRUCTURE OF FPC (0.2) SOLDERING AREA OF FITTING NAIL (0.3) C 金具パターンエリア E D 3.05 D めっき：金めっき(0.２μm)　 　下地ニッケル(1-5μm) PLATING: GOLD(0.2μm)　 　　　 NICKEL UNDER(1-5μm) 適合金めっきFFC推奨寸法 補強板：ポリエステル系 REINFORCE BOARD: PET 接着剤(難燃ポリエステル系) ADHESIVE（FLAME-RETARDANT POLYESTER ADHESIVE) 絶縁テープ：ポリエステル系(25μm) INSULATING FILM: PET(25μm) 適合金めっきFPC推奨寸法 めっき：金めっき(0.２μm)　 　下地ニッケル(1-5μm) PLATING: GOLD(0.2μm)　 　　　 NICKEL UNDER(1-5μm) 4±0.5 6±0.5 4±0.5 E 0.3±0.03 (PITCH) 6 補強板 (STIFFENER BOARD) R0.3 0.5±0.05 0.5±0.08 6±0.5 0.35 (PITCH) 0.5(N-1)±0.05 0.5±0.08 +0.04 -0.03 補強板 (STIFFENER BOARD) 0.5±0.05 F 0.5(N+1)±0.07 0.5±0.1 カバーレイ　:　ポリイミド(25μm) COVER FILM: POLYIMIDE(25μm) 0.5(N-1)±0.05 0.5±0.1 仕上がり厚さ THICKNESS 補強板：ポリイミド REINFORCE BOARD: POLYMIDE 熱硬化接着剤 THERMOSETTING ADHESIVE ベースフィルム：ポリイミド(25μm) BASE FILM: POLYIMIDE(25μm) 熱硬化接着剤 THERMOSETTING ADHESIVE 導体部：　銅箔(35μm) COPPER FOIL (35μm) 熱硬化接着剤 THERMOSETTING ADHESIVE F 1 接着剤(難燃ポリエステル系) ADHESIVE（FLAME-RETARDANT POLYESTER ADHESIVE) 絶縁テープ：ポリエステル系(25μm) INSULATING FILM: PET(25μm) 9 接着剤(難燃ポリエステル系) ADHESIVE（FLAME-RETARDANT POLYESTER ADHESIVE) 導体部：　銅箔(35μmか50μm) COPPER FOIL (35μm or 50μm) 10 7 6 GENERAL TOLERANCES (UNLESS SPECIFIED) 10 UNDER ±　0.2 10 OVER 30 UNDER ±　0.25 ±　0.3 30 OVER ANGULAR 　　±　3　° DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 5 DIMENSION UNITS SCALE mm 5:1 GENERAL TOLERANCES (UNLESS SPECIFIED) ANGULAR TOL ± 3.0 ° 4 PLACES ± 0.2 3 PLACES ± 0.25 2 PLACES ± 0.3 1 PLACE ± 0 PLACES ± DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 4 CURRENT REV DESC: EC NO: 600082 DRWN: YCHEN128 CHK'D: KTAKAHASHI APPR: NUKITA INITIAL REVISION: DRWN: HSHIMABUKURO APPR: MSASAO THIRD ANGLE PROJECTION 2018/02/27 2018/03/14 2018/03/14 2004/02/05 2004/02/06 DRAWING SERIES A3-SIZE 52746 3 0.5 FPC CONN. ZIF FOR SMT R/A (BOTTOM CONTACT) GOLD PLATING PRODUCT CUSTOMER DRAWING DOC TYPE DOC PART REVISION DOCUMENT NUMBER SD-52746-025 MATERIAL NUMBER PSD 001 CUSTOMER GENERAL MARKET SEE TABLE 2 K SHEET NUMBER 2 OF 2 1 A