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53261-7008

53261-7008

  • 厂商:

    MOLEX10(莫仕)

  • 封装:

    -

  • 描述:

    53261-7008

  • 数据手册
  • 价格&库存
53261-7008 数据手册
14 13 12 11 ⌖ 0.4 X Y 10 9 7 8 1 POSITION TOLERANCE A OF PIN TIP H 0.9 4 3 2 1 NOTES X B 5 6 0.6 2 1.25 Y �PITCH� 材料およびめっき仕様 : TABLE 1 参照 MATERIAL AND PLATING : REFER TO TABLE 1 H 適用製品及び各種仕様書はSHEET 4を参照のこと REFER TO SHEET 4 ABOUT APPLICABLE PRODUCTS AND VARIOUS SPECIFICATIONS 1 G 4~15極形状 (2ロック) FIGURE OF 4-15 CIRCUIT (2 LOCKS) 2, 3極形状 (1ロック) FIGURE OF 2, 3 CIRCUIT (1 LOCK) 2.4 0.725 3. 梱包形態 : SHEET 3 参照 PACKAGING INFOMATION : SEE SHEET 3 4. テールおよびネイルのズレは基準面 V に対しA方向に0.05 MAX、B方向に0.1 MAX MISALIGNMENT OF TAILS AND NAILS FROM V , V C 方向A DIRECTION A D DIRECTION A: 0.05 MAX, DIRECTION B: 0.1 MAX 方向B DIRECTION B 5. 端子テール部およびネイルの平坦度は0.1以下 COPLANARITY OF TAIL AND NAIL TO BE 0.1 MAX E ±0.4 6. 本製品は金めっき品です。錫めっき品はSD-53261-023/024をご参照ください 3.4 2 Z CIRCUIT N G THIS PRODUCT IS GOLD PLATING TYPE. PLEASE REFER TO SD-53261-023/024 FOR TIN PLATING TYPE. 0.6 CIRCUIT 1 0.32 ±0.05 Z E 1.25 1.0 ±0.4 ⌖ 0.5 W 1.5 PITCH A 0.5 ±0.1 E C 0.2 ±0.15 1.375 W (1.25N+0.25) 0.4 �1.0� 0.4 �3.8� 4.2 F �2.2� F 3.4 (1.25N+1.75) �3� (1.25N+1.95) 3.2 +0.20 -0.05 SECTION Z-Z MOLD NO CAV NO D D CIRCUIT 1 MARK POSITION MX◻ ◻ ◻ 1 1.48 TRADE MARK C CIRCUIT N TABLE1 1 部品 PART 番号 NO. ① A 材質 MATERIAL ハウジング ポリアミド(PA), UL94V-0, GLASS-FILLED, 色: ナチュラル(ベージュ) HOUSING POLYAMIDE(PA), UL94V-0, GLASS-FILLED, COLOR: NATURAL (BEIGE) 母材 MATERIAL B ② 1.7 ±0.3 CIRCUIT 1 0.25 ±0.05 3 ネイル NAIL 20.5 19.25 18 16.75 15.5 14.25 13 11.75 10.5 9.25 無光沢錫めっき 1.0 micro-meters MIN MATTE TIN PLATING 1.0 micro-meters MIN DIMENSION UNITS SCALE mm NTS E D C ± 3.0 ° 4 PLACES ± 0.2 りん青銅 PHOSPHOR BRONZE 3 PLACES ± 0.2 2 PLACES ± 0.2 テール部 TAIL AREA 無光沢錫めっき 1.0 micro-meters MIN MATTE TIN PLATING 1.0 micro-meters MIN 1 PLACE ± 0.2 下地めっき UNDER PLATING ニッケルめっき 1.0 micro-meters MIN NICKEL PLATING 1.0 micro-meters MIN 0 PLACES ± 0.2 母材 MATERIAL RELEASE DATE 12 2021/05/27 10:21:18 11 10 B 17.5 16.25 15 13.75 12.5 11.25 10 8.75 7.5 6.25 5 3.75 2.5 1.25 15 14 13 12 11 10 9 8 7 6 5 4 3 2 C 極数 CIRCUIT SIZE B A CURRENT REV DESC: GENERAL TOLERANCES (UNLESS SPECIFIED) ANGULAR TOL ニッケルめっき 1.0 micro-meters MIN NICKEL PLATING 1.0 micro-meters MIN 19.3 18.05 16.8 15.55 14.3 13.05 11.8 10.55 9.3 8.05 8 6.8 6.75 5.55 5.5 4.3 4.25 3.05 THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION 金めっき : めっき厚は注記12参照 GOLD PLATING PLATING THICKNESS : SEE NOTE 12. 下地めっき UNDER PLATING DOCUMENT STATUS P1 14 13 FORMAT: master-tb-prod-A2 REVISION: J DATE: 2020/01/14 23.5 22.25 21 19.75 18.5 17.25 16 14.75 13.5 12.25 11 9.75 8.5 7.25 りん青銅 PHOSPHOR BRONZE コンタクト部 ターミナル CONTACT AREA TERMINAL テール部 TAIL AREA ③ 23.9 22.65 21.4 20.15 18.9 17.65 16.4 15.15 13.9 12.65 11.4 10.15 8.9 7.65 EC NO: 643451 DRWN: SOBARA01 CHK'D: SAKIYAMA APPR: KOMURAKAMI INITIAL REVISION: DRWN: SOBARA01 APPR: TKANEKO THIRD ANGLE PROJECTION DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 9 8 7 6 5 2019/04/08 2021/05/27 2021/05/27 PICOBLADE 1.25 HEADER ASSY SMT RIGHT ANGLE GOLD PLATING TYPE PRODUCT CUSTOMER DRAWING DOC TYPE DOC PART REVISION DOCUMENT NUMBER 2018/09/13 2018/09/28 DRAWING SERIES A2-SIZE 53261 4 532610000-SD MATERIAL NUMBER SEE CHART OF SHEET3 3 PSD 000 C SHEET NUMBER CUSTOMER GENERAL 2 1 OF 4 1 A 14 13 12 11 10 9 8 7 (VACCUM AREA) 3 2 1 H コネクタ外形からパッドまでの寸法を示す。 DIMENSIONS FROM CONNECTOR OUTLINE TO PAD (VACCUM AREA) 7 �2� G 4 NOTES �C� H 5 6 G 吸着エリア VACCUM AREA (1.0) TYP (4) 7 �0.4� F �0.6� CIRCUIT 1 CIRCUIT N �0.8� 1.25 ±0.1 E 7 0.6 ±0.1 TYP (2) LENGTH E PATTERN 1.60 +0.1 0 7 (1.8) TYP (4) 3 ±0.1 TYP (2) F 2.1 ±0.1 TYP (2) �1.6� (1.0) TYP (4) コネクタ外形 CONNECTOR OUTLINE (PITCH) 公差非累積 NON-ACCUMILATIVE 3.6 ±0.1 A ±0.1 3.6 ±0.1 推奨基板レイアウト (実装面側) RECOMMENDED P.C.B LAYOUT : COMPONENT SIDE (参考:基板厚 1.0mm, メタルマスク厚さ: 0.15mm, マスク開口率:100%) (REFERENCE:P.C.B THICKNESS 1.0mm, STENCIL THICKNESS: 0.15mm, APERTURE:100%) D D :パターンおよびはんだ禁止エリア RESTRICTED AREA NO PCB COMPONENTS AND SOLDER ALLOWED C C 嵌合相手:51021 シリーズ MATE WITH: 51021 SERIES �E� �5.2� �1.0� �D� B B �3.4� THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT STATUS P1 14 13 FORMAT: master-tb-prod-A2 REVISION: J DATE: 2020/01/14 RELEASE DATE 12 2021/05/27 10:21:18 11 SCALE mm NTS CURRENT REV DESC: GENERAL TOLERANCES (UNLESS SPECIFIED) 嵌合図 MATED CONNECTOR A DIMENSION UNITS ANGULAR TOL ± 3.0 ° 4 PLACES ± 0.2 3 PLACES ± 0.2 2 PLACES ± 0.2 1 PLACE ± 0.2 0 PLACES ± 0.2 EC NO: 643451 DRWN: SOBARA01 CHK'D: SAKIYAMA APPR: KOMURAKAMI INITIAL REVISION: DRWN: SOBARA01 APPR: TKANEKO THIRD ANGLE PROJECTION DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 10 9 8 7 6 5 2019/04/08 2021/05/27 2021/05/27 PICOBLADE 1.25 HEADER ASSY SMT RIGHT ANGLE GOLD PLATING TYPE PRODUCT CUSTOMER DRAWING DOC TYPE DOC PART REVISION DOCUMENT NUMBER 2018/09/13 2018/09/28 DRAWING SERIES A2-SIZE 53261 4 532610000-SD MATERIAL NUMBER SEE CHART OF SHEET3 3 PSD 000 C SHEET NUMBER CUSTOMER GENERAL 2 2 OF 4 1 A 14 13 12 11 10 8 9 10. (⌀80) 22 0°� ⌀330 ±2 �12 G 5 6 11. 12. 材料: TABLE 2参照 MATERIAL: REFER TO TABLE 2 コネクタハウジング平面部 CONNECTOR HOUSING FLAT AREA. トップテープの剥離強度はIEC 60286-3に準拠。 TOP TAPE PEELING FORCE IS DEFINED BY IEC 60286-3. 本製品は乾燥剤入りハイバリア梱包仕様である。 THIS PRODUCT IS HIGH BARRIER PACKAGE WITH DESICCANT. 梱包数量: 1000個/リール DETAIL U 25 ±5 175 ±25 リーダー部 (空部) LEADER PART (EMPTY) 引き出し方向 PULL OUT DIRECTION ④ ⑤ ⑥ (2.8) CIRCUIT 1 (4.6) 吸着ノズル中心位置 VACUUM NOZZLE CENTER LOCATION (3.7) 14 1.75 ±0.1 CIRCUIT N 0.5 ±0.05 4.7 ±0.3 T ⌀ 1.5 +0.1 0 T 12 ±0.1 PITCH 4 ±0.1 極数 CIRCUIT 532617015 532614015 532617014 532614014 532617013 532614013 532617012 532614012 532617011 532614011 532617010 532614010 532617009 532614009 532617008 532614008 532617007 532614007 532617006 532614006 532617005 532614005 532617004 532614004 532617003 532614003 532617002 532614002 GOLD PLATING THICKNESS GOLD PLATING THICKNESS 0.38micro-meters MIN FLASH 40±0.2 トップテープ TOP TAPE �2� 1.5 +0.1 0 �2.8� 0.2 +0.15 -0.05 引き出し方向 PULL OUT DIRECTION 9 (4.6) (0.8) 1.75 ±0.1 VACUUM NOZZLE CENTER LOCATION ⌀ 1.5 +0.1 0 ピッチ累積公差 ACCUMULATIVE PITCH 40±0.2 SECTION: R-R R �2� PITCH 40±0.2 A 32mm幅(11~13極用)および44mm幅(14~15極用)キャリアテープ 32mm (FOR 11~13 CIRCUIT) OR 44mm (FOR 14~15 CIRCUIT) WIDTH CARRIER TAPE DOCUMENT STATUS P1 14 13 RELEASE DATE 12 2021/05/27 10:21:18 11 DIMENSION UNITS SCALE 9 4 FLASH 7 0.38 micro-meters MIN 15 14 13 12 11 10 9 8 7 6 5 4 3 2 E D 極数 CIRCUIT 18.7 17.45 16.2 14.95 13.7 12.45 11.2 9.95 8.7 7.45 6.2 4.95 3.7 2.45 24.5 23.25 22 20.75 19.5 18.25 17 15.75 14.5 13.25 12 10.75 9.5 8.25 M L 42 40.4 20.2 49.4 45.4 32 28.4 14.2 37.4 15 14 13 12 11 10 9 8 7 6 5 4 3 2 33.4 24 - 11.5 29.4 25.4 16 - 7.5 21.4 17.4 キャリアテープ幅 K CARRIER TAPE WIDTH G J H G F C 極数 CIRCUIT B mm NTS CURRENT REV DESC: ANGULAR TOL ± 3.0 ° 4 PLACES ± 0.2 3 PLACES ± 0.2 2 PLACES ± 0.2 1 PLACE ± 0.2 0 PLACES ± 0.2 EC NO: 643451 DRWN: SOBARA01 CHK'D: SAKIYAMA APPR: KOMURAKAMI INITIAL REVISION: DRWN: SOBARA01 APPR: TKANEKO THIRD ANGLE PROJECTION DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 10 番号 接点部 金めっき厚 CONTACT GOLD PLATING THICKNESS GENERAL TOLERANCES (UNLESS SPECIFIED) CIRCUIT N 12 ±0.1 4.9 ±0.3 4.0 ±0.1 R ポリスチレン(PS)<リサイクル材を含む> POLYSTYRENE(PS)<RECYCLE MATERIAL CONTAINED> THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION (0.6) (H) 吸着ノズル中心位置 0.6 ±0.05 発注番号 ORDER NO. 14 梱包形態 : エンボス梱包 PACKAGING : EMBOSSED TAPE AND REEL (3.7) J ±0.1 CARRIER TAPE WIDTH K ±0.3 (L) (M) CIRCUIT 1 B リール REEL 発注番号 ORDER NUMBER SECTION: T-T 16mm幅(2~3極用)および24mm幅(4~10極用)キャリアテープ 16mm (FOR 2~3 CIRCUIT) OR 24mm (FOR 4~10 CIRCUIT) WIDTH CARRIER TAPE �6� F ポリエチレンフラノエート (PEF)、その他 POLYETHYLENE (PEF), ETC トップテープ TOP TAPE 53261*0** 40±0.2 ACCUMULATIVE PITCH D エンボステープ ポリプロピレン(PP) EMBOSSED TAPE POLYPROPYLENE(PP) (2) ピッチ累積公差 材質 MATERIAL (0.8) (0.5) 4 CONNECTOR (H) CARRIER TAPE WIDTH K ±0.3 (L) (M) E 引き出し方向 PULL OUT DIRECTION 部品 PART 番号 NO. �2� 150 ±40 TABLE2 8 F 9 末端部 (空部) TAIL PART (EMPTY) 部品挿入部 COMPONENT SUPPLIER G F ±1 (6) 1 H 120 ±20 G ±1 5 2 トップテープ未装着部 TOP TAPE NON-BONDED PART トップテープリーダー部 TOP TAPE LEADER PART U (⌀13) FORMAT: master-tb-prod-A2 REVISION: J DATE: 2020/01/14 3 NUMBER OF CONNECTOR: 1000PCS/REEL (⌀21) C 4 13. リードテープ長さ LEAD TAPE LENGTH (⌀10) (2) 7 8 注釈 NOTE 6 引き出し方向 PULL OUT DIRECTION H 9 8 7 6 5 2019/04/08 2021/05/27 2021/05/27 PICOBLADE 1.25 HEADER ASSY SMT RIGHT ANGLE GOLD PLATING TYPE PRODUCT CUSTOMER DRAWING DOC TYPE DOC PART REVISION DOCUMENT NUMBER 2018/09/13 2018/09/28 DRAWING SERIES A2-SIZE 53261 4 532610000-SD MATERIAL NUMBER SEE CHART OF SHEET3 3 PSD 000 C SHEET NUMBER CUSTOMER GENERAL 2 3 OF 4 1 A 10 9 7 8 5 6 4 3 2 1 F F 2 適合製品および各種仕様書 APPLICABLE PRODUCTS AND SPECIFICATIONS 梱包仕様書 PACKING SPECIFICATION E PART NUMBER SPECIFICATION NUMBER 53261**** SPK-53261-002 CRIMP TREMINAL HOUSING WIRE SIZE (AWG) 適合嵌合相手 MATE WITH FLASH #28-32 51021**** PART NUMBER 500588020 500588025 500798020 500798025 GOLD PLATING THICKNESS 0.38 micro-meters FLASH #26-28 D E 0.38 micro-meters D 製品仕様書 PRODUCT SPECIFICATION 510210001-PS PS 000 アプリケーション仕様書 (取扱説明書) APPLICATION SPECIFICATION 510210000-AS PS 000 C C B B THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DIMENSION UNITS SCALE mm NTS CURRENT REV DESC: GENERAL TOLERANCES (UNLESS SPECIFIED) A DOCUMENT STATUS FORMAT: master-tb-prod-A3 REVISION: J DATE: 2020/01/14 10 P1 RELEASE DATE 9 2021/05/27 ± 4 PLACES ± 0.2 3 PLACES ± 0.2 2 PLACES ± 0.2 3.0 ° 1 PLACE ± 0.2 0 PLACES ± 0.2 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 10:21:18 8 ANGULAR TOL 7 6 5 4 EC NO: 643451 DRWN: SOBARA01 CHK'D: SAKIYAMA APPR: KOMURAKAMI INITIAL REVISION: DRWN: SOBARA01 APPR: TKANEKO THIRD ANGLE PROJECTION 2019/04/08 2021/05/27 2021/05/27 PICOBLADE 1.25 HEADER ASSY SMT RIGHT ANGLE GOLD PLATING TYPE PRODUCT CUSTOMER DRAWING DOC TYPE DOC PART REVISION DOCUMENT NUMBER 2018/09/13 2018/09/28 DRAWING SERIES A3-SIZE 53261 3 532610000-SD MATERIAL NUMBER CUSTOMER GENERAL 2 PSD 000 C SHEET NUMBER 4 OF 4 1 A
53261-7008 价格&库存

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