54132-4092

10 9 8 7 6 5 4 3 2 1 F F E E D D SCALE 8:1 C 30.5 28.0 27.0 25.5 24.5 23.5 23.0 22.5 22.0 21.5 20.5 5 B 10 P1 RELEASE DATE 9 2018/03/14 07:58:51 8 7 24.5 22.0 21.0 19.5 18.5 17.5 17.0 16.5 16.0 15.5 14.5 54132-5062 54132-4562 54132-4362 54132-4062 54132-3862 54132-3662 54132-3562 54132-3462 54132-3362 54132-3262 54132-3062 50 45 43 40 38 36 35 34 33 32 30 EMBOSSED TAPE ORDER No. オーダー番号 C B THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION A DOCUMENT STATUS 25.65 23.15 22.15 20.65 19.65 18.65 18.15 17.65 17.15 16.65 15.65 CONNECTOR SERIES NO. : 54132-**68 2.27 FORMAT: master-tb-prod-A3 REVISION: H DATE: 2018/01/18 29.3 26.8 25.8 24.3 23.3 22.3 21.8 21.3 20.8 20.3 19.3 6 GENERAL TOLERANCES (UNLESS SPECIFIED) 10 UNDER ±　0.2 10 OVER 30 UNDER ±　0.25 ±　0.3 30 OVER ANGULAR 　　±　3　° DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 5 DIMENSION UNITS SCALE mm 5:1 GENERAL TOLERANCES (UNLESS SPECIFIED) ANGULAR TOL ± 3.0 ° 4 PLACES ± 0.2 3 PLACES ± 0.25 2 PLACES ± 0.3 1 PLACE ± 0 PLACES ± DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 4 CURRENT REV DESC: EC NO: 600082 DRWN: YCHEN128 CHK'D: KTAKAHASHI APPR: NUKITA INITIAL REVISION: DRWN: MUMEDA APPR: NUKITA THIRD ANGLE PROJECTION 0.5 FPC CONN. ZIF SMT 2018/03/02 R/A BOTTOM CONTACT NI-BARRIER GOLD PLATING 2018/03/14 2018/03/14 PRODUCT CUSTOMER DRAWING 2004/10/08 2004/10/14 DRAWING SERIES A3-SIZE 54132 3 DOC TYPE DOC PART REVISION DOCUMENT NUMBER SD-54132-064 MATERIAL NUMBER PSD 001 CUSTOMER GENERAL MARKET SEE TABLE 2 G SHEET NUMBER 1 OF 3 1 A 10 9 7 8 5 6 F 4 3 2 1 F 注記NOTES 0.5(N-1)±0.05 3.3 0.9 0.8 (0.3) (公差非累積) 0.5±0.05 (NON-ACCUMULATIVE) (0.17) (0.3) 0.8 (0.3) (ピッチ) (PITCH) E 2.4 0.9 2.4 1.使用材料　MATERIAL ハウジング : 46ナイロン、ガラス充填、UL94V-0、白 HOUSING:PA46,GLASS FILLED,UL94V-0,WHITE アクチュエータ：ポリフェニレンサルファイド（PPS）、ガラス充填、UL94V-0、黒 ACTUATOR:POLYPHENYLENE SULFIDE,GLASS FILLED,UL94V-0,BLACK ターミナル : リン青銅(t=0.2) 金メッキ コンタクト部 0.1 MICROMETER MINIMUM テール部 0.05 MICROMETER MINIMUM ニッケル下地 1.0 MICROMETER MINIMUM TERMINAL PHOS-BRONZE GOLD-PLATING CONTACT PORTION : 0.1 MICROMETER MINIMUM TAIL PORTION : 0.05 MICROMETER MINIMUM NICKEL PLATING : 1.0 MICROMETER MINIMUM 金具 : リン青銅(t=0.2) 錫メッキ 1.0～3.0 MICROMETER MINIMUM ニッケル下地 1.0～3.0 MICROMETER MINIMUM FITTING NAIL : PHOS-BRONZE TIN-PLATING 1.0～3.0 MICROMETER MINIMUM OVER NICKEL 1.0～3.0 MICROMETER MINIMUM 2.エンボステープ梱包時はアクチュエータがロックした状態とする。 IN THE PACKAGE, ACTUATOR OF PART NO.54132-**68 SHOULD BE LOCKED. 3 ソルダーテール半田付け面のズレ量、および金具半田付け面のズレ量は 基準面 H に対し上方向 0.1MAXIMUM、下方向 0.15MAXIMUMとする。 MISALIGNMENT OF SOLDER TAILS AND FITTING NAILS FROM DATUM-H UPPER DIRECTION : 0.1MAXIMUM, LOWER DIRECTION : 0.15 MAXIMUM. 4 偶数極に適用。 APPLY FOR EVEN CIRCUIT. 5 パターンはく離止め金具。 FITTING NAIL FOR PREVENTION OF PEELING OF P.W.BOARD PATTERN. 6.本製品は54132-**61に対するニッケルバリア品になります。 THIS PRODUCT IS NICKEL-BARRIER OF 54132-**61. 7.ELV & RoHS適合品。 ELV AND RoHS COMPLIANT. 3.3 (0.94) D 0.8 2.4 (2.13) 0.9 1.2 P コネクタ位置 参考基板レイアウト CONNECTOR POSITION RECOMMENDED P.W.BOARD PATTERN DIMENSION(REF.) (マウント面) (MOUNTING SIDE) 1.45MAX. (0.3) 0.35MAX. パターンおよび 半田禁止エリア B R0.3 (0.17) BOARD SOLDERING AREA OF FITTING NAIL VIEW R R (DETAIL OF FITTING NAIL ON PATTERN) DETAIL P THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION A DOCUMENT STATUS 10 FORMAT: master-tb-prod-A3 REVISION: H DATE: 2018/01/18 P1 RELEASE DATE 9 2018/03/14 C B (FROM PATTERN EDGE) 金具パターンエリア D PATTERN (0.3) KEEPING OUT AREA OF PATTERN AND SOLDERING 3.15MIN. C E 07:58:51 8 7 6 GENERAL TOLERANCES (UNLESS SPECIFIED) 10 UNDER ±　0.2 10 OVER 30 UNDER ±　0.25 ±　0.3 30 OVER ANGULAR 　　±　3　° DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 5 DIMENSION UNITS SCALE mm 8:1 GENERAL TOLERANCES (UNLESS SPECIFIED) ANGULAR TOL ± 3.0 ° 4 PLACES ± 0.2 3 PLACES ± 0.25 2 PLACES ± 0.3 1 PLACE ± 0 PLACES ± DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 4 CURRENT REV DESC: EC NO: 600082 DRWN: YCHEN128 CHK'D: KTAKAHASHI APPR: NUKITA INITIAL REVISION: DRWN: MUMEDA APPR: NUKITA THIRD ANGLE PROJECTION 0.5 FPC CONN. ZIF SMT 2018/03/02 R/A BOTTOM CONTACT NI-BARRIER GOLD PLATING 2018/03/14 2018/03/14 PRODUCT CUSTOMER DRAWING 2004/10/08 2004/10/14 DRAWING SERIES A3-SIZE 54132 3 DOC TYPE DOC PART REVISION DOCUMENT NUMBER SD-54132-064 MATERIAL NUMBER PSD 001 CUSTOMER GENERAL MARKET SEE TABLE 2 G SHEET NUMBER 2 OF 3 1 A 9 7 8 5 6 4 E 3 2 1 0.3 ±0.03 0.3 ±0.03 仕上がり厚さ THICKNESS 仕上がり厚さ THICKNESS E 0.5±0.05 (THICKNESS : 0.3±0.03 ) ) FPC/FFCについて : 打ち抜き方向は導体側から補強板側を推奨いたします。 RECOMMENDED PUNCHER DIRECTION FROM CONDUCTOR SIDE TO STIFFENER BOARD SIDE. B めっき：金めっき(0.２μm)　 　下地ニッケル(1-5μm) PLATING: GOLD(0.2μm)　 　　　 NICKEL UNDER(1-5μm) FPC構成推奨仕様 STRUCTURE OF FPC D C 接着剤(難燃ポリエステル系) ADHESIVE（FLAME-RETARDANT POLYESTER ADHESIVE) 絶縁テープ：ポリエステル系(25μm) INSULATING FILM: PET(25μm) (仕上がり厚さ : 0.3±0.03 接着剤(難燃ポリエステル系) ADHESIVE（FLAME-RETARDANT POLYESTER ADHESIVE) 導体部：　銅箔(35μmか50μm) COPPER FOIL (35μm or 50μm) (THICKNESS : 0.3±0.03 ) ) 補強板：ポリイミド REINFORCE BOARD: POLYMIDE 熱硬化接着剤 THERMOSETTING ADHESIVE ベースフィルム：ポリイミド(25μm) BASE FILM: POLYIMIDE(25μm) 熱硬化接着剤 THERMOSETTING ADHESIVE 導体部：　銅箔(35か50μm) COPPER FOIL (35 or 50μm) 熱硬化接着剤 THERMOSETTING ADHESIVE (仕上がり厚さ : 0.3±0.03 APPLICABLE FFC OF GOLD PLATING RECOMMENDED DIMENSION 補強板：ポリエステル系 REINFORCE BOARD: PET 接着剤(難燃ポリエステル系) ADHESIVE（FLAME-RETARDANT POLYESTER ADHESIVE) 絶縁テープ：ポリエステル系(25μm) INSULATING FILM: PET(25μm) 適合金めっきFFC推奨寸法 APPLICABLE FPC OF GOLD PLATING RECOMMENDED DIMENSION C めっき：金めっき(0.２μm)　 　下地ニッケル(1-5μm) PLATING: GOLD(0.2μm)　 　　　 NICKEL UNDER(1-5μm) 適合金めっきFPC推奨寸法 カバーレイ　:　ポリイミド(25μm) COVER FILM: POLYIMIDE(25μm) 補強板 5.5MIN. D (STIFFENER BOARD) 3.5MIN. (ピッチ) (PITCH) B FFC構成推奨仕様 STRUCTURE OF FFC THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION A DOCUMENT STATUS FORMAT: master-tb-prod-A3 REVISION: H DATE: 2018/01/18 9 P1 RELEASE DATE 2018/03/14 8 07:58:51 7 6 5 GENERAL TOLERANCES (UNLESS SPECIFIED) 10 UNDER ±　0.2 10 OVER 30 UNDER ±　0.25 ±　0.3 30 OVER ANGULAR 　　±　3　° DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 4 DIMENSION UNITS SCALE mm 8:1 GENERAL TOLERANCES (UNLESS SPECIFIED) ANGULAR TOL ± 3.0 ° 4 PLACES ± 0.2 3 PLACES ± 0.25 2 PLACES ± 0.3 1 PLACE ± 0 PLACES ± DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS CURRENT REV DESC: EC NO: 600082 DRWN: YCHEN128 CHK'D: KTAKAHASHI APPR: NUKITA INITIAL REVISION: DRWN: MUMEDA APPR: NUKITA THIRD ANGLE PROJECTION 3 0.5 FPC CONN. ZIF SMT 2018/03/02 R/A BOTTOM CONTACT NI-BARRIER GOLD PLATING 2018/03/14 2018/03/14 PRODUCT CUSTOMER DRAWING 2004/10/08 2004/10/14 SD-54132-064 MATERIAL NUMBER DRAWING SERIES A3-SIZE 54132 2 DOC TYPE DOC PART REVISION DOCUMENT NUMBER SEE TABLE PSD 001 G SHEET NUMBER CUSTOMER GENERAL MARKET 1 3 OF 3 A