73644-0209

This document was generated on 03/28/2019 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0736440209 Active HDM Backplane Connector System HDM Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position E, 72 Circuits, Mating Length 6.00mm Documents: 3D Model Drawing (PDF) Packaging Specification PK-70873-0818 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only Agency Certification CSA UL LR19980 E29179 General Product Family Series Application Comments Component Type Overview Product Name UPC Backplane Connectors 73644 Backplane Standard Press-Fit, Standard Press-Fit PCB Header HDM Backplane Connector System HDM 822350613163 Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Net Weight Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length PCB Locator PCB Retention PCB Thickness - Recommended Packaging Type Pitch - Mating Interface Pitch - Termination Interface Plating min - Mating Plating min - Termination Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 72 72 Black, Natural 250 No 94V-0 Yes Yes Phosphor Bronze, Stainless Steel Gold Gold High Temperature Thermoplastic 6.400/g 12 Open Pin Field 6 Vertical 3.50mm No Yes 2.50mm Tube 2.00mm 2.00mm 0.762µm 0.051µm No Yes Yes -55° to +105°C Through Hole - Compliant Pin EU ELV Not Relevant EU RoHS China RoHS Compliant REACH SVHC Not Contained Per ED/61/2018 (27 June 2018) Halogen-Free Status Low-Halogen For more information, please visit Contact US China ROHS ELV RoHS Phthalates Green Image Not Relevant Not Contained Search Parts in this Series 73644 Series Mates With 73632 HDM+ Board-to-Board Daughtercard Receptacle. 73780 HDM Board-to-Board Daughtercard Receptacle Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # Extraction Tool 621001000 Backplane Insertion 621001400 Signal Contact Tool Backplane Signal 622008502 Insertion Module Press-In Tool for 2.00mm Pitch HDM* Board-to-Board Backplane Header Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 1.0A 1.0 Gbps 75 No 250V AC Solder Process Data Lead-freeProcess Capability N/A Material Info Reference - Drawing Numbers Packaging Specification Sales Drawing PK-70873-0818 SDA-73644-XXXX This document was generated on 03/28/2019 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION