78373-0001

Part Number : 783730001 Product Description : 1.00mm Pitch DDR3 DIMM Socket, 25° Angle, Through Hole, with Beveled Metal Pins, Black Housing and Latches, 0.76µm Gold (Au) Plating, 2.79mm Solder Tail Length, 1.57mm PCB Thickness, 1.5V Center Voltage Key, 240 Circuits Series Number : 78373 Status : Planned for Obsolescence Product Category : Memory Module Connectors Documents & Resources Product Environment Compliance Compliance GADSL/IMDS Not Relevant China RoHS EU ELV Not Relevant Low-Halogen Status Not Low-Halogen per IEC 61249-221 REACH SVHC Not Contained per D(2023)3788-DC (14 Jun 2023) EU RoHS Compliant per EU 2015/863 Multiple Part Product Compliance Statements - Eu RoHS - REACH SVHC - Low-Halogen Multiple Part Industry Compliance Documents - IPC 1752A Class C - IPC 1752A Class D - Molex Product Compliance Declaration - IEC-62474 - chemSHERPA (xml) EU RoHS Certificate of Compliance Part Details General Status Planned for Obsolescence Category Memory Module Connectors Series 78373 Description 1.00mm Pitch DDR3 DIMM Socket, 25° Angle, Through Hole, with Beveled Metal Pins, Black Housing and Latches, 0.76µm Gold (Au) Plating, 2.79mm Solder Tail Length, 1.57mm PCB Thickness, 1.5V Center Voltage Key, 240 Circuits Component Type Socket JEDEC Outline MO-269 Product Family DDR3 DIMM Sockets Product Name DDR3 DIMM UPC 883906206697 CSA LR19980 UL E29179 Current - Maximum per Contact 1.0A Voltage Key Center Voltage - Maximum 30V AC (RMS)/DC Circuits (Loaded) 240 Circuits (maximum) 240 Durability (mating cycles max) 25 Entry Angle 25° Angle Flammability 94V-0 Housing Color Black Keying to Mating Part Yes Latch Color Black Agency Electrical Physical Material - Metal Copper Alloy Material - Plating Mating Gold Material - Plating Termination Tin Material - Resin High Temperature Thermoplastic Net Weight 11.547/g Packaging Type Tray PC Tail Length 2.79mm PCB Locator Yes PCB Retention Yes PCB Thickness - Recommended 1.57mm Pitch - Mating Interface 1.00mm Pitch - Termination Interface 1.00mm Plating min - Mating 0.762µm Plating min - Termination 2.540µm Temperature Range - Operating -55° to +85°C Termination Interface Style Through Hole Solder Process Data Max-Duration 10 Lead-Free Process Capability SMC&WAVE Max-Cycle 2 Max-Temp 260 This document was generated on Jan 24, 2024