PRODUCT SPECIFICATION
MICRO SIM CARD CONNECTOR, 1.35MM HEIGHT, PUSH PULL
1.0 SCOPE
This Product Specification covers the performance requirements of the Micro SIM Card Connector.
2.0 PRODUCT DESCRIPTION
2.1 PRODUCT NAME AND SERIES NUMBER(S)
Product Name
Series Number
MICRO SIM CARD CONNECTOR, 1.35MM HEIGHT, PUSH PULL
78723
2.2 DIMENSIONS, MATERIALS, PLATINGS AND MARKINGS
See Sales Drawing for information on dimensions, materials, platings and markings.
TENTATIVE RELEASE:
THIS SPECIFICATION IS BASED ON DESIGN OBJECTIVES AND IS STRICTLY TENTATIVE. PRELIMINARY
TEST DATA MAY EXIST, BUT THIS SPECIFICATION IS SUBJECTED TO CHANGE BASED ON THE RESULTS
OF ADDITIONAL TESTING AND EVALUATION.
REVISION: ECR/ECN INFORMATION: TITLE:
3
EC No: S2012-0823
DATE: 2012/06/06
DOCUMENT NUMBER:
PS-78723-001
SHEET No.
MICRO SIM CARD CONNECTOR
1.35MM HEIGHT, PUSH PULL
1 of 10
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
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TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC
PRODUCT SPECIFICATION
3.0 APPLICABLE DOCUMENTS AND SPECIFICATIONS
The following documents form a part of this specification to the extended specified herewith. In the
event of conflict between the requirements of this specification and the product drawing, the
product drawing shall take precedence.
4.0 RATINGS
4.1 CURRENT RATING
0.5Amps Max. per contact
4.2 VOLTAGE RATING
5 Volt DC Max.
4.3 TEMPERATURE
Operating:
Storage (with packaging):
- 40°C to + 85°C
- 40°C to + 85°C
5.0 MECHANICAL INTERFACE
5.1 CARD INTERFACE
SIM card interface: GSM 11.11 specification
5.2 PWB INTERFACE
Plating on PWB pads: OSP plated copper
6.0 PERFORMANCE
6.1 ELECTRICAL REQUIREMENTS
ITEM
DESCRIPTION
TEST CONDITION
REQUIREMENT
1
Low Level Contact
Resistance
(LLCR)
Mate connectors with dry circuit (20 mV,
100mA MAX) on mated connector.
Refer to appendix 1.
(IEC 60512-2-1)
100 milliohm
[MAXIMUM]
[initial]
Value includes bulk resistance
of terminal
2
Insulation
Resistance
Unmated connectors: apply a voltage of
500 VDC between adjacent contact for 1
minutes
(IEC 60512-3-1)
1000 Megohms
[MINIMUM]
REVISION: ECR/ECN INFORMATION: TITLE:
3
EC No: S2012-0823
DATE: 2012/06/06
DOCUMENT NUMBER:
PS-78723-001
SHEET No.
MICRO SIM CARD CONNECTOR
1.35MM HEIGHT, PUSH PULL
2 of 10
CREATED / REVISED BY:
CHECKED BY:
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TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC
PRODUCT SPECIFICATION
3
Dielectric
Withstanding
Voltage
Unmated connectors: apply a voltage of
500 VAC between adjacent contact for 1
minutes
(IEC 60512-3-1)
4
Temperature Rise
Mated and measure the temperature rise
of contact, when rated current is passed.
(IEC 60512-5-1)
No voltage breakdown
Temperature Rise
30°C
[MAXIMUM]
6.2 MECHANICAL REQUIREMENTS
ITEM
5
DESCRIPTION
Contact Normal
Force
TEST CONDITION
REQUIREMENT
Apply perpendicular force to terminal at
the rate of 12.5mm/min. Measure contact
normal force at 0.10mm working height,
read at return curve.
Refer to appendix 1.
6
Mate and unmate connectors to 500
Durability
cycles at a maximum rate of 720
(Horizontal Insertion
cycles/hour.
Direction)
Take LLCR readings at 500th cycles.
7
Card insertion force
8
Card withdrawal
force
9
10
Vibration
(Random)
0.30N min
Contact resistance
100 milliohms
[MAXIMUM]
Insert the card in mating direction at a
Max. rate of 12.5 mm/min
8N
[MAXIMUM]
Withdraw the card in un-mating direction
at a rate of 12.5 mm/min
0.70N
[MINIMUM]
Contact resistance
100 milliohms
[MAXIMUM]
Frequency: 10~100 Hz, 0.0132 g2/Hz;
Frequency: 100~500Hz, -3dB/Oct
Applied for 1 hour in each 3 mutually
perpendicular axes
(IEC60068-2-64 Fh)
Discontinuity < 1 µs
Apply a load parallel to PCB (3directions).
Solder Joint Peeling
Strength
Refer to Appendix 2 for X & Y direction.
Loading speed: 5mm/min.
50N
[MINIMUM]
REVISION: ECR/ECN INFORMATION: TITLE:
3
EC No: S2012-0823
DATE: 2012/06/06
DOCUMENT NUMBER:
PS-78723-001
SHEET No.
MICRO SIM CARD CONNECTOR
1.35MM HEIGHT, PUSH PULL
3 of 10
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
JTAN 2012/05/22
FCSOO 2012/06/06
KHLIM 2012/06/06
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC
PRODUCT SPECIFICATION
11
Mechanical Shock
(specified pulse)
Pulse shape = half sine
Peak acceleration = 490m/s2 (50G)
Duration of pulse = 11ms
Apply 3 successive shocks in each
direction along the 3 mutually
perpendicular axes.
(IEC-60068-2-27 EA)
Contact resistance
100 milliohms
[MAXIMUM]
Discontinuity < 1 µs
6.3 ENVIRONMENTAL REQUIREMENTS
ITEM
DESCRIPTION
12
Low Temperature
Storage Life
(steady state)
At -40°C for 96 hours
Recovery: 2 hours at ambient atmosphere
(IEC60068-2-1Ab)
Contact resistance
100 milliohms
[MAXIMUM]
13
High Temperature
Storage Life
(steady state)
At +85°C for 96 hours
Recovery: 2 hours at ambient atmosphere
(IEC60068-2-2Bb)
Contact resistance
100 milliohms
[MAXIMUM]
Thermal Shock
25 cycle at Ta = -55°C for 0.5 hours, then
change of temp = 25°C MAX 5min, then,
Tb = +85°C for 0.5hour, then cool to
ambient
Recovery: 2hours at ambient atmosphere
(IEC60068-2-14 Test Na)
14
TEST CONDITION
REQUIREMENT
No mechanical damage,
corrosion and oxidation at
contact area
Temp 25-55°C and 90-100%RH for 18
cycles of 24hours.
15
Damp Heat
(Cyclic)
Contact resistance
100 milliohms
[MAXIMUM]
Contact resistance
100 milliohms
[MAXIMUM]
Recovery at 25°C and 25~75%RH for
2hours.
(Typical cycle in temp 25°C 55°C in 3
hours; then maintain at 55°C for 9hours)
(IEC60068-2-30Db)
Insulation resistance
1000 Megohms
[MINIMUM]
No voltage breakdown
REVISION: ECR/ECN INFORMATION: TITLE:
3
EC No: S2012-0823
DATE: 2012/06/06
DOCUMENT NUMBER:
PS-78723-001
SHEET No.
MICRO SIM CARD CONNECTOR
1.35MM HEIGHT, PUSH PULL
4 of 10
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
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FCSOO 2012/06/06
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TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC
PRODUCT SPECIFICATION
16
17
18
Salt Spray
Solderability
48 hours spray, at temp 35± 2°C, R/H 9095%, Salt NaCl mist 5% after test was
parts and return to room ambient for 1~2
hours
(IEC60068-2-11 Test Ka)
Contact resistance
100 milliohms
[MAXIMUM]
Solder paste is deposited on a ceramic
plate via stencil.
The connectors are steam aged and
placed onto the solder paste print.
The substrate is processed through a
forced hot convection oven. Refer to
section 9.0 for temp profile.
The connectors are removed from the
ceramic and inspected.
Steam Aging: 8 hours
(ANSI-J-STD 002)
Unmated sample to be passed through
Resistance to
reflow over according to temp profiles
Soldering Condition
(shown in section 9.0) 2X times
Solder coverage = 95%
[MINIMUM]
No mechanical damage
7.0 PACKAGING
Parts shall be packaged to protect against damage during handling, transit and storage. The parts shall be
carried in reels inside boxes. For details, kindly refer to Packaging spec PK-78723-001.
REVISION: ECR/ECN INFORMATION: TITLE:
3
EC No: S2012-0823
DATE: 2012/06/06
DOCUMENT NUMBER:
PS-78723-001
SHEET No.
MICRO SIM CARD CONNECTOR
1.35MM HEIGHT, PUSH PULL
5 of 10
CREATED / REVISED BY:
CHECKED BY:
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TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC
PRODUCT SPECIFICATION
8.0 TEST SEQUENCES
Group 1 Group 2 Group 3 Group 4 Group 5 Group 6
Test Group
Test or Examination
Sample size
5
5
5
5
5
5
Resistance to Soldering
Conditions
1
1
1
1
1
1
2,5
2,4,6
2,4
Contact Resistance (LLCR)
2,4,6,8
Insulation Resistance
3,6
Dielectric Withstanding Voltage
2,7
Temperature Rise
2
Contact Normal Force
Durability (Horizontal Direction)
3
Card Insertion Force
Card Withdrawal Force
Vibration
3
Solder Joint Peeling Strength
Mechanical Shock
4
Low Temperature Storage Life
3
High Temperature Storage Life
5
Thermal Shock
5
4
Damp Heat
7
5
Salt Spray
3
Solderability
REVISION: ECR/ECN INFORMATION: TITLE:
3
EC No: S2012-0823
DATE: 2012/06/06
DOCUMENT NUMBER:
PS-78723-001
SHEET No.
MICRO SIM CARD CONNECTOR
1.35MM HEIGHT, PUSH PULL
6 of 10
CREATED / REVISED BY:
CHECKED BY:
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TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC
PRODUCT SPECIFICATION
Screen Test Group
Group 1 Group 2 Group 3 Group 4
(Screen (Screen (Screen (Screen
Test)
Test)
Test)
Test)
Test or Examination
Sample size
5
Resistance to Soldering
Conditions
1
Contact Resistance (LLCR)
5
5
1
1
5
1
2,7
Insulation Resistance
2,5
Dielectric Withstanding Voltage
3,6
Temperature Rise
Contact Normal Force
3,8
Durability (Horizontal Direction)
6
Card Insertion Force
4,9
Card Withdrawal Force
5,10
4
Vibration
Solder Joint Peeling Strength
2
Mechanical Shock
Low Temperature Storage Life
High Temperature Storage Life
Thermal Shock
Damp Heat
Salt Spray
Solderability
2
REVISION: ECR/ECN INFORMATION: TITLE:
3
EC No: S2012-0823
DATE: 2012/06/06
DOCUMENT NUMBER:
PS-78723-001
SHEET No.
MICRO SIM CARD CONNECTOR
1.35MM HEIGHT, PUSH PULL
7 of 10
CREATED / REVISED BY:
CHECKED BY:
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TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC
PRODUCT SPECIFICATION
9.0 SOLDERING PROFILE
Pb-free reflow profile requirement for solderability testing
Pb-free reflow profile requirements for solderability testing
Parameter
Reference Specification
Average temperature gradient in
preheating (25~130°C)
Max 2°C/s
Preheat temperature
T1~T2
130~165°C
Preheat time
t1
60 ~ 120 s
Time above liquidus (T3: 217°C)
t2
Max 30s
Peak temperature in reflow
Tpeak
Time within 5°C of peak
t3
Temperature gradient in cooling
230~235°C
10 s
Max –5°C/s
REVISION: ECR/ECN INFORMATION: TITLE:
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EC No: S2012-0823
DATE: 2012/06/06
DOCUMENT NUMBER:
PS-78723-001
SHEET No.
MICRO SIM CARD CONNECTOR
1.35MM HEIGHT, PUSH PULL
8 of 10
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
JTAN 2012/05/22
FCSOO 2012/06/06
KHLIM 2012/06/06
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC
PRODUCT SPECIFICATION
Reflow soldering profile for soldering heat resistance testing
Pb-free reflow profile requirements for soldering heat resistance
Parameter
Reference Specification
Average temperature gradient in
preheating (25~130°C)
Max 2°C/s
Preheat temperature
T1~T2
130~165°C
Preheat time
t1
60 ~ 120 s
Time above liquidus (T3: 217°C)
t2
35~60s
Peak temperature in reflow
Tpeak
Time within 5°C of peak
t3
Temperature gradient in cooling
235~250°C
Min 10 s
Max –5°C/s
REVISION: ECR/ECN INFORMATION: TITLE:
3
EC No: S2012-0823
DATE: 2012/06/06
DOCUMENT NUMBER:
PS-78723-001
SHEET No.
MICRO SIM CARD CONNECTOR
1.35MM HEIGHT, PUSH PULL
9 of 10
CREATED / REVISED BY:
CHECKED BY:
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TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC
PRODUCT SPECIFICATION
APPENDIX 1:
Contact Force Measurement
0.10mm from housing
surface.
APPENDIX 2:
Solder Joint Peeling Test measurement
Direction Y
Top -> Down
Direction X
Direction X
Left -> Right
Right -> Left
REVISION: ECR/ECN INFORMATION: TITLE:
3
EC No: S2012-0823
DATE: 2012/06/06
DOCUMENT NUMBER:
PS-78723-001
SHEET No.
MICRO SIM CARD CONNECTOR
1.35MM HEIGHT, PUSH PULL
10 of 10
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
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FCSOO 2012/06/06
KHLIM 2012/06/06
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC
