78726-1002

PRODUCT SPECIFICATION 288 Ckt Vertical Through-Hole DDR4 DIMM 2.4mm Seating Plane 1.0 SCOPE This Product Specification covers the 0.85 mm centerline gold plated DDR4 DIMM edge card connector for 1.40 +/- 0.10 thick memory modules. 2.0 PRODUCT DESCRIPTION 2.1 PRODUCT NAME AND SERIES NUMBER(S) Series Number 78726 Product Descriptions 288Ckt, Vertical Through-Hole, DDR4 Dimm, 2.4mm Seating Plane 2.2 DIMENSIONS, MATERIALS, PLATINGS AND MARKINGS See the appropriate Sales Drawings for information on dimensions, materials, plating and markings, recommended module outlines and footprint Specifications. 2.3 SAFETY AGENCY APPROVALS UL File: E29179 CSA File: 1409726 (LR19980) REVISION: ECR/ECN INFORMATION: TITLE: A EC No: S2015-0737 DATE: 2015/04/30 DOCUMENT NUMBER: PS-78726-001 SHEET No. DDR4 DIMM, 0.85MM PITCH, 288CKTS, VERTICAL THRU - HOLE 1 of 7 CREATED / REVISED BY: CHECKED BY: APPROVED BY: MELVIN SOH CG TAN SH LENI TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC PRODUCT SPECIFICATION 3.0 APPLICABLE DOCUMENTS AND SPECIFICATIONS Refer to the appropriate sales drawings and other sections of this specification for the necessary referenced documents and specifications. In the event of conflict between the requirements of this specification and the product drawings, the product drawings shall take precedence. In the event of conflict between the requirements of this specification and reference documents, this specification shall take precedence. 4.0 RATINGS 4.1 VOLTAGE 29 Volts AC (RMS) / DC 4.2 CURRENT 0.75 Amps/ pin 4.3 TEMPERATURE Operating Temperature: -55C ~ +85C Non-Operating Temperature: -55C ~ +85C 4.4 FIELD LIFE AND TEMPERATURE Field Life: 7 Years Field Temperature: 65°C 5.0 PERFORMANCE 5.1 ELECTRICAL REQUIREMENTS ITEM TEST DESCRIPTION PROCEDURE REQUIREMENT 1 Low level contact resistance (LLCR) (Initial) EIA 364-23 – Option 1 Mate connectors. Apply a current of 100 mA maximum and voltage of 20 mV maximum. 10 m Max 2 Low level contact resistance (Change from initial) EIA 364-23 – Option 1 Mate connectors. Apply a current of 100 mA maximum and voltage of 20 mV maximum. 10 m Max 3 Insulation resistance EIA-364-21 Unmate & unmount connectors: apply a voltage of 500 VDC between adjacent terminals and between terminals to ground. 1 M Min. 4 Dielectric withstanding voltage EIA-364-20 - Method B Unmated connectors. Apply 500 VAC for 1 minute between adjacent terminals. No breakdown REVISION: ECR/ECN INFORMATION: TITLE: A EC No: S2015-0737 DATE: 2015/04/30 DOCUMENT NUMBER: PS-78726-001 SHEET No. DDR4 DIMM, 0.85MM PITCH, 288CKTS, VERTICAL THRU - HOLE 2 of 7 CREATED / REVISED BY: CHECKED BY: APPROVED BY: MELVIN SOH CG TAN SH LENI TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC PRODUCT SPECIFICATION 5.2 MECHANICAL REQUIREMENTS ITEM TEST DESCRIPTION PROCEDURE REQUIREMENT 5 Insertion force (Module to Connector with latches) EIA-364-13 – Method B Mate a 1.50 +0.01 mm thickness gauge (GS010-1) to the connector at a rate of 25.4 mm / min 106.8 N max. 6 Retention force – Terminal EIA 364-29 – Method C Axial pull out of terminal in the housing at a rate of 25.4 ±6 mm/min. 300gf min per pin 7 Retention force – Fork lock EIA 364-29 – Method C Axial pull out of fork lock in the housing at a rate of 25.4 ±6 mm/min. 13.3N min per fork lock 8 Durability (Preconditioning) EIA-364-09 Perform 5 plug / unplug cycles. Rate: 5 cycles/min. max No evidence of physical damage. 9 Durability EIA-364-09 Perform 25 plug / unplug cycles. Rate: 5 cycles /min. max No evidence of physical damage. 10 Vibration EIA 364-28 Mated connectors Random profile: 2 2 5 Hz @ 0.01 g /Hz to 20 Hz @ 0.02 g /Hz (slope up) 2 20 Hz to 500 Hz @ 0.02 g /Hz (flat) Input acceleration is 3.13 g RMS 10 minutes per axis for all 3 axes on all samples Random control limit tolerance is ± 3 dB No evidence of physical Damage No discontinuities of ≥1 microsecond Module weight 40 ± 2g with center of gravity 18-20mm from module mating edge. 11 Mechanical Shock Mated Connectors. Profile: Trapezoidal shock 50g ±10% Duration : 11ms Velocity change : 170 in/sec. ±10% Quantity: Three drops in each of six directions. Total 18 drops per connector Module weight 40 ± 2g with center of gravity 18-20mm from module mating edge. 12 Reseating EIA 364-09 Manually mate and unmate the connector with module card for 3 cycles. Rate: 5 cycles/min. max. No evidence of physical Damage No discontinuities of ≥1 microsecond No evidence of physical damage. REVISION: ECR/ECN INFORMATION: TITLE: A EC No: S2015-0737 DATE: 2015/04/30 DOCUMENT NUMBER: PS-78726-001 SHEET No. DDR4 DIMM, 0.85MM PITCH, 288CKTS, VERTICAL THRU - HOLE 3 of 7 CREATED / REVISED BY: CHECKED BY: APPROVED BY: MELVIN SOH CG TAN SH LENI TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC PRODUCT SPECIFICATION Latch overstress force Unmated Connectors. Apply an actuation force on the latch at a rate of 25.4 ± 6 mm / min in the fully open position. 3.5kgf min force held for 10 sec. with no damage. Latch actuation force Apply an actuation force on the latch at a rate of 25.4 ± 6 mm min with test blade of 1.50 ±0.01 mm (GS-010-1) inserted into connector. The force to fully actuate the latch open shall be 3.5kgf max. per latch. Module rip out force Pull up from the center of the test module 1.50 ±0.01mm thick (GS-010-1) with the latches closed at a rate of 25.4 ± 6 mm/min. 9.1kgf min. retention force of the module in connector with no damage Insertion force – Connector to board EIA-364-05. Unmated connectors. Push connector into applicable PCB at a rate of 12.7 ±3 mm/min. Fork lock PCB hole size 2.45 ±0.05 cm /min 75N Max 17 Retention force Connector to Board EIA-364-05. Unmated connectors. Pull or push connector with a force of 0.45kgf on connector mounted on the PCB at a rate of 12.7 ± 3 mm/min. Fork lock PCB hole size 2.45 ± 0.05 mm. No lifting of connector from applicable PCB. 18 Unmating force – (per pin pair) EIA-364-13 Pull out 1.30 ±0.01 mm thick (GS-010-2) test blade from connector with latches removed at a rate of 12.7± 3 mm/min 2.02 Kgf Min. for 288 circuit) (14gf per pin pair). 13 14 15 16 5.3 ENVIRONMENTAL REQUIREMENTS ITEM DESCRIPTION TEST CONDITION REQUIREMENT EIA-364-32, Method A, Table 2, Test Condition 1, Duration A-4. 19 Thermal shock 20 Temperature life (Preconditioning) Mate connectors; expose to 10 cycles of: Temperature °C Duration (min) -55 +0/-3 30 25 +10/-5 5 max 85 +3/-0 30 25 +10/-5 5 max EIA-364-17, Method A, (without electrical load). Mated connector. Expose 91 hours at 105° ±2°C. Exposure time as per EIA-364-1000, Table 9 None None REVISION: ECR/ECN INFORMATION: TITLE: A EC No: S2015-0737 DATE: 2015/04/30 DOCUMENT NUMBER: PS-78726-001 SHEET No. DDR4 DIMM, 0.85MM PITCH, 288CKTS, VERTICAL THRU - HOLE 4 of 7 CREATED / REVISED BY: CHECKED BY: APPROVED BY: MELVIN SOH CG TAN SH LENI TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC PRODUCT SPECIFICATION 21 22 23 24 25 26 27 Temperature Life EIA-364-17, Method A (without electrical load) Mated connector. Expose 165 hours at 105° ±2°C. Exposure time as per EIA-364-1000, Table 8 None Solderability Unmated connector. Steam age for 8 hour +/- 15 min. Dip solder tails into solder pot at a temperature of 245 ± 5°C for 5 ± 0.5 seconds. Rate: 25.4 +/-6mm /sec Flux type – ROL0 JESD 22-B-102; Condition C. Solder coverage: 95% MINIMUM Resistance to solder heat EIA-364-56 Dip solder tails into solder pot of 260 ± 5°C for 5 ± 1 seconds Immerse leads to a depth of 1.00 +/-0.2 mm from connector body. Visual: No Damage or discoloration of connector materials. Temperature rise EIA-364 Test Procedure 70. Ten pair contacts in consecutive positions on the same side of the connector are connected in a series circuit (mated condition). A thermocouple is inserted through holes in the socket housing, as close to the contact interface as possible. Supply the rated current. Maximum Temperature Rise shall not exceed 30°C above ambient. Cyclic temperature & humidity As per EIA-364-1000 – Test Group 2, Cyclic temperature and Humidity Cycle the connector between Cycle between temperature and RH Temp ºC RH % 25 ±3 80 ±3 65 ±3 50 ±3 Ramp times should be 0.5 hour and dwell times should be 1 hour. Dwell times start when the temperature and humidity have stabilized within the specified levels. Perform 24 such cycles. None Mixed flowing gas EIA-364-65, class IIA, Exposure time EIA-364-1000 – Table 4.1. Expose unmated connector for 160 hours in MFG chamber. Expose mated (to same test module mated during temp life preconditioning) connector for 80 hours in MFG chamber. None Thermal disturbance EIA-364-1000 – Table 4. Mated connector. Cycle the connector between 15°C±3°C and 85°C±3°C, as measured on the part. Ramps should be a minimum of 2°C per minute. Dwell times should insure that contacts reach temperature extreme (for a minimum of 5minutes). No humidity control. Perform 10 cycles. None REVISION: ECR/ECN INFORMATION: TITLE: A EC No: S2015-0737 DATE: 2015/04/30 DOCUMENT NUMBER: PS-78726-001 SHEET No. DDR4 DIMM, 0.85MM PITCH, 288CKTS, VERTICAL THRU - HOLE 5 of 7 CREATED / REVISED BY: CHECKED BY: APPROVED BY: MELVIN SOH CG TAN SH LENI TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC PRODUCT SPECIFICATION 6.0 TEST SEQUENCE TEST DESCRIPTION SEQUENCE 1 2 3 Low level contact resistance (Initial) 1 1 1 Durability (preconditioning) 2 2 2 4 5 6 7 8 9 10 11 1 12 1 2 Durability 2 Low level contact resistance (Change from initial) 4,6 4,6,8 3,5,7 3 Insulation resistance 1, 5 Dielectric withstanding voltage 2,6 4,6,8,10,12 Temperature life (Preconditioning) Temperature life 3 3 Thermal shock 3 3 Thermal disturbance 9 Cyclic temperature & humidity 5 4 Mixed flowing gas (Unmated) 5 Mixed flowing gas (mated) 7 Mechanical Shock 6 Vibration 4 Reseating 5 7 11 Temperature rise 1 Solderability 1 Resistance to solder heat 3 Insertion Force (Module to connector with latches) 1 Latch Actuation Force 1 Latch Overstress Force 2 Module Ripout Force 2 Insertion force – Connector to board Retention force – Connector to Board 1 2 Retention Force - Terminal 1,4 Retention Force – Fork lock 2,5 Unmating Force (per pin pair) Sample Size per Test Group 3 5 5 5 5 5 5 5 6 5 5 REVISION: ECR/ECN INFORMATION: TITLE: A EC No: S2015-0737 DATE: 2015/04/30 DOCUMENT NUMBER: PS-78726-001 5 5 SHEET No. DDR4 DIMM, 0.85MM PITCH, 288CKTS, VERTICAL THRU - HOLE 6 of 7 CREATED / REVISED BY: CHECKED BY: APPROVED BY: MELVIN SOH CG TAN SH LENI TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC PRODUCT SPECIFICATION 7.0 PACKAGING Parts shall be packed in trays and protected against damage during handling, transportation and storage. 8.0 RECOMMENDED Pb-FREE REFLOW PROFILES Connector should be soldered onto PCB using either the wave soldering technique or the reflow soldering technique according to the table shown below. Process Peak Temperature Duration Wave 265° C Max (Solder Bath) 220° Max Connector Housing 5 +/-2 sec (wave contact) Reflow 220°C Max Peak 220° Max Connector Housing 20 to 40 sec o Time within 5 C of peak REVISION: ECR/ECN INFORMATION: TITLE: A EC No: S2015-0737 DATE: 2015/04/30 DOCUMENT NUMBER: PS-78726-001 SHEET No. DDR4 DIMM, 0.85MM PITCH, 288CKTS, VERTICAL THRU - HOLE 7 of 7 CREATED / REVISED BY: CHECKED BY: APPROVED BY: MELVIN SOH CG TAN SH LENI TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC