78730-1002

Meeting JEDEC specifications, these high-speed DDR4 DIMM sockets offer greater PCB real-estate and cost savings with excellent assembly processing compatibility DDR4 DIMM Sockets, Halogen-free 78726 Vertical, Through hole 78730 Vertical, SMT Meeting JEDEC specifications, Molex’s Vertical SMT and Through hole DDR4 DIMM sockets support *UDIMMs, RDIMMs and LRDIMM memory applications over a wide range of high-speed data, computing, telecommunication and networking servers with data speed of 3.2 billion transfers per second – twice that of DDR3 – and higher energy savings with lower 1.2V operating voltage (compared with 1.5V for DDR3). With Molex’s DDR4 DIMM sockets, more PCB real estate and cost savings can be achieved. Both series 78726 and 78730 sockets feature reduced connector footprint of 6.50mm (max.) (W) by 162mm (L) for maximum space-savings. The soldertails of the (series 78730) SMT socket are flush with the edges of the connector (that is, no protrusion of soldertails beyond the width of the connector at the base) for minimized bending damages due either to human or machine error. Other hallmarks of Molex’s DDR4 sockets include: high dimensional stability and excellent compatibility in Halogen-free and lead-free technologies. The use of moisture-resistant, high-temperature housing material – regardless of termination styles - minimizes blistering on the connector during high, IRreflow processing temperatures. Reduced yield losses with the use of Molex DDR4 sockets add to greater customer cost savings and delivery speed. Halogen-free DDR4 DIMM Sockets, SMT (top) and Through hole (bottom) versions Ergonomically designed socket latches enhance usability with robust protection against high rip-out force and vibration-resistance. Dual-side leadins on the socket facilitate smooth module insertion while stand-offs at the base of the socket makes solder-joint inspection, measurement and rework easy. Molex offers 0.76 and 0.38 micron Gold (Au)-plated DDR4 DIMM sockets in a combination of several housing and latch colors, PC tail lengths and PCB thicknesses. All sockets are shipped in tray packaging. For more information, visit our website at: www.molex.comlink/ddr4..html. Features and Benefits Reduced connector footprint of 6.50mm (max.) (W) by 162mm (L) Provides increased PCB space and cost savings Robust and more ergonomic latch design Improves rip-out force and vibration resistance; makes socket easy to use Profiled contact terminals Eliminate stress caused to housing during terminal insertion and prevents housing warpage Moisture-resistant, high-temperature housing material Gives added dimensional stability to connector with reduced yield loss and increased cost-savings. Able to withstand infrared (IR), lead-free and wave soldering temperatures High connector durability Supports up to 25 mating cycles Step-and-ramp feature (on connector housing and memory module) Reduces insertion force of module without engaging all gold fingers at the same time during module insertion *U  DIMMs: Unbuffered DIMMs offer the fastest memory speeds, lowest latencies, and (relatively) low power consumption but are limited in capacity though. RDIMM: R  egistered DIMMs, with their registers, are able to buffer the Address and Command signals between the DRAMs and the memory controller thus increasing the amount of memory that a server can support, however, with increased power consumption and memory latency . LRDIMM: L  oad Reduced DIMMs use a buffer to reduce memory loading to a single load on all DDR signals, allowing for greater density but at the highest power usage DDR4 DIMM Sockets, Halogen-free Specifications Reference Information Packaging: Tray UL File No.: TBA CSA File No.: TBA Use With: JEDEC MO-310A memory modules Designed In: Millimeter RoHS: Yes Halogen Free: Yes Glow Wire Compliant: No Electrical Voltage (max.): 29V AC (RMS)/DC Current (max.): 0.75A per pin Low Level Contact Resistance (max.): 10 milliohms Dielectric Withstanding Voltage: 500V AC Insulation Resistance (min.): 1 megohm Mechanical Module Insertion Force (with Latches): 12.96 kgf Module Rip-out Force (min.): 9.10 kgf Module Unmating Force (of 1.33mm thick blade from socket): 2.02 kgf Terminal Retention Force (min.): : 0.30 kgf (contact) : 1.33 kgf (forklock) Latch Actuation Force: 4.50 kgf per latch Durability (min.): 25 cycles Physical Housing: Halogen-free, high-temperature Nylon, glass-filled, UL94V-0 (both socket and latch) Contact: Copper Alloy Plating: Contact Area — Refer to table below Solder Tail Area — 2.54μm (100μ") Tin (Sn) Underplating — 1.27μm (50μ") Nickel (Ni) PCB Thickness: Refer to table below (for through hole version only) Operating Temperature: -55 to +85°C Product Features Key differences between DDR3 and DDR4 DIMM Sockets Features DDR3 DIMM Sockets DDR4 DIMM Sockets Pitch 1.00mm 0.85mm Module Thickness 1.27mm 1.40mm Circuits 240 288 Key from Module Center 12.00mm 5.15mm Voltage 1.5V 1.2V Electrical Performance 800 – 1600Mbps 1600 – 3200Mbps DDR4 DIMM Sockets, Halogen-free Product Features Through Hole Pitch Sizes 2.85mm 0.95mm 2.70mm 1.10mm 1.00mm 0.85mm 0.70mm via hole diameter 0.66mm via hole diameter DDR3 pitch size DDR4 pitch size DDR4 uses a smaller pitch and via hole diameter than DDR3 Through hole versions SMT Footprint 2.45mm 2.10mm 1.00mm 2.30mm 1.80mm 0.85mm 0.70mm 0.57mm DDR3 pitch size DDR4 pitch size Socket Housing One of 3 socket forklocks for robust PCB retention Underside of SMT version DDR4 DIMM Socket showing housing and soldertail design Recessed soldertail terminals of the SMT DDR4 DIMM Socket Ergonomically designed latches Stepped housing design improves thumb-grip for easy opening of latch Though compact, each latch delivers an actuation force of up to 4.50 kgf Ergonomically designed latches of the DDR4 DIMM Sockets in open (left) and closed (right) positions Recessed terminal design of the socket reduces exposure of terminal from physical damage Soldertails of the SMT DDR4 DIMM socket are flush with the connector edge (width) on both sides Flush soldertail design minimizes accidental damage to terminal due to bending DDR4 DIMM Sockets, Halogen-free Product Features Differences in socket dimensions 165mm (max.) 2.4mm (max.) Seating Plane 141mm (max.) 26.00mm (max.) 7.75mm max. DDR3 DIMM Socket 162mm (max.) 2.4mm (max.) Seating Plane 142mm (max.) 21.30mm (max.) 6.50mm max. DDR4 DIMM Socket DDR4 has a narrower connector width and mounted height than DDR3 versions Product Features Differences in DDR3 and DDR4 memory modules Module Thickness: 1.27mm DDR3 DIMM Module 240 circuits, 1.00mm pitch Module Thickness: 1.40mm 0.5mm step DDR4 DIMM Module 288 circuits, 0.85mm pitch Step and ramp feature on both sides of memory module helps maintain the same insertion force to the socket when inserted Differences between DDR3 and DDR4 Memory Modules Two notches for Very Low Profile (VLP) and Low Profile (LP) modules Single notch for both VLP and LP modules 0.5mm step DDR4 DIMM Sockets, Halogen-free Ordering Information Through Hole Versions Order No. Housing Color 78726-1002 78726-1003 Latch Color Recommended PCB Thickness (mm) Black 1.57 2.36 78726-1026 78726-1040 Off-white 78726-1027 Black 1.57 Off-white 2.36 78726-1029 3.00 78726-1010 1.57 78726-1011 Blue 78726-1030 2.36 3.00 Blue 78726-1022 1.57 Off-white 78726-1023 1.57 2.36 78726-1031 3.00 78726-1045 1.57 78726-1012 Black 78726-1013 1.57 2.36 3.00 Black 78726-1014 1.57 78726-1015 Off-white 78726-1033 2.36 3.00 1.57 78726-1016 78726-1017 Black 78726-1034 2.36 3.00 Off-white 78726-1018 1.57 Off-white 78726-1019 1.57 2.36 78726-1035 3.00 78726-1020 1.57 78726-1021 78726-1036 78726-1024 PS-78726-002 2.36 3.00 Off-white 78726-1009 78726-1048 0.38μm (15μ”) Gold (Au) on contact; 2.54μm (100μ”) Tin (Sn) on soldertails; 1.27μm (50μ”) Nickel (Ni) underplate 2.36 1.57 78726-1007 78726-1032 PS-78726-001 1.57 3.00 78726-1006 78726-1044 0.76μm (30μ") Gold (Au) on contact; 2.54μm (100μ") Tin (Sn) on soldertails; 1.27μm (50μ") Nickel (Ni) underplate 3.00 78726-1005 78726-1008 Product Specification 1.57 Black 78726-1004 78726-1028 Plating Blue 3.00 Blue 78726-1025 2.36 1.57 Off-white 78726-1037 2.36 3.00 SMT Versions Order No. 78730-1002 78730-1003 78730-1004 78730-1005 Housing Color Black Off-white Latch Color Plating Product Specification 0.76μm (30μ") Gold (Au) on contact; 2.54μm (100μ") Tin (Sn) on soldertails; 1.27μm (50μ") Nickel (Ni) underplate PS-78730-001 Black Off-white Black Off-white www.molex.com/link/ddr4.html Order No. 987650-9721 Printed in USA/KC/2012.11 ©2012 Molex DDR4 DIMM Sockets, Halogen-free Applications Data/Computing – High-end computing – Personal computers Telecommunications/Networking – Infrastructure – Networking Servers Data centers Networking systems www.molex.com/link/ddr4.html Order No. 987650-9721 Rev. 1 Printed in USA/KC/2012.11 ©2012 Molex