87775-1101

87775-1101

  • 厂商:

    MOLEX10(莫仕)

  • 封装:

  • 描述:

    87775-1101 - 1.00mm (.039) Pitch DDR2 DIMM Socket, Through Hole, 0.76μm (30μ) Gold (Au), 4.00mm (0.1...

  • 详情介绍
  • 数据手册
  • 价格&库存
87775-1101 数据手册
This document was generated on 05/27/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Description: 0877751101 Active 1.00mm (.039") Pitch DDR2 DIMM Socket, Through Hole, 0.76µm (30µ") Gold (Au), 4.00mm (0.157") Soldertail, 276 Circuits, Lead free Documents: 3D Model Drawing (PDF) Product Specification PS-87775-018 (PDF) RoHS Certificate of Compliance (PDF) Series Memory Module Sockets 87775 Socket N/A DDR2 DIMM image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Not Reviewed Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. General Product Family Series Component Type JEDEC Outline Product Name Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) Entry Angle Function Key Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Temperature Range - Operating Termination Interface: Style 276 276 Black, Natural 25 Vertical None Yes Brass, Phosphor Bronze Gold Tin High Temperature Thermoplastic 0.157 In 4.00 mm Yes Yes 0.118 In 3.00 mm Tray 0.039 In 1.00 mm 0.039 In 1.00 mm 30.4 0.76 101.6 2.54 -55°C to +85°C Through Hole Search Parts in this Series 87775Series Electrical Current - Maximum per Contact Voltage - Maximum Voltage Key 0.5A 30V AC (RMS)/DC Center Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 10 SMC & Wave Capable (TH only) 1 260 Material Info Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-87775-001 PS-87775-018, RPS-87775-020 SD-87775-002 This document was generated on 05/27/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
87775-1101
1. 物料型号: - 型号:0877751101 - 状态:Active(活跃) - 描述:1.00mm (.039") 间距 DDR2 DIMM 插座,通孔,0.76um (30") 金(4.00mm (0.157") 焊尾,276路,无铅)

2. 器件简介: - 产品系列:Memory Module Sockets - 组件类型:Socket - JEDEC轮廓:N/A - 产品名称:DDR2 DIMM - 物理电路(已加载):276

3. 引脚分配: - 最大电路数:276

4. 参数特性: - 树脂颜色:黑色,自然色 - 耐用性(最大插拔次数):25 - 进入角度:垂直 - 功能键:无 - 与配对部件的键合:是 - 金属材质:黄铜,磷青铜 - 接触镀层:金 - 终止镀层:锡 - 树脂材质:高温热塑性塑料 - PCB尾长:4.00mm - PCB定位器:有 - PCB保持:有 - 推荐PCB厚度:3.00mm - 接口间距:1.00mm - 接触镀层最小厚度:0.76um - 终止镀层最小厚度:2.54um - 工作温度范围:-55°C至+85°C - 终止接口样式:通孔

5. 功能详解: - 每个接触点最大电流:0.5A - 最大电压:30V AC(RMS)/DC - 焊接过程数据:在最大过程温度下持续时间为10秒,适用于表面贴装和波峰焊(仅限通孔)

6. 应用信息: - 该插座适用于DDR2 DIMM内存模块,提供276个物理电路连接。

7. 封装信息: - 包装类型:托盘装 - 接口间距:1.00mm
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