87831-2010

PRODUCT SPECIFICATION 1.0 SCOPE This specification covers the performance requirements for Milli-Grid 2mm Dual Row Shrouded Headers. 2.0 PRODUCT DESCRIPTION 2.1 Product covered by this specification are for series number Product Name MGrid Headers (Vertical) MGrid Headers (SMT) MGrid Headers (R/A) Part Number 87831 Series 87832 Series 87833 Series These series mate with Molex : a. Milli-Grid 2mm Grid Wire to Board Connector, Crimp Receptacle Housing, 51110 series and Crimp Terminal, 50394 series. b. 2mm Milli-Grid Dual Row IDT, 87568 series. 2.2 For dimensions, materials & plating, refer to the appropriate product drawings. 2.3 Safety Agency Approvals: UL File Number : E29179 CSA File Number : LR19980 3.0 APPLICABLE DOCUMENTS AND SPECIFICATIONS The following documents are part of this specification to the extent specified herewith. In the event of conflict between the requirements of this specification and the product drawing, the product drawing shall take precedence. In the event of conflict between the requirements of this specification and reference documents, this specification shall take the precedence. MIL-STD-202 Test Methods for Electrical and Electronic Component Parts. MIL-STD-1344 Test Methods of Electrical Connector Reference Product Specifications PS-51110-001 Milli-Grid 2mm Grid Wire to Board Connector PS-87568-004 2mm Milli-Grid Dual Row IDT Receptacle REVISION: ECR/ECN INFORMATION: TITLE: A3 EC No: S2014-0174 DATE: 2013/07/18 DOCUMENT NUMBER: PS-87831-027 MILLIGRID 2MM DUAL ROW SHROUDED HEADERS SHEET No. 1 of 4 CREATED / REVISED BY: CHECKED BY: APPROVED BY: AT SEE 2013/07/18 SK Ang 2013/08/16 ML Ong 2013/08/16 TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC PRODUCT SPECIFICATION 4.0 RATINGS 4.1 Voltage : 125 4.2 Current : 2.00 Amp MAXIMUM 4.3 Operating Temperature : -55°C to +105°C Non-operating Temperature : -55°C to +105°C 5.0 PERFORMANCE 5.1 ELECTRICAL REQUIREMENTS ITEM DESCRIPTION TEST CONDITION REQUIREMENT 1 Insulation Resistance Apply 500 VDC for 1 minute per MIL-STD-1344A, METHOD 3003.1 1000 Megaohms Minimum 2 Dielectric Strength 1000 Vrms for 1 minute between adjacent terminals. No breakdown 5.2 MECHANICAL REQUIREMENTS ITEM 3 DESCRIPTION Pin/ Terminal Retention Force (in Housing) TEST CONDITION Apply an axial load on the terminal in the Retention Force: 850 g housing to dislodge the terminals from the Min per pin. connector at a rate of 0.50 inch per minute (Before heat soldering) REVISION: ECR/ECN INFORMATION: TITLE: A3 EC No: S2014-0174 DATE: 2013/07/18 DOCUMENT NUMBER: PS-87831-027 REQUIREMENT MILLIGRID 2MM DUAL ROW SHROUDED HEADERS SHEET No. 2 of 4 CREATED / REVISED BY: CHECKED BY: APPROVED BY: AT SEE 2013/07/18 SK Ang 2013/08/16 ML Ong 2013/08/16 TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC PRODUCT SPECIFICATION 5.3 ENVIROMENT REQUIREMENTS 4. Solderability 5. Resistance to Soldering Heat (Through Hole) 95% of the immersed area must show no voids, pin holes. Solder Time: 5 +/-0.5 secs. Solder Temperature: 260+/- 5°C Solder tail to be dipped in flux as per MILSTD-202F method 210 condition B. No damage in appearance of the connector Solder Temperature: 260 +/- 5°C Solder Time: 10 +/- 1 secs Pass product through IR machine for 3 cycles of the following reflow profile: Resistance to IR reflow heat (SMT) Average Ramp Rate Preheat Temp. (Min.) Preheat Temp. (Max.) Preheat Time Ramp to Peak Time over liquidus (217°C) Peak Temperature Time within 5°C of peak Ramp – Cool Down Time 25°C to Peak 3°C/sec max. 150°C 200°C 60 – 180 sec No damage in appearance of 3°C/sec max. the connector 60 – 150 sec 260 +0/-5°C 20 – 40 sec. 6°C/sec max. 8 mins max. Reflow Temperature Profile 6. 6.0 Packaging Product shall be packed in either Tube or Tape & Reel and protected against damage during handling, transportation and storage. REVISION: ECR/ECN INFORMATION: TITLE: A3 EC No: S2014-0174 DATE: 2013/07/18 DOCUMENT NUMBER: PS-87831-027 MILLIGRID 2MM DUAL ROW SHROUDED HEADERS SHEET No. 3 of 4 CREATED / REVISED BY: CHECKED BY: APPROVED BY: AT SEE 2013/07/18 SK Ang 2013/08/16 ML Ong 2013/08/16 TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC PRODUCT SPECIFICATION 7.0 Special Instructions for High-temperature Reflow Processing Only Background The products covered in this specification are molded with a high-temperature thermoplastic resin that can withstand the effects of elevated temperatures as seen in today’s reflow soldering processes. This high temperature resin, like many used in the electronics industry, is hygroscopic in nature, meaning it can absorb/desorb moisture readily. Depending on the degree of elevated ambient temperature and relative humidity, the connectors may absorb an increased percentage of moisture. This increase in percentage of absorption is also dependent on the exposure time once connectors are removed from the sealed moisture barrier bags. Higher levels of moisture absorption are typically non-detrimental in most situations but when combined with the elevated peak temperatures and dwell times seen in reflow solder processes trapped gasses and moisture can sometimes result in blistering of the plastic housing. Floor Life In view of the hygroscopic nature of the resin, proper handling and storage are required if connectors will be processed or exposed to the higher temperatures of reflow soldering. Storage exposure time begins once connectors have been removed from sealed moisture barrier bags. Greater exposure time, storage and processing temperatures, ambient humidity and part geometry are influencing factors. As such, if connectors are used in a reflow soldering environment, it is recommended that upon removal from the moisture barrier bag, they should be consumed within 48 hours with a temperature and humidity level of not more than 30°C and 60% RH respectively. For unused quantity, it is recommended to repack within 24 hours into the moisture barrier bag and vacuum sealed prior to storage for future use. Precautions and Remedy To minimize moisture absorption, connectors are supplied in sealed moisture barrier bags with desiccant pouches. It is recommended that the connectors remain sealed in moisture barrier bags until they are ready to be consumed, following the above storage guideline. However, in the event the connectors are removed from the moisture barrier bag and have been exposed to conditions beyond the storage guideline, it is recommended that the connectors to be baked to remove moisture. Exposed connectors may be baked at 125°C for 3 to 5 hours and thereafter, they should be good for reflow soldering. REVISION: ECR/ECN INFORMATION: TITLE: A3 EC No: S2014-0174 DATE: 2013/07/18 DOCUMENT NUMBER: PS-87831-027 MILLIGRID 2MM DUAL ROW SHROUDED HEADERS SHEET No. 4 of 4 CREATED / REVISED BY: CHECKED BY: APPROVED BY: AT SEE 2013/07/18 SK Ang 2013/08/16 ML Ong 2013/08/16 TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC