87832-1007

厂商：
MOLEX10(莫仕)
封装：
描述：
87832-1007 - 2.00mm (.079) Pitch Milli-Grid™ Header, Surface Mount, Vertical, Shrouded, Leadfree, 10...

数据手册：

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数据手册
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87832-1007 数据手册

This document was generated on 05/25/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0878321007 Active milligrid 2.00mm (.079") Pitch Milli-Grid™ Header, Surface Mount, Vertical, Shrouded, Leadfree, 10 Circuits, 0.76µm (30µ") Gold (Au) Plating, with Locking Window, Pick-andPlace Cap, PCB Locator, Embossed Tape on Reel Documents: 3D Model Drawing (PDF) Product Specification PS-87831-027 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only Series Agency Certification CSA UL LR19980 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. General Product Family Series Application Comments Overview Product Name PCB Headers 87832 Wire-to-Board With Cap|Contact Molex for application in automotive industry milligrid Milli-Grid™ Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin First Mate / Last Break Flammability Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PCB Locator PCB Retention Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to Mating Part Polarized to PCB Shrouded Stackable No 10 10 Black No 94V-0 No No Yes Yes Phosphor Bronze Gold Tin Nylon 2 Vertical Yes None Embossed Tape on Reel 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.76 75 1.88 Side Slots (2) No Fully No Search Parts in this Series 87832Series Mates With 50394 Wire-to-Board Terminals. 51110 Wire-to-Board Crimp Housing. 87568 Wireto-Board IDT Housings. 79107 Board-toBoard Top Entry Through Hole Receptacle. 79108 Board-to-Board FFC/FPC Top Entry Through Hole Receptacle. L Temperature Range - Operating Termination Interface: Style -55°C to +105°C Surface Mount Electrical Current - Maximum per Contact Voltage - Maximum 2A 125V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 10 Reflow Capable (SMT only) 1 260 Material Info Reference - Drawing Numbers Product Specification Sales Drawing PS-87831-027 SD-87832-011 This document was generated on 05/25/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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87832-1007

1. 物料型号： - 型号：0878321007

2. 器件简介： - 产品名称：Milli-Grid™ - 描述：2.00mm (.079") 间距 Mili-Grid™ 标头，表面贴装，垂直，带护罩，无铅，10电路，0.76um (30) 金 (Au) 镀层，带锁定窗口，取放帽，PCB定位器，压花胶带卷装。

3. 引脚分配： - 电路（已加载）：10 - 电路（最大）：10

4. 参数特性： - 间距 - 接口（英寸）：0.079 In - 间距 - 接口（毫米）：2.00 mm - 镀层最小 - 接口（uin）：30 - 镀层最小 - 接口（um）：0.76 - 镀层最小 - 终止（uin）：75 - 镀层最小 - 终止（um）：1.88

5. 功能详解： - 应用：线对板 - 极化到配对部分：侧槽（2） - 完全护罩：是 - 堆叠：否 - 操作温度范围：-55°C 至 +105°C - 电气：每个接触点最大电流2A，最大电压125V

6. 应用信息： - 与50394线对板端子、51110线对板压接外壳、87568线对板IDT外壳、79107板对板顶部通孔插座、79108板对板FFC/FPC顶部通孔插座兼容。

7. 封装信息： - 封装类型：压花胶带卷装 - 定位：垂直 - PCB定位器：是 - PCB保持：无

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