87832-1210

厂商：
MOLEX10(莫仕)
封装：
描述：
87832-1210 - 2.00mm (.079) Pitch Milli-Grid™ Header, Surface Mount, Vertical, Shrouded, Leadfree 12 ...

数据手册：

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87832-1210 数据手册

This document was generated on 05/25/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0878321210 Active milligrid 2.00mm (.079") Pitch Milli-Grid™ Header, Surface Mount, Vertical, Shrouded, Leadfree, 12 Circuits, 0.38µm (15µ") Gold (Au) Plating, with Locking Window, without Cap, PCB Locator, Tube Documents: 3D Model Drawing (PDF) Product Specification PS-87831-027 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only Series Agency Certification CSA UL LR19980 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. General Product Family Series Application Comments Overview Product Name PCB Headers 87832 Wire-to-Board Contact Molex for application in automotive industry milligrid Milli-Grid™ Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin First Mate / Last Break Flammability Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PCB Locator PCB Retention Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to Mating Part Polarized to PCB Shrouded Stackable Temperature Range - Operating No 12 12 Black No 94V-0 No No Yes Yes Phosphor Bronze Gold Tin Nylon 2 Vertical Yes None Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 15 0.38 75 1.88 Side Slots (2) No Fully No -55°C to +105°C Search Parts in this Series 87832Series Mates With 50394 Wire-to-Board Terminals. 51110 Wire-to-Board Crimp Housing. 87568 Wireto-Board IDT Housings. 79107 Board-toBoard Top Entry Through Hole Receptacle. 79108 Board-to-Board FFC/FPC Top Entry Through Hole Receptacle. L Termination Interface: Style Surface Mount Electrical Current - Maximum per Contact Voltage - Maximum 2A 125V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 10 Reflow Capable (SMT only) 1 260 Material Info Reference - Drawing Numbers Product Specification Sales Drawing PS-87831-027 SD-87832-010 This document was generated on 05/25/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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87832-1210

1. 物料型号： - Part Number: 0878321210

2. 器件简介： - 产品名称：Milli-Grid™ - 描述：2.00mm (.079") 间距的Milli-Grid™ 插座，表面贴装，垂直方向，带护罩，无铅，12路，0.38m (15") 金(Au)镀层，带锁定窗口，无盖帽，PCB定位，管装。

3. 引脚分配： - 电路（已加载）：12路 - 最大电路数：12路

4. 参数特性： - 间距：0.079英寸（2.00mm） - 镀层：金（Au）镀层，接触区域0.38um/5uin，端子区域1.88um/75uin，最小锡镀层 - 材料：金属为磷青铜，树脂为尼龙 - 极化：与配合部件侧槽（2）极化 - 完全带护罩 - 温度范围：-55°C至+105°C

5. 功能详解： - 该产品为Wire-to-Board应用，可与多种Molex产品配合使用，如50394线对板端子、51110线对板压接式外壳等。

6. 应用信息： - 应用于线对板的连接，如需在汽车工业中应用，请联系Molex。

7. 封装信息： - 封装类型：管装 - 引脚间距：2.00mm - 垂直方向的PCB定位

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