87832-2021

厂商：
MOLEX10(莫仕)
封装：
SMD
描述：

数据手册：

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数据手册
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87832-2021 数据手册

This document was generated on 05/25/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0878322021 Active milligrid 2.00mm (.079") Pitch Milli-Grid™ Header, Surface Mount, Vertical, Shrouded, Leadfree, 20 Circuits, 0.76µm (30µ") Gold (Au) Plating, with Locking Windows and Center Polarization Slot, PCB Locator, Tube Documents: 3D Model Drawing (PDF) Product Specification PS-87831-027 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only Series Agency Certification CSA UL LR19980 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. General Product Family Series Application Comments Overview Product Name PCB Headers 87832 Wire-to-Board Without Cap; Contact Molex for application in automotive industry milligrid Milli-Grid™ Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin First Mate / Last Break Flammability Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PCB Locator PCB Retention Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to Mating Part Polarized to PCB Shrouded Stackable No 20 20 Black No 94V-0 No No Yes Yes Phosphor Bronze Gold Tin Nylon 2 Vertical Yes None Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.76 75 1.88 Side Slots (2) No Fully No Search Parts in this Series 87832Series Mates With 50394 Wire-to-Board Terminals. 51110 Wire-to-Board Crimp Housing. 87568 Wireto-Board IDT Housings. 79107 Board-toBoard Top Entry Through Hole Receptacle. 79108 Board-to-Board FFC/FPC Top Entry Through Hole Receptacle. L Temperature Range - Operating Termination Interface: Style -55°C to +105°C Surface Mount Electrical Current - Maximum per Contact Voltage - Maximum 2A 125V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 10 Reflow Capable (SMT only) 1 260 Material Info Reference - Drawing Numbers Product Specification Sales Drawing PS-87831-027 SD-87832-007 This document was generated on 05/25/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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87832-2021

1. 物料型号： - 型号：0878322021 - 状态：Active（活跃）

2. 器件简介： - 描述：2.00mm (.079") 间距 Milli-Grid™ 插座，表面贴装，垂直，带护罩，L型自由，20路，0.76m (30") 金 (Au) 镀层，带锁定窗口和C极化槽，PCB定位器。

3. 引脚分配： - 电路（已加载）：20路 - 电路（最大）：20路

4. 参数特性： - 颜色 - 树脂：黑色 - 阻燃性：94V-0 - 金属材质：磷青铜 - 镀层 - 接触：金 - 镀层 - 终止：锡 - 树脂材质：尼龙 - 行数：2 - 方向：垂直 - 间距 - 接口（英寸）：0.079 In - 间距 - 接口（毫米）：2.00 mm - 镀层最小值：接触（微英寸）：30，接触（微米）：0.76，终止（微英寸）：75，终止（微米）：1.88

5. 功能详解： - 该产品为Mii-Grid™系列，应用于线对板连接，无盖帽；如需在汽车工业中应用，请联系Molex。

6. 应用信息： - 与50394线对板端子、51110线对板压接外壳、87568线对板IDT外壳兼容。适用于-55°C至+105°C表面贴装。

7. 封装信息： - 封装类型：管装 - 引脚间距：2.00mm - 操作温度范围：-55°C至+105°C - 电气特性：最大电流每接触2A，最大电压125V。

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