87833-0420

厂商：
MOLEX10(莫仕)
封装：
-
描述：
CONN HEADER 4POS 2MM RT ANG GOLD

数据手册：

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数据手册
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87833-0420 数据手册

This document was generated on 06/08/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0878330420 Active milligrid 2.00mm (.079") Pitch Milli-Grid™ Header, Right Angle, Shrouded, Lead-free, 4 Circuits, 0.38µm (15µ") Gold (Au) Plating, without PCB Locator, without Locking Window, without Center Polarization Slot, Tube Documents: 3D Model Drawing (PDF) Product Specification PS-87831-027 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only Series Agency Certification CSA UL LR19980 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. General Product Family Series Application Comments MolexKits Overview Product Name PCB Headers 87833 Wire-to-Board Contact Molex for application in automotive industry Yes milligrid Milli-Grid™ Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin First Mate / Last Break Flammability Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) No 4 4 Black No 94V-0 No No None None Phosphor Bronze Gold Tin Nylon 2 Right Angle 0.085 In 2.16 mm No None 0.062 In 1.60 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 15 0.38 75 1.88 Search Parts in this Series 87833Series Mates With 50394 Wire-to-Board Terminals. 51110 Wire-to-Board Crimp Housing. 87568 Wireto-Board IDT Housings. 79107 Board-toBoard Top Entry Through Hole Receptacle. 79108 Board-to-Board FFC/FPC Top Entry Through Hole Receptacle. L Polarized to Mating Part Polarized to PCB Shrouded Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No No Fully No Yes -55°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 2A 125V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 11 SMC & Wave Capable (TH only) 1 265 Material Info Reference - Drawing Numbers Product Specification Sales Drawing PS-87831-027 SD-87833-010 This document was generated on 06/08/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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87833-0420

1. 物料型号： - 型号：0878330420

2. 器件简介： - 描述：2.00mm (.079") 间距 Mili-Grid™ 直角、带护套、无铅、4路0.38m (15") 金 (Au) 镀层，无PCB定位器，无锁定窗口，无中心极化槽，管装。

3. 引脚分配： - 电路（已加载）：4路 - 电路（最大）：4路

4. 参数特性： - 耐燃性：94V-0 - 金属材质：磷青铜 - 金属镀层：金 - 镀层终止：锡 - 树脂材质：尼龙 - 行数：2 - 角度：直角 - PCB尾长：0.085英寸（2.16毫米） - 推荐PCB厚度：0.062英寸（1.60毫米） - 间距：2.00mm

5. 功能详解： - 该产品为Molex的PCB头，适用于线对板连接，不适用于汽车行业的应用需联系Molex。 - 与50394线对板端子、51110线对板压接外壳、87568线对板IDT外壳兼容。

6. 应用信息： - 应用：线对板 - MolexKits：是

7. 封装信息： - 封装类型：管装 - 间距：2.00mm - 镀层最小：配合界面15微英寸（0.38微米），终止界面75微英寸（1.88微米）

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