87833-2421

87833-2421

  • 厂商:

    MOLEX10(莫仕)

  • 封装:

  • 描述:

    87833-2421 - 2.00mm (.079) Pitch Milli-Grid™ Header, Right Angle, Shrouded, Lead-free, 24 Circuits, ...

  • 详情介绍
  • 数据手册
  • 价格&库存
87833-2421 数据手册
This document was generated on 05/25/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0878332421 Active milligrid 2.00mm (.079") Pitch Milli-Grid™ Header, Right Angle, Shrouded, Lead-free, 24 Circuits, 0.76µm (30µ") Gold (Au) Plating, without PCB Locator, with Locking Windows, Center Polarization Slot, Tube Documents: 3D Model Drawing (PDF) Product Specification PS-87831-027 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only Series Agency Certification CSA UL LR19980 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. General Product Family Series Application Comments Overview Product Name PCB Headers 87833 Wire-to-Board Contact Molex for application in automotive industry milligrid Milli-Grid™ Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) No 24 24 Black 100 No 94V-0 No No None Yes Phosphor Bronze Gold Tin Nylon 2 Right Angle 0.085 In 2.16 mm No None 0.062 In 1.60 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.76 75 1.88 Search Parts in this Series 87833Series Mates With 50394 Wire-to-Board Terminals. 51110 Wire-to-Board Crimp Housing. 87568 Wireto-Board IDT Housings. 79107 Board-toBoard Top Entry Through Hole Receptacle. 79108 Board-to-Board FFC/FPC Top Entry Through Hole Receptacle. L Polarized to Mating Part Polarized to PCB Shrouded Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style Side Slots (2) No Fully No Yes -55°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 2A 125V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 11 SMC & Wave Capable (TH only) 1 265 Material Info Reference - Drawing Numbers Product Specification Sales Drawing PS-87831-027 SD-87833-010 This document was generated on 05/25/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
87833-2421
1. 物料型号: - 型号:0878332421

2. 器件简介: - 描述:2.00mm (.079") 间距 Milli-Grid™ 直角、带护套、无铅、24路、0.76µm (30µ") 金 (Au) 镀层,无PCB定位器,带锁定窗口,中心极化槽,管状封装。

3. 引脚分配: - 引脚数量:24路

4. 参数特性: - 间距:2.00mm (0.079") - 镀层:最小30µin (0.76µm) 金 (Au) 镀层在接触点,最小75µin (1.88µm) 锡 (Sn) 镀层在终止点 - 材料:金属部件为磷青铜,塑料部件为尼龙 - 极化:与PCB接触面和护套堆叠极化 - 工作温度范围:-55°C至+105°C

5. 功能详解: - 该器件为Wire-to-Board应用,适用于汽车行业的应用需联系Molex - 与50394系列Wire-to-Board端子、51110系列Wire-to-Board压接外壳、87568系列Wire-to-Board IDT外壳兼容 - 电气特性:最大电流每接触点2A,最大电压125V

6. 应用信息: - 适用于Wire-to-Board应用,特别是在汽车行业中

7. 封装信息: - 封装类型:管状封装 - 推荐PCB厚度:0.062英寸 (1.60mm)
87833-2421 价格&库存

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