87966-0002

87966-0002

  • 厂商:

    MOLEX10(莫仕)

  • 封装:

  • 描述:

    87966-0002 - 1.00mm (.039) Pitch DDR2 DIMM Socket, SMT, 0.76μm (30μ) Gold (Au), 240 Circuit, Lead fr...

  • 详情介绍
  • 数据手册
  • 价格&库存
87966-0002 数据手册
This document was generated on 04/09/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Description: 0879660002 Active 1.00mm (.039") Pitch DDR2 DIMM Socket, SMT, 0.76µm (30µ") Gold (Au), 240 Circuit, Lead free Documents: 3D Model Drawing (PDF) RoHS Certificate of Compliance (PDF) Agency Certification UL E29179 Series image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Not Reviewed Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. General Product Family Series Component Type JEDEC Outline Product Name Memory Module Sockets 87966 Socket MO-237 DDR2 DIMM Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) Entry Angle Flammability Function Key Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Temperature Range - Operating Termination Interface: Style 240 240 Black 25 Vertical 94V-0 None Yes Brass, Phosphor Bronze Gold Tin High Temperature Thermoplastic 0.000 In 0.00 mm Yes Yes 0.000 In 0.00 mm Tray 0.039 In 1.00 mm 0.039 In 1.00 mm 30 0.76 100 2.54 -10°C to +85°C Surface Mount Search Parts in this Series 87966Series Electrical Current - Maximum per Contact Voltage - Maximum Voltage Key 1A 30V AC (RMS)/DC Center Solder Process Data Duration at Max. Process Temperature (seconds) 3 Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C Reflow Capable (SMT only) 1 250 Material Info Reference - Drawing Numbers Product Specification Sales Drawing RPS-87966-001 SD-87966-002 This document was generated on 04/09/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
87966-0002
物料型号: - 型号:0879660002

器件简介: - 描述:1.00mm (.039") 间距 DDR2 DIMM插座,表面贴装,0.76m (30") 金。 - 产品家族:Memory Module Sockets - 系列:87966 - 组件类型:Socket - JEDEC外形:MO-237 - 产品名称:DDR2 DIMM

引脚分配: - 物理引脚数(已加载):240 - 最大引脚数:240

参数特性: - 颜色 - 树脂:黑色 - 耐久性(最大插拔次数):25次 - 进入角度:垂直 - 阻燃性:94V-0 - 功能键:无 - 与配对部件的键合:是 - 材料 - 金属:黄铜,磷青铜 - 材料 - 镀层配对:金 - 材料 - 镀层终止:锡 - 材料 - 树脂:高温热塑性塑料 - PCB定位/PCB保持:是 - PCB厚度推荐(英寸):0.000英寸 - PCB厚度推荐(毫米):0.00毫米 - 包装类型:托盘 - 间距 - 配对接口(英寸):0.039英寸 - 间距 - 配对接口(毫米):1.00毫米 - 间距 - 端子接口(英寸):0.039英寸 - 间距 - 端子接口(毫米):1.00毫米 - 镀层最小值:配对(微英寸):30 - 镀层最小值:配对(微米):0.76 - 镀层最小值:终止(微英寸):100 - 镀层最小值:终止(微米):2.54 - 工作温度范围:-10°C至+85°C - 终止接口:表面贴装

功能详解: - 电气特性: - 每个接触点最大电流:1A - 最大电压:30V AC(RMS)/DC - 焊接过程数据:在最大过程温度下持续时间(秒):3

应用信息: - 该产品为DDR2 DIMM插座,适用于内存模块的连接。

封装信息: - 封装类型:表面贴装 - 封装材料:高温热塑性塑料
87966-0002 价格&库存

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