90130-1308

90130-1308

  • 厂商:

    MOLEX10(莫仕)

  • 封装:

  • 描述:

    90130-1308 - 2.54mm (.100) Pitch C-Grid III™ Header, Dual Row, Vertical, Shrouded, Fully Loaded, 8 C...

  • 详情介绍
  • 数据手册
  • 价格&库存
90130-1308 数据手册
This document was generated on 05/25/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0901301308 Active cgrid_iii 2.54mm (.100") Pitch C-Grid III™ Header, Dual Row, Vertical, Shrouded, Fully Loaded, 8 Circuits, Black, 0.76µm (30µ") Gold (Au) Selective Plating Documents: 3D Model Drawing (PDF) RoHS Certificate of Compliance (PDF) Series General Product Family Series Application Overview Product Name PCB Headers 90130 Wire-to-Board cgrid_iii C-Grid III™ image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to Mating Part Polarized to PCB Shrouded Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No 8 8 Black 200 No No No None Yes Brass Gold Tin Polyester 2 Vertical 0.114 In 2.90 mm No None 0.063 In 1.60 mm Tray 0.100 In 2.54 mm 0.100 In 2.54 mm 30.48 0.762 120 3 Yes No Closed Ends No No -55°C to +125°C Through Hole Search Parts in this Series 90130Series Mates With 90142 C-Grid III™ Crimp Housing Electrical Current - Maximum per Contact Voltage - Maximum 3A 350V AC/DC Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 Wave Capable (TH only) 1 260 Material Info Reference - Drawing Numbers Packaging Specification Sales Drawing PK-90130-001, PK-91814-005 SDA-90130 This document was generated on 05/25/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
90130-1308
1. 物料型号: - Part Number: 0901301308 - Status: Active - Series: 90130

2. 器件简介: - Product Family: PCB Headers - Product Name: C-Grid II™ - Overview: 2.54mm (.100") Pitch C-Grid II™ Header, Dual Row, Vertical, Shrouded, Fully Loaded 8 Circuits, Black, 0.76 m (30") Gold (Au) Selective Plating

3. 引脚分配: - Circuits (Loaded): 8 - Number of Rows: 2

4. 参数特性: - Color - Resin: Black - Durability (mating cycles max): 200 - Material - Metal: Brass - Material - Plating Mating: Gold - Material - Plating Termination: Tin - Material - Resin: Polyester - Orientation: Vertical - PCB Thickness Recommended: 0.063 In (1.60 mm) - Pitch - Mating Interface: 2.54 mm - Plating min: Mating: 0.762 um - Polarized to Mating Part: Yes - Shrouded: Closed Ends - Temperature Range - Operating: -55°C to +125°C - Termination Interface: Style - Through Hole

5. 功能详解: - The C-Grid II™ series is designed for Wire-to-Board applications and features a dual row, vertical, shrouded header with gold selective plating for reliable electrical connections.

6. 应用信息: - Application: Wire-to-Board

7. 封装信息: - The header is available in a fully loaded configuration with 8 circuits and has a vertical orientation. It is shrouded with closed ends for protection and is polarized to the mating part.
90130-1308 价格&库存

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