90130-1312

90130-1312

  • 厂商:

    MOLEX10(莫仕)

  • 封装:

  • 描述:

  • 详情介绍
  • 数据手册
  • 价格&库存
90130-1312 数据手册
This document was generated on 05/25/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0901301312 Active cgrid_iii 2.54mm (.100") Pitch C-Grid III™ Header, Dual Row, Vertical, Shrouded, Fully Loaded, 12 Circuits, Black, 0.76µm (30µ") Gold (Au) Selective Plating Documents: 3D Model Drawing (PDF) RoHS Certificate of Compliance (PDF) Series General Product Family Series Application Overview Product Name PCB Headers 90130 Wire-to-Board cgrid_iii C-Grid III™ image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to Mating Part Polarized to PCB Shrouded Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No 12 12 Black 200 No No No None Yes Brass Gold Tin Polyester 2 Vertical 0.114 In 2.90 mm No None 0.063 In 1.60 mm Tray 0.100 In 2.54 mm 0.100 In 2.54 mm 30.48 0.762 120 3 Yes No Closed Ends No No -55°C to +125°C Through Hole Search Parts in this Series 90130Series Mates With 90142 C-Grid III™ Crimp Housing Electrical Current - Maximum per Contact Voltage - Maximum 3A 350V AC/DC Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 Wave Capable (TH only) 1 260 Material Info Reference - Drawing Numbers Packaging Specification Sales Drawing PK-90130-001, PK-91814-005 SDA-90130 This document was generated on 05/25/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
90130-1312
1. 物料型号: - 型号:0901301312 - 状态:Active(活跃)

2. 器件简介: - 产品系列:Series 90130 - 应用:Wire-to-Board(线对板) - 产品名称:C-Grid III™ - 描述:2.54mm (.100") 间距 C-Grid III™ 插座,双排,垂直,带护套,全装,12路,黑色,0.76µm (30µ") 金 (Au) 选择性镀层

3. 引脚分配: - 最大引脚数:12 - 已装引脚数:12

4. 参数特性: - 颜色 - 树脂:黑色 - 耐用性(最大插拔次数):200次 - 材料 - 金属:黄铜 - 材料 - 镀层:金 - 材料 - 镀层终止:锡 - 行数:2 - 材料 - 树脂:聚酯 2 - 引脚长度(英寸):0.114 In - 引脚长度(毫米):2.90 mm - 推荐PCB厚度(英寸):0.063 In - 推荐PCB厚度(毫米):1.60 mm - 包装类型:Tray(托盘) - 接口 - 配对界面(英寸):0.100 In - 接口 - 配对界面(毫米):2.54 mm - 接口 - 终端界面(英寸):0.100 In - 接口 - 终端界面(毫米):2.54 mm - 镀层最小值:配对(µin)30.48 - 镀层最小值:配对(µm)0.762 - 镀层最小值:终止(µin)120 - 镀层最小值:终止(µm)3 - 极化到配对部分:是 - 极化到PCB:否 - 护套:闭端 - 可堆叠:否 - 表面安装兼容(SMC):否 - 工作温度范围:-55°C至+125°C - 终止接口:通孔式

5. 功能详解: - 该产品为C-Grid III™系列的插座,具有双排、垂直、带护套和全装等特点,适用于线对板的连接方式。

6. 应用信息: - 适用于线对板的连接。

7. 封装信息: - 封装类型:通孔式 - 封装细节:垂直安装,带护套,全装。
90130-1312 价格&库存

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