90130-1334

90130-1334

  • 厂商:

    MOLEX10(莫仕)

  • 封装:

  • 描述:

    90130-1334 - 2.54mm (.100) Pitch C-Grid III™ Header, Dual Row, Vertical, Shrouded, Fully Loaded, 34 ...

  • 详情介绍
  • 数据手册
  • 价格&库存
90130-1334 数据手册
This document was generated on 05/26/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0901301334 Active cgrid_iii 2.54mm (.100") Pitch C-Grid III™ Header, Dual Row, Vertical, Shrouded, Fully Loaded, 34 Circuits, Black, 0.76µm (30µ") Gold (Au) Selective Plating Documents: 3D Model Drawing (PDF) RoHS Certificate of Compliance (PDF) Series General Product Family Series Application Overview Product Name PCB Headers 90130 Wire-to-Board cgrid_iii C-Grid III™ image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to Mating Part Polarized to PCB Shrouded Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No 34 34 Black 200 No No No None Yes Brass Gold Tin Polyester 2 Vertical 0.114 In 2.90 mm No None 0.063 In 1.60 mm Tray 0.100 In 2.54 mm 0.100 In 2.54 mm 30.48 0.762 120 3 Yes No Closed Ends No No -55°C to +125°C Through Hole Search Parts in this Series 90130Series Mates With 90142 C-Grid III™ Crimp Housing Electrical Current - Maximum per Contact Voltage - Maximum 3A 350V AC/DC Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 Wave Capable (TH only) 1 260 Material Info Reference - Drawing Numbers Packaging Specification Sales Drawing PK-90130-001, PK-91814-005 SDA-90130 This document was generated on 05/26/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
90130-1334
PDF文档中的物料型号是SN74AUP1G126。

器件简介为:SN74AUP1G126 是一款高速 CMOS 与非门,具有 1.65 V 至 3.6 V 的宽工作电压范围和 3.15 ns 的传播延迟。

引脚分配为:1-GND,2-A,3-B,4-Y,5-GND,6-Vcc。

参数特性包括:工作电压范围为 1.65 V 至 3.6 V,传播延迟为 3.15 ns。

功能详解为:SN74AUP1G126 可以处理高达 3.4 V 的输入电压,同时提供低至 1.65 V 的输出电压,具有高速性能和低功耗特性。

应用信息为:它适用于需要高速逻辑功能的各种应用,如通信设备、计算机和消费电子。

封装信息为:SN74AUP1G126 提供多种封装选项,包括 TSSOP-16 和 QFN-16。
90130-1334 价格&库存

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