90130-3324

90130-3324

  • 厂商:

    MOLEX10(莫仕)

  • 封装:

  • 描述:

    90130-3324 - 2.54mm (.100) Pitch C-Grid III™ Header, Dual Row, Right Angle, Shrouded, Fully Loaded, ...

  • 详情介绍
  • 数据手册
  • 价格&库存
90130-3324 数据手册
This document was generated on 05/26/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0901303324 Active cgrid_iii 2.54mm (.100") Pitch C-Grid III™ Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 24 Circuits, Black 0.76µm (30µ") Gold (Au) Selective Plating Documents: 3D Model Drawing (PDF) RoHS Certificate of Compliance (PDF) Series General Product Family Series Application Overview Product Name PCB Headers 90130 Wire-to-Board cgrid_iii C-Grid III™ image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to Mating Part Polarized to PCB Shrouded Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No 24 24 Black 200 No No No None Yes Brass Gold Tin Polyester 2 Right Angle 0.114 In 2.90 mm No None 0.063 In 1.60 mm Tray 0.100 In 2.54 mm 0.100 In 2.54 mm 30.48 0.762 120 3 Yes No Closed Ends No No -55°C to +125°C Through Hole Search Parts in this Series 90130Series Mates With 90142 C-Grid III™ Crimp Housing Electrical Current - Maximum per Contact Voltage - Maximum 3A 350V AC/DC Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 Wave Capable (TH only) 1 260 Material Info Reference - Drawing Numbers Packaging Specification Sales Drawing PK-90130-001, PK-91814-005 SDA-90130 This document was generated on 05/26/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
90130-3324
物料型号: - 型号:0901303324 - 状态:Active - 描述:2.00mm Pitch, 24 Circuits, Black, 0.76um (30") Gold (Au) Selective Plating

器件简介: - 产品家族:PCB Headers - 系列:90130 - 应用:Wire-to-Board - 产品名称:C-Grid III - 物理特性:Breakaway, N242

引脚分配: - 电路(已加载):24 - 颜色 - 树脂:黑色 - 耐磨损(最大插拔次数):200 - 行数:2 - 引脚间距 - 接口(英寸):0.100 In - 引脚间距 - 接口(毫米):2.54 mm

参数特性: - 材料 - 金属:黄铜 - 材料 - 镀层:金 - 材料 - 镀层终止:锡 - 材料 - 树脂:聚酯 - PCB厚度推荐(英寸):0.063 In - PCB厚度推荐(毫米):1.60 mm - 包装类型:Tray

功能详解: - 极化到配对部件:是 - 极化到PCB:否 - 屏蔽:闭端 - 堆叠:否 - 表面安装兼容(SMC):否 - 操作温度范围:-55°C 至 +125°C - 终止接口:通孔

应用信息: - 与90142 C-Grid III™ Crimp Housing配对使用

封装信息: - 封装类型:DIP(双列直插式) - 封装尺寸:根据提供的不同型号,有多种尺寸选择,例如:X110、X210、X114、X212等。
90130-3324 价格&库存

很抱歉,暂时无法提供与“90130-3324”相匹配的价格&库存,您可以联系我们找货

免费人工找货