90136-1207

厂商：
MOLEX10(莫仕)
封装：
-
描述：

数据手册：

下载90136-1207.pdf

立即购买

详情介绍
数据手册
价格&库存

90136-1207 数据手册

This document was generated on 05/26/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0901361207 Active cgrid_iii 2.54mm (.100") Pitch C-Grid III™ Header, Single Row, Vertical, Shrouded, 7 Circuits, 0.38µm (15µ") Gold (Au) Selective Plating Documents: 3D Model Drawing (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only PCB Headers 90136 Wire-to-Board cgrid_iii C-Grid III™ EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. General Product Family Series Application Overview Product Name Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin First Mate / Last Break Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Shrouded Stackable Temperature Range - Operating Termination Interface: Style No 7 7 Black No No No None Yes Brass Gold Tin Polyester 1 Vertical 0.114 In 2.90 mm No None 0.062 In 1.60 mm Tray 0.100 In 2.54 mm 15.2 0.38 120 3 No Fully No -55°C to +125°C Through Hole Search Parts in this Series 90136Series Mates With 90123 C-Grid III™ Modular Crimp Housing. 90156 C-Grid III™ Crimp Housing Electrical Current - Maximum per Contact Voltage - Maximum 3A 350V Solder Process Data Lead-free Process Capability Wave Capable (TH only) Material Info Reference - Drawing Numbers Packaging Specification Sales Drawing PK-90136-001 SDA-90136 This document was generated on 05/26/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

下载 PDF

90136-1207

1. 物料型号： - 型号：0901361207 - 状态：Active（活跃）

2. 器件简介： - 产品系列：Series 90136 - 应用：Wire-to-Board（线对板） - 产品名称：C-Grid III™ - 概述：2.54mm (.100") 间距 C-Grid III™ 头部，单行，垂直，带护套，7电路，0.38µm (15µ") 金 (Au) 选择性镀金

3. 引脚分配： - 电路数（最大）：7 - 电路数（已加载）：7 - 行数：1 - 方向：垂直 - 引脚间距（接口）：2.54mm

4. 参数特性： - 金属材质：黄铜 - 镀金：金 - 镀锡：终止 - 树脂材料：聚酯 - 推荐PCB厚度：1.60mm - 工作温度范围：-55°C至+125°C - 最大电流每接触点：3A - 最大电压：350V

5. 功能详解： - 该产品为C-Grid III™系列的垂直头部，适用于线对板应用，具有7个电路，并且每个接触点都进行了0.38µm的金选择性镀金。产品完全带护套，但没有极化到PCB。

6. 应用信息： - 适用于线对板应用，与90123 C-Grid III™模块化压接外壳和90156 C-Grid III™压接外壳配合使用。

7. 封装信息： - 封装类型：Tray（托盘） - 引脚间距（接口）：2.54mm

90136-1207 价格&库存

-> 查询更多价格&库存

很抱歉，暂时无法提供与“90136-1207”相匹配的价格&库存，您可以联系我们找货

免费人工找货