90136-1214

90136-1214

  • 厂商:

    MOLEX10(莫仕)

  • 封装:

  • 描述:

    90136-1214 - 2.54mm (.100) Pitch C-Grid III™ Header, Single Row, Vertical, Shrouded, 14 Circuits, 0....

  • 详情介绍
  • 数据手册
  • 价格&库存
90136-1214 数据手册
This document was generated on 05/26/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0901361214 Active cgrid_iii 2.54mm (.100") Pitch C-Grid III™ Header, Single Row, Vertical, Shrouded, 14 Circuits, 0.38µm (15µ") Gold (Au) Selective Plating Documents: 3D Model Drawing (PDF) Product Specification PS-99020-0001 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only PCB Headers 90136 Wire-to-Board cgrid_iii C-Grid III™ EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. General Product Family Series Application Overview Product Name Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to Mating Part Polarized to PCB Shrouded Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No 14 14 Black 200 No No No None Yes Brass Gold Tin Polyester 1 Vertical 0.114 In 2.90 mm No None 0.063 In 1.60 mm Tray 0.100 In 2.54 mm 0.100 In 2.54 mm 15.2 0.38 120 3 No No Closed Ends No No -55°C to +125°C Through Hole Search Parts in this Series 90136Series Mates With 90123 C-Grid III™ Modular Crimp Housing. 90156 C-Grid III™ Crimp Housing Electrical Current - Maximum per Contact Voltage - Maximum 3A 350V AC/DC Solder Process Data Lead-free Process Capability Wave Capable (TH only) Material Info Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-90136-001 PS-99020-0001 SDA-90136 This document was generated on 05/26/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
90136-1214
物料型号: - 型号:0901361214 - 状态:Active(活跃)

器件简介: - 产品系列:Series 90136 - 应用:Wire-to-Board(线对板) - 产品名称:C-Grid III™ - 概述:2.54mm (.100") 间距 C-Grid III™ 插座,单排,垂直,带护套,14路,0.38µm (15µ") 金 (Au) 选择性镀层

引脚分配: - 最大引脚数:14 - 引脚已安装:14 - 引脚颜色:黑色树脂

参数特性: - 耐用性(最大插拔次数):200次 - 首次配对/最后断开:否 - 符合灼热丝测试:否 - 与配对部件的导向:无 - 与配对部件的锁定:是 - 金属材质:黄铜 - 镀层材质:镀金 - 镀层终止:镀锡 - 树脂材质:聚酯 - 行数:1 - 垂直方向 - PCB尾长:0.114英寸(2.90毫米) - PCB厚度推荐:0.063英寸(1.60毫米) - 包装类型:托盘 - 接口间距(配合界面):2.54毫米 - 镀层最小值:配合(0.38微米),终止(3微米) - 极化到配对部件:否 - 极化到PCB:否 - 护套:封闭端 - 堆叠:否 - 表面安装兼容(SMC):否 - 工作温度范围:-55°C至+125°C - 接口方式:通孔

功能详解: - 与90123 C-Grid III™ 模块化压接外壳和90156 C-Grid III™ 压接外壳配合使用。 - 电气特性:最大电流每接触3A,最大电压350V AC/DC,波峰焊能力(仅限通孔)。

应用信息: - 产品家族:PCB插座

封装信息: - 封装类型:直插式装配
90136-1214 价格&库存

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