PRODUCT SPECIFICATION
PRODUCT SPECIFICATION
FOR
MXMag MAGNETIC JACK
0.85” INVERTED PROFILE SINGLE PORT WITH LEDS WITH EMI SHIELD TABS
(shown as example)
0.85” INVERTED PROFILE DUAL PORT WITH LEDS WITH EMI SHIELD TABS
(shown as example)
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MXMAG PRODUCT SPECIFICATION
EC No: 602124
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PRODUCT SPECIFICATION
1.0 SCOPE
This specification defines the functionality as well as the mechanical and electrical interfaces
for the Molex Family of MXMag Magnetic Jacks.
2.0 PRODUCT DESCRIPTION
The MXMag magnetic connector offers a simple solution for integrating Ethernet magnetics
and the RJ-45 connector interface into one integrated package with guaranteed signal
integrity, Fast and Gigabit Ethernet, common mode termination and EMI shielding. The
connector is available in 0.85” deep Inverted profile, 0.85” deep Standard profile and 1” deep
profile versions. The connector includes up to two LED’s per port.
3.0 PRODUCT NAME AND SERIES NUMBER
MXMag Single Port Series Connector
Series Number
Tray
Tape & Reel
3.3mm PHY Pin 1.8mm PHY Pin 3.3mm PHY Pin 1.8mm PHY Pin
93461
93741
93753
93765
93462
93742
93754
93766
93463
93743
93755
93767
93626
93744
93756
93768
93627
93745/94011
93757
93769
93628
93746
93758
93770
93634
93747
93759
93771
93635
93748
93760
93772
93636
93749
93761
93773
93637
93750
93762
93774
93638
93751
93763
93775
93639
93752
93764
93776
Description*
0.85” 4C FE STD
0.85” 4C FE INV
1" 4C FE INV
0.85” 8C GIG STD
0.85” 8C GIG INV
1" 8C GIG INV
0.85” 6C FE STD
0.85” 6C FE INV
0.85” 12C GIG STD
0.85” 12C GIG INV
1" 6C FE INV
1" 12C GIG INV
MXMag Dual Port Series Connector
Series Number
Tray
Tape & Reel
2.7 mm PHY Pin 2.2 mm PHY Pin 2.7 mm PHY Pin 2.2 mm PHY Pin
93824
93828
93832
93836
93825
93829
93833
93837
93826
93830
93834
93838
93827
93831
93835
93839
Description*
DP 4C FE INV
DP 6C FE INV
DP 8C GIG INV
DP 12C GIG INV
* 0.85” & 1” refer to connector depth, C = cores, FE = Fast Ethernet, GIG = Gigabit Ethernet,
INV = Inverted / Tab-Up, STD = Standard / Tab-Down, DP = Dual Port
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PRODUCT SPECIFICATION
4.0 FEATURES
Range of Fast & Gigabit Ethernet magnetic options
Integrated Common Mode Termination Circuitry
Operating Temperature range: SEE RELEVANT SALES DRAWINGS
2250 V DC isolation
Integrated LED options
Options available for Reflow or Wave soldering process
5.0 SAFETY AGENCY APPROVALS
UL File Number…………E177474
This product is designed as an SELV CIRCUIT and is considered to be powered up by
a TELECOMMUNICATION CABLE OR A CABLE DISTRIBUTION SYSTEM. For any other
power supply, the requirements of IEC 60950-1 must be taken into consideration.
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PRODUCT SPECIFICATION
6.0 APPLICABLE DOCUMENTS AND SPECIFICATIONS
Molex sales drawing
See relevant sales drawing for information on dimensions, materials, markings and product
offerings.
Plating
Contact Surface:
Palladium Nickel With Gold Flash:
Post plate 0.05 µm Min Gold Flash over 1.00 µm Min Palladium Nickel in contact area,
1.90 µm Min pure Tin in tail area, both over 1.270 µm Min Nickel overall.
PHY Terminals: 1.25 µm Min Nickel.
Shield: 1.27 µm Min Nickel, solder tabs post plated with 1.27 µm Min Tin
Molex Packaging Spec
See relevant Sales Drawings
Applicable standards
IEC 60603-7
IEC 60603-7-1
TIA-1096-A
EIA-364-65
IEC 60951-1
IEEE802.3
LED Terminal Pinout
The Magnetic Jack has on-board LEDs that can be controlled directly. Each Magnetic Jack
has two LED positions per port with up to two different colours (single or bicolour) per position.
The bicolour LEDs are bipolar. Colour change is achieved by reversing voltage using an
external switch or relay. Note that the LEDs need external current limitation and voltage
adjustment according to the LED characteristics.
See LED Pin out examples below.
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PRODUCT SPECIFICATION
Figure 1: 0.85” Inverted Connector LED Pin-out example
Figure 2: 1” Inverted Connector LED Pin-out example
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PRODUCT SPECIFICATION
Figure 3: 0.85” Standard Connector LED Pin-out example
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PRODUCT SPECIFICATION
Figure 4: 0.85” Dual Port Inverted Connector LED Pin-out example
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PRODUCT SPECIFICATION
LED Electrical Characteristics
The following table contains the electrical characteristics for the LED and the LED terminals
on the Magnetic Jack.
All LEDs are low power LEDs according to IEC 62471 /exempt group.
Parameter
Symbol
Forward
Voltage
Vf
Dominant
Wavelength
λD
Forward
Current
If
Luminous
Intensity
Iv
Without 250 Ω
Resistor
Min
Max
1.8
2.4
1.8
2.4
1.8
2.4
567
575
600
612
585
595
5
25
5
25
5
25
5
10
5
10
5
10
Colour
Green
Orange
Yellow
Green
Orange
Yellow
Green
Orange
Yellow
Green
Orange
Yellow
With 250 Ω
Resistor
Min
Max
8
10
8
10
8
10
567
575
600
612
585
595
5
25
5
25
5
25
5
10
5
10
5
10
Unit
Condition
V
@If = 20 mA
nm
mA
N/A
mcd
@If = 10 mA
6.1 ABSOLUTE MAXIMUM RATINGS (TABLE 1)
Temperature Ranges
Operating
Non-operating (No condensation)
Maximum Current
Per RJ45 contact
SEE RELEVANT SALES DRAWINGS
-55°C to +85°C
0.5 A
Table 1 – Absolute Max Ratings
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PRODUCT SPECIFICATION
7.0 TEST SCHEDULES
The following tests specify the characteristics to be checked and the requirements to be fulfilled. This test
sequence is based on IEC 60603-7 and EIA-364-1000. Where required Molex has modified testing based
on the customers’ requirements and changes required to accommodate custom requirements of the
connector.
For a complete test sequence, a minimum of 90 specimens are needed.
Test Group EP & CZ is customised by Molex for this sequence.
All connectors in each group shall undergo the following tests as described in the sequence given.
All the test group specimens shall be subjected to the preliminary group P tests in the
following sequence.
Test group P
TEST
PHASE
DESCRIPTION
P1
VISUAL
INSPECTION
P2
INITIAL
CONTACT
RESISTANCE
(LOW LEVEL)
TEST CONDITION
REQUIREMENT
There shall be no defects that
would impair normal operation
IEC 60512-1-1 Test 1a
Mated connectors:
Max test voltage 20 mV DC or AC peak,
test current 100 mA DC or AC peak
Arrangement acc. IEC 60603-7
Section 7.3
5 mΩ
MAXIMUM
[Initial]
IEC 60512-2-1 Test 2a
P3
P4
Test voltage 100 V DC ± 15V Method A
INSULATION
mated connectors
RESISTANCE
(PHY
TERMINALS TO
IEC 60512-3-1: Test 3a
SHIELD)
HI-POT
(VOLTAGE
PROOF /
ISOLATION)
2250 V DC for 60 seconds.
(Between PHY pins + shield to RJ45
Terminals)
500 V DC ( LEDs to Shield)
2250 V DC (LEDs to RJ45 Terminals)
500 MΩ Minimum
No breakdown
(IEC 60950-1: 2001 Sub-clause 5.2.2.)
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PRODUCT SPECIFICATION
Test group AP
TEST
PHASE
AP 1
AP 2
TITLE
INSERTION AND
WITHDRAWAL
FORCES
EFFECTIVENESS
OF CONNECTOR
COUPLING
DEVICE.
SEVERITY
Connector locking device depressed.
PER IEC 60512-13-2, Test 13b
Rate of load application
44.5 N/s Max
REQUIREMENTS
Insertion force 30 N max,
Withdrawal force 30 N max.
50 N for 60s ± 5s
PER IEC 60512-15-6, Test 15f
AP 3
RAPID CHANGE OF
TEMPERATURE
-40°C to 85°C
Mated connectors
25 cycles ι = 30 min
recovery time 2 h
PER IEC 60068-2-14
INSULATION
RESISTANCE
AP 4
(PHY terminals to
shield)
Test voltage
100V ±15 V DC
method a, mated connectors
PER P3
IEC 60512-3-1, Test 3a, Method a.
AP 5
AP 6
AP 7
AP 8
CONTACT
RESISTANCE
PER P2
VOLTAGE PROOF
VISUAL
EXAMINATION
CYCLIC DAMP
HEAT
PER P4
PER P1
PER P1
21 cycles
low temperature 25°C
high temperature 65°C
cold sub-cycle –10°C
humidity 93 %
Half of the samples in mated state
Half of the samples in un-mated state
PER IEC 60068-2-38
PER P2
AP 9
E
ECM INFORMATION:
from initial
PER P4
CONTACT
RESISTANCE
REVISION:
10 mΩ maximum change
10 mΩ maximum change
from initial
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PRODUCT SPECIFICATION
Test group AP (continued).
TEST
PHASE
AP 10
AP 11
TITLE
INSERTION AND
WITHDRAWAL FORCES
EFFECTIVENESS OF
CONNECTOR COUPLING
DEVICE.
SEVERITY
REQUIREMENTS
PER AP1
PER AP1
Rate of load application
44.5 N/s Max
50 N for 60 s ± 5 s
PER IEC 60512-15-6, Test 15f
AP 12
VISUAL EXAMINATION
PER P1
PER P1
Solder Bath 245 °C ± 3 °C
Immersion Time 3.0 s ± 0.3 s
AP 13
SOLDERABILITY
Solder area will have
a minimum of 95%
solder coverage.
PER IEC 60068-2-20 Test Ta
Method 1
For wave solder connectors:
Temperature: 260 °C ± 3 °C
Immersion Time: 10 s ± 1 s
AP 14
PER IEC 60068-2-20 Test Tb
Method 1
RESISTANCE TO
SOLDERING HEAT
Appearance: No
Damage.
For recommended Reflow
Profile
(See Section 8.0)
VOLTAGE PROOF
AP 15
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PER P4
ECM INFORMATION:
PER P4
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PRODUCT SPECIFICATION
Test group BP
TEST
PHASE
TITLE
LOCKING DEVICE
MECHANICAL
OPERATIONS.
BP 1
HI-POT
(VOLTAGE PROOF /
ISOLATION)
BP 2
BP 3
CONTACT RESISTANCE
BP 4
BP 5
REVISION:
CONTACT RESISTANCE
E
HI-POT
(VOLTAGE PROOF /
ISOLATION)
ECM INFORMATION:
REQUIREMENTS
5,000 operations
After the specified
number of operations,
the specimens shall
show no visual
indication of fatigue or
stress cracking of the
locking device.
PER P4
No breakdown
10 mΩ maximum
change from initial
PER P2
EIA-364-09 (perform the rated
number of unplug/plug cycles.
retention features, such as
latches,
should not be deactivated.)
2,500 cycles
DURABILITY
BP 6
SEVERITY
PER P2
no evidence of
physical
damage
10 mΩ maximum
change from initial
PER P4
No breakdown
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PRODUCT SPECIFICATION
Test group CP
TEST
PHASE
TITLE
SEVERITY
REQUIREMENTS
f = 10 Hz to 500 Hz,
Amplitude: 0.35 mm
Accel 50m/s²
10 sweeps / axis (3axis)
Time 2 hours/axis
measurement points per
section 7.0
VIBRATION
CP 1
Discontinuities 0.1µs
maximum.
(For arrangement,See
IEC 60603-7, 7.3)
PER IEC 60512-6-4, Test
6d
CONTACT RESISTANCE
CP 2
No disturbance of the free
connector to fixed connector
electrical connections, between
vibration test and contact
resistance measurement
PER P2
10 mΩ maximum
change from initial
INSULATION RESISTANCE
CP 3
(PHY terminals to shield)
PER P3
PER P3
CP 4
VISUAL EXAMINATION
PER P1
PER P1
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PRODUCT SPECIFICATION
Test group DP
TEST
PHASE
DP 1
TITLE
SEVERITY
REQUIREMENTS
1.6 A shield contacts 5
connectors,
no current 5
connectors
0.5 A per RJ45
contact.
500 h 70°C
Recovery period 2 h
ELECTRICAL LOAD AND
TEMPERATURE
PER IEC 60512-9-2, Test 9b
DP 2
INSULATION RESISTANCE
(PHY terminals to shield)
PER P3
PER P3
DP 3
VOLTAGE PROOF
PER P4
PER P4
DP 4
VISUAL EXAMINATION
PER P1
PER P1
DP 5
CONTACT RESISTANCE
PER P2
DP 6
DP 7
10 mΩ maximum
change from initial
N/A
All signal contacts and
screen/specimens
GAUGING CONTINUITY
0.1 µs maximum
PER IEC 60603-7-3, Annex A
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PRODUCT SPECIFICATION
Test Group EP
TEST
PHASE
TITLE
EP 1
Insertion loss (dB)
Mated Connectors
EP 2
Return loss (dB)
Mated Connectors
EP 3
NEXT loss (dB)
Mated connectors, pair to
pair
EP 4
CMR (dB)
EP 5
OCL (µH min)
Test group FP
TEST
PHASE
TEST CONDITION
See Relevant Sales Drawings for Part
specific Transmission Values
Mated Connectors
Wire Side
TITLE
SEVERITY
SURGE TEST
FP 1
Test no. ITU_T K.20:2000
Mated
connectors,
Table 2a /2b,
Basic test level
Tests 2.1.1a,
2.1.1b,
2.1.3, 2.2.1a
REQUIREMENTS
Test 2.1 & 2.2:
Acceptance criteria A
per ITU-T K.44,
clause 9
INSULATION
RESISTANCE
FP 2
(PHY terminals to
shield)
PER P3
PER P3
FP 3
VISUAL EXAMINATION
PER P1
PER P1
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PRODUCT SPECIFICATION
Test Group GP
TEST
PHASE
TITLE
SEVERITY
HIGH TEMPERATURE
(DRY HEAT)
GP1
REQUIREMENTS
336 h 70°C
Recovery period 2 h
Mated
PER IEC 60068-2-2, Test
Bb
21 cycles
low temperature 25°C
high temperature 65°C
cold subcycle –10°C
humidity 93 %
Half of the samples in mated
state
Half of the samples in
unmated state
CYCLIC DAMP HEAT
GP2
10 mΩ maximum
change from initial
10 mΩ maximum
change from initial
PER IEC 60068-2-38
Test group AZ
TEST
PHASE
TITLE
SEVERITY
HIGH TEMPERATURE
(DRY HEAT)
AZ1
CONTACT RESISTANCE
Mate connectors; expose to:
96 hours at 85°C ± 2°C
PER IEC 60068-2-2, Test
9b
PER P2
AZ 2
REVISION:
E
REQUIREMENTS
Use Molex plug
500602-0819
10 mΩ maximum
change from initial
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PRODUCT SPECIFICATION
Test group CZ (Use Molex Plug 500602-0819)
TEST
PHASE
TITLE
SEVERITY
REQUIREMENTS
CONTACT RESISTANCE
PER P2
5 mΩ maximum
change from initial
CZ 1
1.0 MECHANICAL
OPERATIONS
2.0
CZ 2
Mate/un-mate connectors
20 cycles, at a maximum rate
of 10mm/s maximum.
Rest 1s (when mated and when
unmated) Locking device
inoperative.
No Evidence Of
Physical Damage.
Mate Connectors
105°C for 72 hours
Use Molex plug
500602-0819
TEMPERATURE LIFE
CZ 3
PER EIA-364-17, METHOD
A
(TEMPERATURE AND
DURATION PER EIA-3641000, TABLE 9, 60°C FOR
10YEARS).
CONTACT RESISTANCE
CZ 4
10 mΩ maximum
change from initial
PER P2
FLOWING MIXED GAS
CORROSION
CZ 5
PER EIA 364-65 CLASS IIA
1/2 samples mated for 336
hours, ½ samples unmated for
240 hours, then mated for final
96 hours.
(do not place unmated plugs in
chamber).
CONTACT RESISTANCE
CZ 6
10 mΩ maximum
change from initial
PER P2
THERMAL DISTURBANCE
CZ 7
Mate Connectors
10 cycles of 15°C ± 3°C to
85°C ± 3°C/ dwell 30 minutes
at each temp
CONTACT RESISTANCE
CZ 8
PER P2
10 mΩ maximum
change from initial
CZ 9
Manually unplug/plug the
connector
or socket. perform 3 such
cycles.
No evidence of
physical
damage
PER P2
10 mΩ maximum
change from initial
PER P1
PER P1
RESEATING
CONTACT RESISTANCE
CZ 10
CZ 11
REVISION:
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VISUAL EXAMINATION
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PRODUCT SPECIFICATION
8.0 SOLDERING CONDITIONS.
Recommended
Table 2 – Reflow simulation.
NOTE MXMag can only be used in a NO-WASH soldering process due to magnetics used.
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PRODUCT SPECIFICATION
9.0 PACKAGING
Parts shall be packaged to protect against damage during handling, transit and storage.
See relevant Packaging specifications.
10.0 ESD PROTECTION
To avoid damage by an electrostatic discharge while installing the connector, ESD packaging
has been used. For more details see relevant Packaging specifications.
11.0 GAUGES AND FIXTURES
Arrangement for contact resistance test:
Arrangement acc. IEC60603-7 section 7.2
Arrangement for vibration test:
Arrangement acc. IEC60603-7 section 7.3
12.0 QUALITY ASSURANCE PROVISIONS
The applicable Molex Inspection plan specifies the sampling acceptable quality level to be
used. Dimensional and functional requirements shall be in accordance with applicable product
drawings and this specification.
REVISION:
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MXMAG PRODUCT SPECIFICATION
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13.0 APPENDIX B
The norms and standards cited in the following sections are applicable.
Standard
Test
IEC 60068-2-14
IEC 60068-2-20
IEC 60068-2-38
IEC 60068-2-60
IEC 60068-2-78
IEC 60512-2-1
2a
IEC 60512-3-1
3a
IEC 60512-6
12a
IEC 60512-6-3
6c
IEC 60512-6-4
6d
IEC 60512-9-1
9a
IEC 60512-9-2
9b
IEC 60512-13-2
13b
IEC 60512-15-6
15f
IEC 60603-7
IEC 60603-7-1
IEC 60950-1
IEEE 802.3
REVISION:
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Description
Environmental testing – Part 2-14: Tests – Test N: Change of
Temperature
Environmental testing – Part 2-2-: Tests – Test T: Test methods for
solderability and resistance to soldering heat of devices with leads
Environmental testing – Part 2-38: Tests – Test Z/AD: Composite
temperature/humidity cyclic test
Environmental testing - Part 2: Tests - Test Ke: Flowing mixed gas
corrosion test
Environmental testing - Part 2-78: Tests; Test Cab: Damp heat,
steady state
Part 2-1: Electrical continuity and contact resistance tests; Test 2a:
Contact resistance - Millivolt level method
Part 3-1: Insulation tests; Test 3a: Insulation resistance
Part 6: Climatic tests and soldering tests: Test 12a: Solderability,
wetting, solder bath method.
Part 6-3: Dynamic stress tests; Test 6c: Shock
Connectors for electronic equipment - Tests and measurements Part 6-4: Dynamic stress tests - Test 6d: Vibration (sinusoidal)
Part 9-1: Endurance tests - Test 9a: Mechanical operation
Connectors for electronic equipment - Tests and measurements Part 9-2: Endurance tests - Test 9b: Electrical load and
temperature
Part 13-2: Mechanical operation tests - Test 13b: Insertion and
withdrawal force
Connectors for electronic equipment – Tests and measurements
Part 15 - : Connector tests (mechanical) – Test 15f: Effectiveness
of connector coupling devices
Connectors for electronic equipment - Part 7: Detail specification
for 8-way,
unshielded, free and fixed connectors
Connectors for electronic equipment - Part 7-1: Detail specification
for 8-way,
shielded, free and fixed connectors
Information technology equipment – Safety – Part 1: General
Requirements
Standard for Ethernet
TITLE:
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PRODUCT SPECIFICATION
Connector requirements for connection of Terminal Equipment to
the telephone network
TIA 1096 A
Mixed Flowing test procedure for electrical connectors contacts and
sockets.
Temperature Life with or without Electrical Load Test Procedure for
Electrical Connectors and Sockets
Environmental Test Methodology For
Assessing The Performance Of Electrical Connectors And
Sockets
EIA-364-65
EIA-364-17
EIA-364-1000
Table 3 – Standards Index.
Released Revision Control
Revision
Change
2
B
Release post screen testing
Product Testing
Edited Section AP13 Solderability
and added Dual Port
Updated UL File Number
Updated Sections AP13 and AP14
C
D
E
REVISION:
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ECM INFORMATION:
Person
Responsible
D.Byrnes
D.Byrnes
ECN No:
Date:
109228
03-Oct-2016
DShea
169633
04-Oct-2017
DShea
DShea
606445
602124
02-Oct-2018
19-Dec-2018
TITLE:
SHEET No.
MXMAG PRODUCT SPECIFICATION
EC No: 602124
DATE: 2019/01/25
DOCUMENT NUMBER:
934620001
21 of 21
DOC
TYPE:
DOC
PART:
CREATED / REVISED BY:
CHECKED BY:
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DBYRNES
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