0015477634

厂商：
MOLEX2
封装：
描述：
0015477634 - 2.54mm (.100) Pitch C-GridÂ® Header, Through Hole, Dual Row, Vertical, High Temperature...

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0015477634 数据手册

This document was generated on 03/31/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Description: 0015477634 Active 2.54mm (.100") Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 34 Circuits, 0.38µm (15µ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating Documents: 3D Model Drawing (PDF) Product Specification PS-70567 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only LR19980 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL General Product Family Series Application Product Name PCB Headers 70568 Wire-to-Board C-Grid® Physical Breakaway Circuits (Loaded) Color - Resin First Mate / Last Break Flammability Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to Mating Part Polarized to PCB Shrouded Stackable Surface Mount Compatible (SMC) No 34 Black No 94V-0 No No None Yes Brass, Phosphor Bronze Gold Tin High Temperature Thermoplastic 2 Vertical 0.130 In 3.30 mm No Yes 0.093 In 2.40 mm Tube 0.100 In 2.54 mm 0.100 In 2.54 mm 15 0.375 75 1.875 Yes Yes Fully No No Search Parts in this Series 70568Series Temperature Range - Operating Termination Interface: Style -55°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 2.5A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 SMC & Wave Capable (TH only) 1 245 Material Info Old Part Number A-70568-0049 Reference - Drawing Numbers Product Specification Sales Drawing PS-70567 SDA-70568-**** This document was generated on 03/31/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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0015477634

1. 物料型号： - 型号：0015477634 - 描述：2.54mm (.100") Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 34 Circuits, 0.38µm (15µ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

2. 器件简介： - 产品家族：PCB Headers - 系列：70568 - 应用：Wire-to-Board - 产品名称：C-Grid®

3. 引脚分配： - 电路（已加载）：34 - 行数：2 - 引脚间距 - 接口（英寸）：0.100 In - 引脚间距 - 接口（毫米）：2.54 mm

4. 参数特性： - 颜色 - 树脂：黑色 - 阻燃等级：94V-0 - 金属材质：黄铜，磷青铜 - 镀层材质：金 - 镀层终止：锡 - 树脂材质：高温热塑性塑料 - PCB厚度推荐（英寸）：0.093 In - PCB厚度推荐（毫米）：2.40 mm - 包装类型：管装

5. 功能详解： - 极化到配对部件：是 - 极化到PCB：是 - 全封闭：完全封闭 - 堆叠：否 - 表面安装兼容（SMC）：否

6. 应用信息： - 应用：Wire-to-Board

7. 封装信息： - 引脚间距 - 接口（英寸）：0.100 In - 引脚间距 - 接口（毫米）：2.54 mm - 镀层最小 - 接口（微英寸）：15 - 镀层最小 - 接口（微米）：0.375 - 镀层最小 - 终止（微英寸）：75 - 镀层最小 - 终止（微米）：1.875

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