0015800181

厂商：
MOLEX2
封装：
描述：
0015800181 - 2.54mm (.100) Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shro...

数据手册：

下载0015800181.pdf

立即购买

详情介绍
数据手册
价格&库存

0015800181 数据手册

This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0015800181 Active cgrid__sl_products 2.54mm (.100") Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, Tin (Sn) Plating Documents: 3D Model Drawing (PDF) Packaging Specification (PDF) Product Specification PS-70567 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only Agency Certification CSA UL LR19980 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. General Product Family Series Application Overview Product Name PCB Headers 70567 Wire-to-Board cgrid__sl_products C-Grid® Physical Breakaway Circuits (Loaded) Circuits Detail Color - Resin First Mate / Last Break Flammability Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to Mating Part Polarized to PCB No 18 18 Black No 94V-0 No No None Yes Brass, Phosphor Bronze Tin Tin High Temperature Thermoplastic 2 Vertical 0.130 In 3.30 mm No Yes 0.093 In 2.40 mm Tube 0.100 In 2.54 mm 0.100 In 2.54 mm 150 3.75 150 3.75 Yes No Search Parts in this Series 70567Series Mates With 70450 Crimp Housing Shrouded Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style Fully No No -55°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 2.5A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 SMC & Wave Capable (TH only) 1 245 Material Info Old Part Number 70567-0007 Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-70873-0018 PS-70567 SDA-70567-**** This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

下载 PDF

0015800181

1. 物料型号： - 型号：0015800181 - 状态：Active - 描述：2.54mm (.100") Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical

2. 器件简介： - 产品系列：70567 - 应用：Wire-to-Board - 产品名称：C-Grid® - 物理特性：无断裂，18路，黑色树脂，无前/后断开，94V-0阻燃等级，无极性导向，金属材质为黄铜和磷青铜，镀锡，高温热塑性树脂，双排，垂直方向，PC尾长0.130英寸（3.30毫米），PCB厚度推荐0.093英寸（2.40毫米）。

3. 引脚分配： - 引脚数量：18个电路

4. 参数特性： - 引脚间距：2.54mm (0.100英寸) - 焊接过程数据：最大过程温度245°C，最大周期1次，最大过程温度持续时间5秒，无铅焊接能力（仅限通孔）。 - 接触最大电流：每个接触2.5A

5. 功能详解： - 该连接器为C-Grid®系列，适用于线对板连接，具有18个电路，垂直方向，双排，无屏蔽罩，高温等级，锡镀层。

6. 应用信息： - 适用于线对板连接，工作温度范围为-55°C至+105°C。

7. 封装信息： - 封装类型：Tube - 引脚间距：2.54mm (0.100英寸) - 焊接端接口风格：通孔 - 极性：与配合部件极性匹配，与PCB无极性匹配。

0015800181 价格&库存

-> 查询更多价格&库存

很抱歉，暂时无法提供与“0015800181”相匹配的价格&库存，您可以联系我们找货

免费人工找货

搜索历史

0015800181