0015800245

0015800245

  • 厂商:

    MOLEX2

  • 封装:

  • 描述:

    0015800245 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shro...

  • 详情介绍
  • 数据手册
  • 价格&库存
0015800245 数据手册
This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0015800245 Active cgrid__sl_products 2.54mm (.100") Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, 0.76µm (30µ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating Documents: 3D Model Packaging Specification (PDF) Drawing (PDF) Product Specification PS-70567 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Series Agency Certification CSA UL LR19980 E29179 General Product Family Series Application Overview Product Name PCB Headers 70567 Wire-to-Board cgrid__sl_products C-Grid® Physical Breakaway Circuits (Loaded) Circuits (maximum) Circuits Detail Color - Resin First Mate / Last Break Flammability Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) No 24 24 24 Black No 94V-0 No No None Yes Brass, Phosphor Bronze Gold Tin High Temperature Thermoplastic 2 Vertical 0.130 In 3.30 mm No Yes 0.093 In 2.40 mm Tube 0.100 In 2.54 mm 0.100 In 2.54 mm 30 0.75 75 1.875 Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Search Parts in this Series 70567Series Mates With 70450 Crimp Housing Polarized to Mating Part Polarized to PCB Shrouded Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style Yes No Fully No No -55°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 2.5A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 SMC & Wave Capable (TH only) 1 245 Material Info Old Part Number 70567-0146 Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-70873-0018 PS-70567 SDA-70567-**** This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
0015800245
1. 物料型号 - 型号:0015800245 - 状态:Active(活跃) - 符合欧盟RoHS、中国RoHS、ELV和RoHS标准,不含SVHC物质,无卤素,REACH SVHC未审核。

2. 器件简介 - 描述:2.54mm(.100")Pitch C-Grid Header,通孔无定位销,双护套,高温,24路,0.76um(30")金(Au)选择性锡(Sn)PC尾镀层。

3. 引脚分配 - 最大电路数:24 - 电路数细节:24路 - 每排引脚数:2

4. 参数特性 - 颜色 - 树脂:黑色 - 首次配对/最后断裂阻燃性:不适用 - 灼热丝合规性:94V-0 - 金属材质:hip.com黄铜,磷青铜 - 镀层 - 配对:金 - 镀层 - 终止:锡 - 树脂材质:高温热塑性塑料 - PCB推荐厚度:0.093英寸/2.40毫米

5. 功能详解 - 该产品为C-Grid系列,支持线对板连接。 - 物理特性包括完全护套、未极化至PCB、支持与配对部件的锁定。

6. 应用信息 - 适用于线对板的连接。 - 操作温度范围:-55°C至+105°C。

7. 封装信息 - 封装类型:通孔 - 引脚间距:0.100英寸/2.54毫米 - 尾长:0.130英寸/3.30毫米 - 包装类型:Tube(管装)
0015800245 价格&库存

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