0015800465

0015800465

  • 厂商:

    MOLEX2

  • 封装:

  • 描述:

    0015800465 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shro...

  • 详情介绍
  • 数据手册
  • 价格&库存
0015800465 数据手册
This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0015800465 Active cgrid__sl_products 2.54mm (.100") Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 46 Circuits, 0.76µm (30µ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating Documents: 3D Model Packaging Specification (PDF) Drawing (PDF) Product Specification PS-70567 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Series Agency Certification CSA UL LR19980 E29179 General Product Family Series Application Overview Product Name PCB Headers 70567 Wire-to-Board cgrid__sl_products C-Grid® Physical Breakaway Circuits (Loaded) Circuits Detail Color - Resin First Mate / Last Break Flammability Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to Mating Part No 46 46 Black No 94V-0 No No None Yes Brass, Phosphor Bronze Gold Tin High Temperature Thermoplastic 2 Vertical 0.130 In 3.30 mm No Yes 0.093 In 2.40 mm Tube 0.100 In 2.54 mm 0.100 In 2.54 mm 30 0.75 75 1.875 Yes Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Search Parts in this Series 70567Series Mates With 70450 Crimp Housing Polarized to PCB Shrouded Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No Fully No No -55°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 2.5A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 SMC & Wave Capable (TH only) 1 245 Material Info Old Part Number A-70567-0157 Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-70873-0018 PS-70567 SDA-70567-**** This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
0015800465
1. 物料型号: - 型号:0015800465 - 状态:Active(活跃) - 符合欧盟RoHS、中国RoHS、ELV和RoHS标准,不含SVHC(高度关注物质),无卤素,未审核。

2. 器件简介: - 产品系列:PCB Headers(PCB插座) - 系列:70567 - 应用:Wire-to-Board(线对板) - 概述:2.54mm(.100)间距C-Grid Header,通孔无定位销,双列 - 描述:带护套,耐高温,46电路,0.76um(30")金(Au)选择性锡(Sn)PC尾镀层

3. 引脚分配: - 电路(已加载):46 - 电路细节:46

4. 参数特性: - 阻燃等级:94V-0 - 耐热丝合规性:否 - 金属材质:黄铜,磷青铜 - 镀层材质:金 - 镀层终止:锡 - 树脂材质:耐高温热塑性塑料 - 行数:2 - 垂直方向:垂直 - PCB尾长:0.130英寸(3.30毫米) - PCB厚度推荐:0.093英寸(2.40毫米) - 包装类型:管装 - 间距- mating interface(英寸):0.100 - 间距- term. interface(英寸):0.100 - 镀层最小值:mating(uin)30,mating(um)0.75,termination(uin)75,termination(um)1.875 - 极化至配合部件:是

5. 功能详解: - 无断裂:否 - 护套:完全护套 - 堆叠:否 - 表面安装兼容(SMC):否 - 工作温度范围:-55°C至+105°C - 电气参数:每接触最大电流2.5A,最大电压250V - 焊接过程数据:最大过程温度持续时间5秒,无铅过程能力(TH only),最大过程温度周期1,过程温度最大245°C

6. 应用信息: - 与70450压接式外壳配合使用

7. 封装信息: - 包装规格:PK-70873-0018 - 产品规格:PS-70567 - 销售图纸:SDA-70567-
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