0015800581

0015800581

  • 厂商:

    MOLEX2

  • 封装:

  • 描述:

    0015800581 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shro...

  • 详情介绍
  • 数据手册
  • 价格&库存
0015800581 数据手册
This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0015800581 Active cgrid__sl_products 2.54mm (.100") Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 58 Circuits, Tin (Sn) Plating Documents: 3D Model Packaging Specification (PDF) Drawing (PDF) Product Specification PS-70567 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only Agency Certification CSA UL LR19980 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. General Product Family Series Application Overview Product Name PCB Headers 70567 Wire-to-Board cgrid__sl_products C-Grid® Physical Breakaway Circuits (Loaded) Circuits Detail Color - Resin First Mate / Last Break Flammability Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to Mating Part Polarized to PCB No 58 58 Black No 94V-0 No No None Yes Brass, Phosphor Bronze Tin Tin High Temperature Thermoplastic 2 Vertical 0.130 In 3.30 mm No Yes 0.093 In 2.40 mm Tube 0.100 In 2.54 mm 0.100 In 2.54 mm 100 2.50 50 1.30 Yes No Search Parts in this Series 70567Series Mates With 70450 Crimp Housing Shrouded Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style Fully No No -55°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 2.5A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 SMC & Wave Capable (TH only) 1 245 Material Info Old Part Number A-70567-0027 Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-70873-0018 PS-70567 SDA-70567-**** This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
0015800581
1. 物料型号: - 型号:0015800581

2. 器件简介: - 产品描述:2.54mm(.100")间距C-Grid® 直插式无定位销D型闭壳式高温58路通孔,锡(Sn)镀层。

3. 引脚分配: - 引脚数量:58路

4. 参数特性: - 无断路:否 - 颜色 - 树脂:黑色 - 阻燃等级:94V-0 - 金属材质:黄铜,磷青铜 - 端接金属镀层:锡 - 端接终止镀层:锡 - 树脂材质:高温热塑性塑料 - 行数:2 - 引脚间距 - 接口(mm):2.54mm - 通孔最小镀层厚度(um):2.50 - 端接最小镀层厚度(um):1.30 - 极化到匹配部件:是

5. 功能详解: - 该产品为线对板应用,具有58个通孔,适用于高温环境,具有锡镀层,提供良好的电气连接性能。

6. 应用信息: - 应用:线对板 - 操作温度范围:-55°C至+105°C - 最大电流每接触点:2.5A

7. 封装信息: - 封装类型:管装 - 引脚长度(mm):3.30mm - PCB厚度推荐(mm):2.40mm - 引脚间距 - 接口(mm):2.54mm
0015800581 价格&库存

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