0015800703

0015800703

  • 厂商:

    MOLEX2

  • 封装:

  • 描述:

    0015800703 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shro...

  • 详情介绍
  • 数据手册
  • 价格&库存
0015800703 数据手册
This document was generated on 05/26/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0015800703 Active cgrid__sl_products 2.54mm (.100") Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 70 Circuits, 0.38µm (15µ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating Documents: 3D Model Drawing (PDF) Packaging Specification (PDF) Product Specification PS-70567 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Series Agency Certification CSA UL LR19980 E29179 General Product Family Series Application Overview Product Name PCB Headers 70567 Wire-to-Board cgrid__sl_products C-Grid® Physical Breakaway Circuits (Loaded) Circuits Detail Color - Resin First Mate / Last Break Flammability Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to Mating Part No 70 70 Black No 94V-0 No No None Yes Brass, Phosphor Bronze Gold Tin High Temperature Thermoplastic 2 Vertical 0.130 In 3.30 mm No Yes 0.093 In 2.40 mm Tube 0.100 In 2.54 mm 0.100 In 2.54 mm 15 0.38 75 1.875 Yes Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Search Parts in this Series 70567Series Mates With 70450 Crimp Housing Polarized to PCB Shrouded Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No Fully No No -55°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 2.5A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 SMC & Wave Capable (TH only) 1 245 Material Info Old Part Number A-70567-0101 Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-70873-0018 PS-70567 SDA-70567-**** This document was generated on 05/26/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
0015800703
1. 物料型号: - 型号:0015800703 - 状态:Active(活跃)

2. 器件简介: - 描述:2.54mm (.100") 间距 C-Grid® 直插式无定位销双排直立式头,符合欧盟RoHS、中国RoHS、ELV和RoHS标准,REACH SVHC不含SVHC,无卤素,未审核。 - 详细描述:带屏蔽、高温、70电路、0.38um (15') 金(Au)锡(Sn)PC尾镀层。

3. 引脚分配: - 电路数(已加载):70 - 电路细节:70 - 每排电路数:2(双排)

4. 参数特性: - 耐燃性:94V-0 - 极性:是,与配合件极性匹配 - 材料:金属部分为黄铜、磷青铜,塑料部分为高温热塑性塑料 - 镀层:最小镀层厚度,配合界面15微英寸(0.38微米),终止界面75微英寸(1.875微米)

5. 功能详解: - 产品系列:70567 - 应用:线对板 - 物理特性:无断路、黑色树脂、无先导/最后断开、无火焰测试合规、无导向配合件、有锁配合件等。

6. 应用信息: - 与70450压接式外壳配合使用 - 工作温度范围:-55°C至+105°C - 电气特性:每个接触点最大电流2.5A,最大电压250V

7. 封装信息: - 封装类型:管装 - 配合界面间距:2.54mm - 终止界面间距:2.54mm - PCB厚度推荐:0.093英寸(2.40mm) - PCB定位:无 - PCB保持:有
0015800703 价格&库存

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