0015801221

0015801221

  • 厂商:

    MOLEX2

  • 封装:

  • 描述:

    0015801221 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shro...

  • 详情介绍
  • 数据手册
  • 价格&库存
0015801221 数据手册
This document was generated on 05/26/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0015801221 Active cgrid__sl_products 2.54mm (.100") Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76µm (30µ") Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm (.150") Inside Shroud to End Circuit Spacing Documents: 3D Model Packaging Specification (PDF) Drawing (PDF) Product Specification PS-70567 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Series Agency Certification CSA UL LR19980 E29179 General Product Family Series Application Overview Product Name PCB Headers 70567 Wire-to-Board cgrid__sl_products C-Grid® Physical Breakaway Circuits (Loaded) Circuits (maximum) Circuits Detail Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) No 22 22 22 Black 25 No 94V-0 No No None Yes Brass, Phosphor Bronze Gold Tin High Temperature Thermoplastic 2 Vertical 0.130 In 3.30 mm No Yes 0.093 In 2.36 mm Tube 0.100 In 2.54 mm 0.100 In 2.54 mm 30 0.75 75 Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Search Parts in this Series 70567Series Mates With 70013 Interim Clip Plating min: Termination (µm) Polarized to Mating Part Polarized to PCB Shrouded Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 1.875 No No Open Ends No Yes -55°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 2.5A 250V DC Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 SMC & Wave Capable (TH only) 1 245 Material Info Old Part Number A-70567-0349 Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-70873-0018 PS-70567 SDA-70567-**** This document was generated on 05/26/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
0015801221
1. 物料型号: - 型号:0015801221 - 状态:Active(活跃) - 符合欧盟RoHS、中国RoHS、ELV和RoHS标准,REACH SVHC不含SVHC,无卤素,未审核。

2. 器件简介: - 描述:2.54mm(.100")Pitch C-Grid® Header,直通孔无定位销,双排,垂直,带护罩,高温,22路,0.76µm(30µ")金(Au)选择性镀层,锡(Sn)PC尾镀层,3.81mm(.150")护罩内部到端路间距。 - 应用:线对板连接。

3. 引脚分配: - 引脚数量:22路(最大)。 - 引脚间距:2.54mm(.100")。

4. 参数特性: - 耐用性:最大25次插拔。 - 阻燃等级:94V-0。 - 金属材质:黄铜,磷青铜。 - 镀层:接触金,终止锡。 - 树脂材质:高温热塑性塑料。 - 排数:2。 - 垂直方向。 - PCB尾长:0.130英寸(3.30mm)。 - PCB厚度推荐:0.093英寸(2.36mm)。

5. 功能详解: - 该器件为C-Grid®系列,具有高温性能和选择性金镀层,适用于要求较高的应用场景。

6. 应用信息: - 适用于线对板连接。

7. 封装信息: - 封装类型:管装。 - 封装规格:PK-70873-0018。 - 产品规格:PS-70567。 - 销售图纸:SDA-70567-。
0015801221 价格&库存

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