0015911762

0015911762

  • 厂商:

    MOLEX2

  • 封装:

  • 描述:

    0015911762 - 2.54mm (.100) Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, 76 Circuits, 0....

  • 详情介绍
  • 数据手册
  • 价格&库存
0015911762 数据手册
This document was generated on 03/30/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Description: 0015911762 Active 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, 76 Circuits, 0.38µm (15µ") Gold (Au) Selective Plating, with 3.30mm (.130") PCB Locator Pegs Documents: 3D Model Drawing (PDF) Product Specification PS-71308 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Not Reviewed Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL LR19980 E29179 General Product Family Series Application Product Name PCB Headers 71308 Board-to-Board, Wire-to-Board C-Grid® Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) Flammability Glow-Wire Compliant Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PCB Locator PCB Retention Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to Mating Part Polarized to PCB Shrouded Stackable Temperature Range - Operating Termination Interface: Style Yes 76 76 Black 50 94V-0 No None Phosphor Bronze Gold Tin High Temperature Thermoplastic 2 Vertical Yes Yes Tube 0.100 In 2.54 mm 15 0.375 75 1.875 No No No Yes -40°C to +105°C Surface Mount Search Parts in this Series 71308Series Electrical Current - Maximum per Contact Voltage - Maximum 3A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability 30 Reflow Capable (SMT only) Max. Cycles at Max. Process Temperature Process Temperature max. C 3 260 Material Info Reference - Drawing Numbers Product Specification Sales Drawing PS-71308, RPS-71308-001 SD-71308-001 This document was generated on 03/30/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
0015911762
1. 物料型号: - 型号:0015911762

2. 器件简介: - 描述:2.54mm(.100")间距C-Grid排母,表面贴装,双排,垂直,70.38mm(15")金(Au)选择性电镀,带3.30mm(.130")PCB定位。

3. 引脚分配: - 引脚数:76个电路(满载)。

4. 参数特性: - 颜色 - 树脂:黑色 - 耐久性(最大插拔次数):50次 - 阻燃等级:94V-0 - 金属材质:磷青铜 - 镀层 - 接触:金 - 镀层 - 终止:锡 - 树脂材质:耐高温热塑性塑料 - 排数:2 - 接口方向:垂直 - PCB定位:芯片是 - 包装类型:是管装 - 接口间距 - 接口(英寸):0.100 In - 接口间距 - 接口(毫米):2.54 mm - 镀层最小 - 接触(uin):15 - 镀层最小 - 接触(um):0.375 - 镀层最小 - 终止(uin):75 - 镀层最小 - 终止(um):1.875 - 操作温度范围:-40°C至+105°C - 安装方式:表面贴装

5. 功能详解: - 应用:板对板、线对板 - 产品名称:C-GridR - 断路:是 - 极化:不与接触件极化,不与PCB极化 - 堆叠:是 - 未屏蔽:否

6. 应用信息: - 应用:板对板、线对板

7. 封装信息: - 封装:表面贴装 - 电气参数:每个接触最大电流3A,最大电压250V - 焊接过程数据:在最高工艺温度下持续时间30秒,无铅工艺能力(仅限SMT)
0015911762 价格&库存

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