015-91-1302

厂商：
MOLEX2
封装：
描述：
015-91-1302 - 2.54mm (.100) Pitch C-GridÂ® Header, Surface Mount, Dual Row, Vertical, 30 Circuits, 0...

数据手册：

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数据手册
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015-91-1302 数据手册

This document was generated on 03/31/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Description: 0015911302 Active 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, 30 Circuits, 0.38µm (15µ") Gold (Au) Selective Plating, with 3.30mm (.130") PCB Locator Pegs Documents: 3D Model Drawing (PDF) Product Specification PS-71308 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Not Reviewed Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL LR19980 E29179 General Product Family Series Application Product Name PCB Headers 71308 Board-to-Board, Wire-to-Board C-Grid® Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) Flammability Glow-Wire Compliant Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PCB Locator PCB Retention Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to Mating Part Polarized to PCB Shrouded Stackable Temperature Range - Operating Termination Interface: Style Yes 30 30 Black 50 94V-0 No None Phosphor Bronze Gold Tin High Temperature Thermoplastic 2 Vertical Yes Yes Tube 0.100 In 2.54 mm 15 0.375 75 1.875 No No No Yes -40°C to +105°C Surface Mount Search Parts in this Series 71308Series Electrical Current - Maximum per Contact Voltage - Maximum 3A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability 30 Reflow Capable (SMT only) Max. Cycles at Max. Process Temperature Process Temperature max. C 3 260 Material Info Old Part Number A-71308-4130N Reference - Drawing Numbers Product Specification Sales Drawing PS-71308, RPS-71308-001 SD-71308-001 This document was generated on 03/31/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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015-91-1302

1. 物料型号： - 型号：0015911302 和 0019911302

2. 器件简介： - 描述：2.54mm (.100") 间距 C-Grid Header，表面贴装，双排，垂直，0.38m (15) 金 (Au) 选择性电镀，带3.30mm (.130") PCB定位。

3. 引脚分配： - 电路（已加载）：30 - 最大电路数：30 - 引脚排列：垂直双排

4. 参数特性： - 颜色 - 树脂：黑色 - 耐久性（最大插拔次数）：50 - 阻燃等级：94V-0 - 锁扣与接插部分：无 - 金属材质：磷青铜 - 接插部分镀层：金 - 终止部分镀层：锡 - 树脂材质：高温热塑性塑料 - 排数：2 - 方向：垂直 - PCB定位：是 - PCB保持：芯片是 - 包装类型：管装 - 接插界面间距（英寸）：0.100 In - 接插界面间距（毫米）：2.54 mm - 接插部分最小镀层（微英寸）：15 - 接插部分最小镀层（微米）：0.375 - 终止部分最小镀层（微英寸）：75 - 终止部分最小镀层（微米）：1.875 - 对接插部分极性：否 - 对PCB极性：否 - 屏蔽：否 - 可堆叠：是 - 工作温度范围：-40°C至+105°C - 终止界面样式：表面贴装

5. 功能详解： - 电流 - 每个接点最大：3A - 电压 - 最大：250V - 焊接过程数据：在最高工艺温度下持续时间（秒）30，无铅工艺能力（仅限SMT）回流能力。

6. 应用信息： - 应用：板对板、线对板

7. 封装信息： - 封装类型：表面贴装

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