015-91-2260

015-91-2260

  • 厂商:

    MOLEX2

  • 封装:

  • 描述:

    015-91-2260 - 2.54mm (.100) Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, 26 Circuits, T...

  • 详情介绍
  • 数据手册
  • 价格&库存
015-91-2260 数据手册
This document was generated on 03/30/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Description: 0015912260 Active 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, 26 Circuits, Tin (Sn) Plating, without PCB Locator Pegs Documents: 3D Model Packaging Specification (PDF) Drawing (PDF) Product Specification PS-71308 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only LR19980 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL General Product Family Series Application Product Name PCB Headers 71308 Board-to-Board, Wire-to-Board C-Grid® Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) Flammability Glow-Wire Compliant Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PCB Locator PCB Retention Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to Mating Part Polarized to PCB Shrouded Stackable Temperature Range - Operating Termination Interface: Style Yes 26 26 Black 25 94V-0 No None Phosphor Bronze Tin Tin High Temperature Thermoplastic 2 Vertical No None Tube 0.100 In 2.54 mm 152.4 3.81 152.4 3.81 No No No Yes -40°C to +105°C Surface Mount Search Parts in this Series 71308Series Electrical Current - Maximum per Contact Voltage - Maximum 3A 250V Solder Process Data Lead-free Process Capability Reflow Capable (SMT only) Process Temperature max. C 260 Material Info Old Part Number 71308-0026N Reference - Drawing Numbers Product Specification Sales Drawing PS-71308, RPS-71308-001 SD-71308-001 This document was generated on 03/30/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
015-91-2260
物料型号: - 型号:0015912260 - 状态:符合欧盟RoHS、中国RoHS、ELV和RoHS指令,REACH SVHC不含SVHC,无卤素,未审核。

器件简介: - 描述:2.54mm(0.100")间距C-Grid® Header,表面贴装,双排。 - 电镀:锡(Sn)电镀,不带PCB定位销。

引脚分配: - 电路(已加载):26 - 电路(最大):26 - 每排引脚数:26

参数特性: - 颜色 - 树脂:黑色 - 耐用性(最大插拔次数):25次 - 阻燃性:94V-0 - 耐热性:不合规 - 锁紧到匹配部件:无 - 金属材质:磷青铜 - 电镀材质 - 配合:锡 - 电镀材质 - 终止:镀锡 - 树脂材质:高温热塑性塑料 - 排数:2 - 方向:垂直 - PCB定位:无 - PCB固定:无 - 包装类型:管装 - 配合界面间距(英寸):0.100 In - 配合界面间距(毫米):2.54 mm - 电镀最小:配合(微英寸):152.4 - 电镀最小:配合(微米):3.81 - 电镀最小:终止(微英寸):152.4 - 电镀最小:终止(微米):3.81 - 极化到匹配部件:无 - 极化到PCB:无 - 带罩:无 - 可堆叠:是

功能详解: - 电流 - 每个接触最大:3A - 电压 - 最大:250V - 焊接过程数据铅免费工艺能力:回流能力(仅限SMT)

应用信息: - 应用:板对板,线对板

封装信息: - 封装:表面贴装 - 操作温度范围:-40°C至+105°C
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