15-80-0061

厂商：
MOLEX2
封装：
描述：
15-80-0061 - 2.54mm (.100) Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shro...

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15-80-0061 数据手册

This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0015800061 Active cgrid__sl_products 2.54mm (.100") Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating Documents: 3D Model Drawing (PDF) Packaging Specification (PDF) Product Specification PS-70567 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only Agency Certification UL E29179 General Product Family Series Application Overview Product Name PCB Headers 70567 Wire-to-Board cgrid__sl_products C-Grid® Physical Breakaway Circuits (Loaded) Circuits Detail Color - Resin First Mate / Last Break Flammability Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to Mating Part Polarized to PCB Shrouded No 6 6 Black No 94V-0 No No None Yes Brass, Phosphor Bronze Tin Tin High Temperature Thermoplastic 2 Vertical 0.130 In 3.30 mm No Yes 0.093 In 2.40 mm Tube 0.100 In 2.54 mm 0.100 In 2.54 mm 150 3.75 150 3.75 Yes No Fully EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Search Parts in this Series 70567Series Mates With 70450 Crimp Housing Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No No -55°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 2.5A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 SMC & Wave Capable (TH only) 1 245 Material Info Old Part Number 70567-0001 Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-70873-0018 PS-70567 SDA-70567-**** This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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15-80-0061

1. 物料型号： - 型号：0015800061 - 状态：Active（活跃） - 描述：2.54mm (.100") 间距 C-Grid Header, 通孔无定位销，[带护罩，高温，6电路，锡（Sn）镀层]

2. 器件简介： - 产品系列：70567 - 应用：线对板（Wire-to-Board） - 产品名称：C-GridR - 物理特性：无断路（Breakaway）功能，6个电路，黑色树脂，94V-0阻燃等级，无极性导向

3. 引脚分配： - 引脚数量：6个电路 - 引脚材料：铜合金 - 金属镀层：锡 - 端子镀层：锡，最小镀层厚度为150微英寸（3.75微米）

4. 参数特性： - 行数：2 - 引脚间距：2.54mm - PCB厚度推荐：0.093英寸（2.40mm） - 包装类型：管装 - 极化：与配合件极化，但未与PCB极化

5. 功能详解： - 配合件：不提供导向 - 锁紧：无锁紧到配合件 - 护罩：完全护罩 - PCB定位：无 - PCB保持：是

6. 应用信息： - 与70450型号的压接外壳配合使用 - 不支持堆叠 - 不支持表面贴装兼容（SMC） - 工作温度范围：-55°C至+105°C - 电气参数：每个接触点最大电流2.5A，最大电压250V

7. 封装信息： - 封装类型：通孔 - 焊接过程数据：最大过程温度245°C，无铅焊接能力（仅限通孔）

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